Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip structure. The method may be performed by forming a plurality of interconnect layers within a first interconnect structure disposed over an upper surface of a first semiconductor substrate. An edge trimming process is performed to remove parts of the first interconnect structure and the first semiconductor substrate along a perimeter of the first semiconductor substrate. The edge trimming process results in the first semiconductor substrate having a recessed surface coupled to the upper surface by way of an interior sidewall disposed directly over the first semiconductor substrate. A dielectric capping structure is formed onto a sidewall of the first interconnect structure after performing the edge trimming process.

Abstract: A self-healing polymer includes metal ions and a polymer network including polymer chains cross-linked through coordination bonds with the metal ions. Each polymer chain includes ligands within a backbone of the polymer chain, and the ligands include metal ion coordination sites.

Abstract: A thermal control apparatus is provided. The thermal control apparatus includes a controller and a thermoelectric cooling module. The thermoelectric cooling module includes: a thermal sensor for measuring a first current temperature of a first location of the thermoelectric cooling module; and a thermoelectric cooling device for adjusting the first current temperature according to a control signal from the controller. The controller calculates a predicted temperature of a second location of the thermoelectric cooling module according to the measured first current temperature and a thermal model between the first location and the second location. The controller further automatically adjusts a first target temperature of the first location according to the predicted temperature and an expected temperature of the second location, and controls the thermoelectric cooling device to automatically adjust the first current temperature of the first location to reach the first target temperature.

Abstract: A self-healing polymer includes metal ions and a polymer network including polymer chains cross-linked through coordination bonds with the metal ions. Each polymer chain includes ligands within a backbone of the polymer chain, and the ligands include metal ion coordination sites.