Abstract: A semiconductor package includes a redistribution structure, a supporting layer, a semiconductor device, and a transition waveguide structure. The redistribution structure includes a plurality of connectors. The supporting layer is formed over the redistribution structure and disposed beside and between the plurality of connectors. The semiconductor device is disposed on the supporting layer and bonded to the plurality of connectors, wherein the semiconductor device includes a device waveguide. The transition waveguide structure is disposed on the supporting layer adjacent to the semiconductor device, wherein the transition waveguide structure is optically coupled to the device waveguide.

Abstract: A semiconductor device includes a substrate, at least one semiconductor fin, and at least one epitaxy structure. The semiconductor fin is present on the substrate. The semiconductor fin has at least one recess thereon. The epitaxy structure is present in the recess of the semiconductor fin. The epitaxy structure includes a topmost portion, a first portion and a second portion arranged along a direction from the semiconductor fin to the substrate. The first portion has a germanium atomic percentage higher than a germanium atomic percentage of the topmost portion and a germanium atomic percentage of the second portion.

Abstract: A package includes an electronic die, a photonic die underlying and electronically communicating with the electronic die, a lens disposed on the electronic die, and a prism structure disposed on the lens and optically coupled to the photonic die. The prism structure includes first and second polymer layers, the first polymer layer includes a first curved surface concaving toward the photonic die, the second polymer layer embedded in the first polymer layer includes a second curved surface substantially conforming to the first curved surface, and an outer sidewall of the second polymer layer substantially aligned with an outer sidewall of the first polymer layer.

Abstract: An integrated circuit package and a method of forming the same are provided. The integrated circuit package includes a photonic integrated circuit die. The photonic integrated circuit die includes an optical coupler. The integrated circuit package further includes an encapsulant encapsulating the photonic integrated circuit die, a first redistribution structure over the photonic integrated circuit die and the encapsulant, and an opening extending through the first redistribution structure and exposing the optical coupler.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: A device, apparatus, and method for semiconductor transfer are provided. A transfer substrate is controlled to be moved to be above the target substrate. An infrared emitting portion emits infrared signals to position a semiconductor on a target substrate. After a second magnetic portion picks up the semiconductor from the target substrate, a controller outputs a first control current to a first electromagnetic portion to cause the first electromagnetic portion to generate an electromagnetic force, to control the second magnetic portion to adjust a position of the picked-up semiconductor relative to the welding position on the target substrate, where adjusting the position of the picked up semiconductor includes horizontal adjustment.

Abstract: A sub-pixel array and a display are provided. The sub-pixel structure includes a driving module, a first selection module, a second selection module, a switch module, a first light-emitting element, and a second light-emitting element. The first selection module is configured to control conduction between the driving module and an anode of the first light-emitting element or conduction between the driving module and an anode of the second light-emitting element through a first control signal. The second selection module is configured to control grounding of a cathode of the first light-emitting element or grounding of a cathode of the second light-emitting element through a second control signal.

Abstract: A method for light-emitting element transferring includes: providing multiple light-emitting elements, each light-emitting element includes a first light-emitting unit, a substrate, and a second light-emitting unit sequentially stacked, the first light-emitting unit includes a first epitaxial structure and a first electrode group stacked on a side of the substrate, the second light-emitting unit includes a second epitaxial structure and a second electrode group stacked on another side of the substrate, and the first light-emitting unit and the second light-emitting unit have different light-emitting colors; providing a display backplane, multiple grooves are defined on the display backplane, a first pad group and a second pad group are provided on side walls of each groove; and embedding the multiple light-emitting elements into the multiple grooves in one-to-one correspondence, where the first electrode group is bonded with the first pad group, and the second electrode group is bonded with the second pad gro

Abstract: Disclosed is a display backplane, comprising a backplane, micro light-emitting diodes, a plug-in circuit board, and signal lines; a light-emitting area arranged on front surface of the backplane; a first trace area and a second trace area arranged on both opposite sides of the light-emitting area, and a third trace area arranged on one side of the light-emitting area and between the opposite sides; the third trace area is arranged between the first trace area and the second trace area; first signal lines are routed from the first trace area and the second trace area and are electrically coupled to the plug-in circuit board through the third trace area, second signal lines routed along the back surface from the first trace area and the second trace area are arranged on the third trace area in a winding manner. A display device and a tiled display device are also disclosed.

Abstract: The present disclosure relates to a display panel and a method for manufacturing the same. The method includes the following. A first adhesive layer and a second adhesive layer are disposed sequentially on a surface of a driving substrate, and the first adhesive layer includes conductive particles. Multiple light emitting units arranged in an array are adhered to one side of the second adhesive layer away from the driving substrate. The second adhesive layer is semi-cured. The first adhesive layer and the second adhesive layer are cured, and the multiple light emitting units are electrically connected with the driving substrate through the conductive particles.

Abstract: A sub-pixel array and a display are provided. The sub-pixel structure includes a driving module, a first selection module, a second selection module, a switch module, a first light-emitting element, and a second light-emitting element. The first selection module is configured to control conduction between the driving module and an anode of the first light-emitting element or conduction between the driving module and an anode of the second light-emitting element through a first control signal. The second selection module is configured to control grounding of a cathode of the first light-emitting element or grounding of a cathode of the second light-emitting element through a second control signal.

