Patents by Inventor Chenghong GAN

Chenghong GAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11081749
    Abstract: The present application relates to the field of batteries, and discloses a battery and a manufacturing method for the same. The battery comprises a package bag, an electrode, and a circuit board assembly. The electrode is located in the package bag, and the electrode is further provided with a terminal. The terminal has one end connected to the electrode and located inside the package bag, and the other end located outside the package bag. The other end of the terminal is electrically connected to the circuit board assembly to form a protection portion, and the protection portion is covered by a protection layer. In the foregoing embodiment, the protection layer can cover structures requiring insulation protection, such as the circuit board assembly and the terminal, and the protection layer can be tightly adhered to the surfaces of the structures, thereby improving the reliability.
    Type: Grant
    Filed: January 21, 2019
    Date of Patent: August 3, 2021
    Assignee: DONGGUAN NVT TECHNOLOGY CO., LTD.
    Inventors: Liming Wang, Chenghong Gan, Baiqing Zhang, Guanghui Chen, Wei Tang
  • Publication number: 20190229305
    Abstract: The present application relates to the field of batteries, and discloses a battery and a manufacturing method for the same. The battery comprises a package bag, an electrode, and a circuit board assembly. The electrode is located in the package bag, and the electrode is further provided with a terminal. The terminal has one end connected to the electrode and located inside the package bag, and the other end located outside the package bag. The other end of the terminal is electrically connected to the circuit board assembly to form a protection portion, and the protection portion is covered by a protection layer. In the foregoing embodiment, the protection layer can cover structures requiring insulation protection, such as the circuit board assembly and the terminal, and the protection layer can be tightly adhered to the surfaces of the structures, thereby improving the reliability.
    Type: Application
    Filed: January 21, 2019
    Publication date: July 25, 2019
    Inventors: Liming WANG, Chenghong GAN, Baiqing ZHANG, Guanghui CHEN, Wei TANG