Abstract: A method and system that are directed to determining compatibility of integrated circuit (IC) packages with X-ray inspection. The method comprises determining one or more packaging specifications and one or more imaging specifications, generating an X-ray discernability model based on one or more X-ray image samples and one or more X-ray simulations, determining, using the X-ray discernability model, one or more threshold values of one or more DFI parameters that are associated with a target IC package type, assigning one or more compatibility scores to the one or more DFI parameters based on a comparison between one or more test DFI parameter values that are associated with a test IC package design and the one or more threshold values, and generating an X-ray compatibility metric based on the one or more compatibility scores.

Abstract: Various embodiments of the present disclosure provide a framework for obfuscation of a printed circuit board (PCB). In one example, an embodiment provides for generating a plurality of connections interconnecting a plurality of components of the PCB using additive manufacturing, permuting, using a micro electro-mechanical systems (MEMS) device, a first set of connections interconnecting a first component with a second component in the PCB, integrating the MEMS device into the PCB such that the MEMS device covers a second set of connections from an x-ray probe, probing the PCB using x-ray simulation, and iteratively adjusting the permutation of the first set of connections and the integration of the MEMS device using a result of the x-ray simulation to reduce the detectability of the first and second connections based on the result of the x-ray simulation.

Abstract: Various embodiments are directed to analysis of three-dimensional structure of an integrated circuit (IC) sample in order to enable sample preparation for physical inspection and hardware assurance. Specifically, various embodiments provide a structural analysis framework that enables high-quality sample preparation, including careful material removal of IC packaging material without damaging internal components of the IC sample. In various embodiments, the structural analysis framework involves receiving a digital twin model of an IC sample, and the digital twin model may be generated using X-ray CT imaging. Then, various regions of interest of the IC sample may be identified and selected via the digital twin model. The structural analysis framework further includes performing THz-TDS to collect ultra-high-resolution thickness information at the regions of interest. Both the digital twin model and the ultra-high-resolution thickness information may then be used to guide material removal of the IC sample.

Abstract: Various embodiments of the present disclosure provide systems and methods for classifying and evaluating an electronic object based at least in part on terahertz (THz) data. THz data may comprise time-domain THz data collected via THz time domain spectroscopy of the electronic object. THz data may further comprise frequency-domain THz data, which may be generated based at least in part on the time-domain THz data. A unique THz fingerprint may be generated for the electronic object based at least in part on the THz data. This unique THz fingerprint may be compared to an earlier generated THz fingerprint of the same electronic object to evaluate reliability and consistency. The unique THz fingerprint may also be compared to THz fingerprints or THz data of other electronic objects of the same object type, class, design, and/or the like, to validate the electronic object (e.g., determine if the electronic object is counterfeit).