Abstract: A device, apparatus, and method for semiconductor transfer are provided. A transfer substrate is controlled to be moved to be above the target substrate. An infrared emitting portion emits infrared signals to position a semiconductor on a target substrate. After a second magnetic portion picks up the semiconductor from the target substrate, a controller outputs a first control current to a first electromagnetic portion to cause the first electromagnetic portion to generate an electromagnetic force, to control the second magnetic portion to adjust a position of the picked-up semiconductor relative to the welding position on the target substrate, where adjusting the position of the picked up semiconductor includes horizontal adjustment.

Abstract: A pixel array comprise a green pixel comprising a first green optical filter and a first clear filter, a red pixel comprising a red optical filter and a first special filter, a blue pixel comprising a blue optical filter and a second special filter, and an IR pixel comprising an IR optical filter and one of a second green optical filter and a second clear filter, where the first special filter suppresses a transmission of IR at a stopband centered at 850 nm at a first IR minimum transmission, and the second special filter suppresses a transmission of IR at the stopband centered at 850 nm at a second IR minimum transmission, and where the first minimum IR transmission is different from the second minimum IR transmission.

Abstract: A pixel array comprise a green pixel comprising a first green optical filter and a first clear filter, a red pixel comprising a red optical filter and a first special filter, a blue pixel comprising a blue optical filter and a second special filter, and an IR pixel comprising an IR optical filter and one of a second green optical filter and a second clear filter, where the first special filter suppresses a transmission of IR at a stopband centered at 850 nm at a first IR minimum transmission, and the second special filter suppresses a transmission of IR at the stopband centered at 850 nm at a second IR minimum transmission, and where the first minimum IR transmission is different from the second minimum IR transmission.

Abstract: An optical film and an autostereoscopic 3D display using the same are provided. The optical film includes a concave lens layer and a birefringence layer. The concave lens layer has plurality of concaves and a presumed refractive index. The birefringence layer overlaps the concave lens layer and includes a plurality of liquid crystal units filled and cured in the concaves. The birefringence layer has a short axis refractive index. The presumed refractive index is between 100.1%-102.8% of the short axis refractive index. The autostereoscopic 3D display includes the optical film, a liquid crystal switch module, and a display panel module. The liquid crystal switch module is disposed on one side of the optical film. The display panel module is disposed on one side of the liquid crystal switch module opposite to the optical film and has a display surface facing the liquid crystal switch module.

Abstract: An optical film and an autostereoscopic 3D display using the same are provided. The optical film includes a concave lens layer and a birefringence layer. The concave lens layer has plurality of concaves and a presumed refractive index. The birefringence layer overlaps the concave lens layer and includes a plurality of liquid crystal units filled and cured in the concaves. The birefringence layer has a short axis refractive index. The presumed refractive index is between 100.1%-102.8% of the short axis refractive index. The autostereoscopic 3D display includes the optical film, a liquid crystal switch module, and a display panel module. The liquid crystal switch module is disposed on one side of the optical film. The display panel module is disposed on one side of the liquid crystal switch module opposite to the optical film and has a display surface facing the liquid crystal switch module.

Abstract: The invention relates to a power grid visualization system and a power grid visualization method based on a three-dimensional geographic information system (GIS) technology. Models to be loaded are divided into different model loading subtasks according to the difference of object types included in a scene to be loaded, and model files are called in parallel from a plurality of subtasks in a multi-thread mode; and meanwhile, on the basis that loading tasks are divided into a plurality of model loading subtasks according to the loaded object types, model files of objects of each type are only read once, moreover, reuse of the model files is not limited to a client loading task, different clients can reuse the read model files, and the characteristics of limited type and relatively consistent specification of power equipment are fully considered, so that rereading of the model files of the same type is avoided.

Abstract: The invention discloses a two-step process for recovery of thuringiensin, comprising adsorbing the thuringiensin from fermentation broth by calcium silicate, and dissociating the thuringiensin by dibasic sodium phosphate. The resulting thuringiensin can be further purified by using semi-preparative HPLC and electrodialysis to remove the excess salts from the recovered thuringiensin solution.

Abstract: Quantitative analysis for thuringiensin by capillary electrophoresis (“CE’) was demonstrated. CE is a suitable separation technique for thuringiensin because of its high resolution, great efficiency, rapid analysis and small consumption of sample. Tryptophan, an aromatic amino acid sharing a similar UV absorptive spectrum as thuringiensin, was used as an internal standard to avoid some inaccurate results caused by the questionable stability of purified thuringiensin. A mixed amount of tryptophan was mixed with varied amount of newly made thuringiensin standards for CE analysis. The electropherograms showed that the peak of tryptophan appeared around 8 minutes, which is 6 minutes earlier than the peak of thuringiensin. The peak area ratio between thuringiensin and tryptophan is proportional to the amount of thuringiensin in the mixture. The linear regression has been established to assess the peak area ratio that can be used to quantify the concentration of thuringiensin.

Abstract: Protein mixtures are separated by capillary electrophoresis in a buffer containing one or more amino acids in an amount sufficient to prevent or substantially reduce the degree of protein binding to the wall of the capillary.