Abstract: Methods and systems for performing sample lift-out and protective cap placement for highly reactive materials within charged particle microscopy systems are disclosed herein. Methods include preparing a nesting void in a support structure, translating at least a portion of a sample into the nesting void, and milling material from a region of the support structure that defines the nesting void. The material from the region of the support structure is milled such that at least some of the removed material redeposits to form an attachment bond between the sample and a remaining portion of the support structure. In various embodiments, the sample can then be investigated using one or more of serial sectioning tomography on the sample, enhanced insertable backscatter detector (CBS) analysis on the sample, and electron backscatter diffraction (EBSD) analysis on the sample.

Abstract: Methods and systems for imaging a sample with a charged particle microscope comprises after scanning a region of interest (ROI) of a sample with an electron beam and acquiring X-rays emitted from the sample, scanning the ROI with an ion beam and acquiring ion-induced photons emitted from the sample. A spatial distribution of multiple elements in the sample may be determined based on both the acquired X-rays and the acquired ion-induced photons.

Abstract: The invention relates to a high resolution full material Fresnel Zone Plate array comprising a plurality of full material Fresnel Zone Plates on a common carrier, a method for producing a full material Fresnel Zone Plate precursor array by providing a common carrier comprising a plurality of micro-pillars and deposition of alternating layers of at least two different materials onto at least some of the micro-pillars and an apparatus for producing high resolution full material Fresnel Zone Plate (FZP) arrays. The apparatus for producing a full material Fresnel Zone Plate arrays, comprises a first device for providing a plurality of micro-pillars in a common carrier, a deposition device which applies alternating layers of at least two different materials onto at least some of the micro-pillars arranged on the common carrier and a slicing device which slices a full material Fresnel Zone Plate out of a pillar.