Patents by Inventor Chenggong Jia

Chenggong Jia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of preparing a composition in blister packages
    Patent number: 8646246
    Abstract: The present invention provides methods for preparing compositions in blister packages using complex aluminum substrate materials, wherein said complex aluminum substrate materials comprise an intermediate aluminum layer, and first and second outer layers, wherein the material of the first outer layer differs from that of the second outer layer, and the flexural rigidity of the first outer layer differs from that of the second outer layer by 0-30%.
    Type: Grant
    Filed: June 19, 2008
    Date of Patent: February 11, 2014
    Assignee: Quantum Hi-Tech (Beijing) Research Institute
    Inventors: Hewei Li, Congwei Wang, Bo Du, Chenggong Jia, Shirong Jiao, Chun Ji
  • METHOD OF PREPARING A COMPOSITION IN BLISTER PACKAGES
    Publication number: 20080305289
    Abstract: The present invention provides methods for preparing compositions in blister packages using complex aluminum substrate materials, wherein said complex aluminum substrate materials comprise an intermediate aluminum layer, and first and second outer layers, wherein the material of the first outer layer differs from that of the second outer layer, and the flexural rigidity of the first outer layer differs from that of the second outer layer by 0-30%.
    Type: Application
    Filed: June 19, 2008
    Publication date: December 11, 2008
    Inventors: Hewei Li, Congwei Wang, Bo Du, Chenggong Jia, Shirong Jiao, Chun Ji