Abstract: Methods, apparatus, systems, and articles of manufacture to reduce impedance discontinuities and crosstalk in integrated circuit packages are disclosed. A disclosed apparatus includes: a package substrate, and a ball grid array on a first surface of the package substrate. The ball grid array includes a first ball and a second ball adjacent the first ball. The ball grid array is to enable the package substrate to be electrically coupled to a circuit board. The apparatus further includes a metal interconnect within the package substrate. The metal interconnect is electrically coupled to the first ball. The metal interconnect includes an inductive loop that extends toward the second ball.

Abstract: Systems, apparatus, articles of manufacture, and methods to compensate for impedance and reduce crosstalk in integrated circuit packages are disclosed. An example apparatus includes a metal interconnect within a substrate of an integrated circuit package. The metal interconnect includes a contact pad in a first metal layer of the substrate and a via pad in a second metal layer of the substrate. The metal interconnect defines a conductive path for an electric signal that is to pass through both the contact pad and the via pad. The example apparatus further includes a conductive material having a length defining a segment of the conductive path between the contact pad and the via pad. At least a portion of the length of the conductive material extends along a course that corresponds and is adjacent to a portion of a perimeter of the contact pad.

Abstract: An apparatus and method for reducing differential cross-talk in a CPU pin arrangement of a server motherboard are described. The CPU pin arrangement has pin patterns that are arranged in a square, separated from each other, and are mirrored around an axis between the pin patterns. Each pin pattern has pins that each include a main body with a lateral asymmetric cross-section, a first connector extending from one end of the main body and coupled to the motherboard through solder, and a second connector extending from an opposing end of the main body and coupled to the CPU through a pressure contact.

Abstract: Methods, apparatus, systems, and articles of manufacture to reduce impedance discontinuities and crosstalk in integrated circuit packages are disclosed. A disclosed apparatus includes: a package substrate, and a ball grid array on a first surface of the package substrate. The ball grid array includes a first ball and a second ball adjacent the first ball. The ball grid array is to enable the package substrate to be electrically coupled to a circuit board. The apparatus further includes a metal interconnect within the package substrate. The metal interconnect is electrically coupled to the first ball. The metal interconnect includes an inductive loop that extends toward the second ball.