Abstract: Embodiments of the disclosure provide a server device. A chassis of the server device includes an accommodating cavity and a first opening. The accommodating cavity includes a first region adjacent to a front side of the chassis and a second region adjacent to a rear side of the chassis. The first opening is disposed at a top of the chassis and corresponds to the first region. A carrier board is disposed in the first region. A plurality of expansion cards are detachably coupled to a side of the carrier board facing the first opening. A cover is disposed at the first opening and rotatably coupled to the chassis and switchable between closed and open positions. The cover covers the first opening when in the closed position. When the cover is in the open position, the first opening is exposed for an operator to operate at the first opening.

Abstract: A system and a method for cooling a data center, and a computer room are provided, where the system has a first channel and a second channel and the system includes: a stacking structure located between the first channel and the second channel, the stacking structure includes at least one electronic device and at least one surface cooler stacked with each other, each electronic device has a first air inlet and a first air outlet, each surface cooler has a second air inlet and a second air outlet, the first air outlet and the second air inlet are both oriented towards one side of the first channel, and the first air inlet and the second air outlet are both oriented towards one side of the second channel.

Abstract: The embodiments of the disclosure provide an immersion liquid cooling device and a liquid cooling system. The liquid cooling device includes a cabinet comprising a first cavity and a second cavity integrated on a side wall of the first cavity; and a heat exchange module adapted to be inserted into the second cavity via an opening on the second cavity, and comprising a heat exchanger, a coolant driving device and a guiding assembly, the heat exchanger being configured to cool the first coolant with the second coolant, the coolant driving device being configured to drive the first coolant to circulate between the second cavity and the first cavity, and the guiding assembly comprising a liquid flow channel configured to guide the first coolant from the coolant driving device to the heat exchanger.

Abstract: A system and a method for cooling a data center, and a computer room are provided, where the system has a first channel and a second channel and the system includes: a stacking structure located between the first channel and the second channel, the stacking structure includes at least one electronic device and at least one surface cooler stacked with each other, each electronic device has a first air inlet and a first air outlet, each surface cooler has a second air inlet and a second air outlet, the first air outlet and the second air inlet are both oriented towards one side of the first channel, and the first air inlet and the second air outlet are both oriented towards one side of the second channel.

Abstract: The embodiments of the disclosure provide an immersion liquid cooling device and a liquid cooling system. The liquid cooling device includes a cabinet comprising a first cavity and a second cavity integrated on a side wall of the first cavity; and a heat exchange module adapted to be inserted into the second cavity via an opening on the second cavity, and comprising a heat exchanger, a coolant driving device and a guiding assembly, the heat exchanger being configured to cool the first coolant with the second coolant, the coolant driving device being configured to drive the first coolant to circulate between the second cavity and the first cavity, and the guiding assembly comprising a liquid flow channel configured to guide the first coolant from the coolant driving device to the heat exchanger.