Patents by Inventor Cheng-Peng Yeh

Cheng-Peng Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate carrier unit for a film deposition apparatus
    Patent number: 9771649
    Abstract: A substrate carrier unit includes a substrate carrier and a phase transition material. The substrate carrier defines an isolated space therein. The phase transition material is filled into the isolated space of the substrate carrier and has a melting point ranging between 18° C. and 95° C. The phase transition material is capable of absorbing thermal energy from the substrate carrier as latent heat to change the phase from solid to liquid.
    Type: Grant
    Filed: May 5, 2015
    Date of Patent: September 26, 2017
    Assignee: Linco Technology Co., Ltd.
    Inventors: Chung-Yu Yeh, Huei-Chia Su, Cheng-Peng Yeh, Tsung-Wei Chang, Yi-Yuan Huang, Wan-Yu Huang, Mu-Sen Lu
  • Film deposition system having a substrate carrier and a cooling device
    Patent number: 9611542
    Abstract: A film deposition system includes a substrate carrier, a film deposition device, a transport device and a cooling device. The substrate carrier includes a carrier body that defines an isolated space therein, and a phase transition material that is filled into the isolated space and that has a melting point ranging between 18° C. and 95° C. The phase transition material is capable of absorbing thermal energy from the carrier body as latent heat to change the phase of the phase transition material from solid to liquid. The cooling device is configured to absorb thermal energy from the substrate carrier so as to change the phase of the phase transition material from liquid to solid.
    Type: Grant
    Filed: May 1, 2015
    Date of Patent: April 4, 2017
    Assignee: Linco Technology Co., Ltd.
    Inventors: Cheng-Peng Yeh, Huei-Chia Su, Chung-Yu Yeh, Tsung-Wei Chang, Yi-Yuan Huang, Wan-Yu Huang, Mu-Sen Lu
  • Substrate Carrier Unit for a Film Deposition Apparatus
    Publication number: 20160326637
    Abstract: A substrate carrier unit includes a substrate carrier and a phase transition material. The substrate carrier defines an isolated space therein. The phase transition material is filled into the isolated space of the substrate carrier and has a melting point ranging between 18° C. and 95° C. The phase transition material is capable of absorbing thermal energy from the substrate carrier as latent heat to change the phase from solid to liquid.
    Type: Application
    Filed: May 5, 2015
    Publication date: November 10, 2016
    Inventors: Chung-Yu Yeh, Huei-Chia Su, Cheng-Peng Yeh, Tsung-Wei Chang, Yi-Yuan Huang, Wan-Yu Huang, Mu-Sen Lu
  • Film Deposition System Having a Substrate Carrier and a Cooling Device
    Publication number: 20160318061
    Abstract: A film deposition system includes a substrate carrier, a film deposition device, a transport device and a cooling device. The substrate carrier includes a carrier body that defines an isolated space therein, and a phase transition material that is filled into the isolated space and that has a melting point ranging between 18° C. and 95° C. The phase transition material is capable of absorbing thermal energy from the carrier body as latent heat to change the phase of the phase transition material from solid to liquid. The cooling device is configured to absorb thermal energy from the substrate carrier so as to change the phase of the phase transition material from liquid to solid.
    Type: Application
    Filed: May 1, 2015
    Publication date: November 3, 2016
    Inventors: Cheng-Peng Yeh, Huei-Chia Su, Chung-Yu Yeh, Tsung-Wei Chang, Yi-Yuan Huang, Wan-Yu Huang, Mu-Sen Lu