Abstract: A fast charging mobile battery pack is usable to accept approximately 12V DC or between approximately 100V-240V AC and manage the voltage and current levels to rapidly charge a battery of a portable electronic device and/or one or more battery cells within the fast charging mobile battery pack. The fast charging portable battery pack may additionally include multiple output ports to provide different voltage and/or current levels to desired portable electronic devices.

Abstract: A system and method for forming high resolution electronic circuits on a substrate is provided. The system (10) includes a substrate (12), a source of radiant energy (34) and a focusing means (16). The source of radiant energy (34) directs an energy beam (14) through the focusing means (16) in order to direct a focused energy beam (18) onto the surface of the substrate (12). The focused energy beam (18) creates a plurality of channels (20) in the surface of the substrate (12). A paste applicator (22) fills the channels (20) with an electrically conductive paste (24). Once heated and cured, the electrically conductive paste (24) makes up the electrically conductive pathways of the electronic circuit.

Abstract: A method for manufacturing a modular electrical circuit includes the steps of pre-manufacturing a plurality of components having fine features such as resistors, capacitors, inductances, and conductors formed on a dielectric substrate. The pre-manufactured components are laminated each to the other in a predetermined order. Each pre-manufactured component includes one or more electrical elements of the same type coupled each to the other by conducting lines. Each dielectric substrate includes through vias filled with the conductive material which serve for cross-coupling of the elements of neighboring components. Position of the passive elements, as well as conductive lines and through vias, are pre-designed to allow precise coordination between the elements of different components in the multi-layered modular electrical circuit.

Abstract: A system and method for forming high resolution electronic circuits on a substrate is provided. The system (10) includes a substrate (12), a source of radiant energy (34) and a focusing means (16). The source of radiant energy (34) directs an energy beam (14) through the focusing means (16) in order to direct a focused energy beam (18) onto the surface of the substrate (12). The focused energy beam (18) creates a plurality of channels (20) in the surface of the substrate (12). A paste applicator (22) fills the channels (20) with an electrically conductive paste (24). Once heated and cured, the electrically conductive paste (24) makes up the electrically conductive pathways of the electronic circuit.

Abstract: A method of forming high resolution electronic circuits (10) on a substrate (12) is provided. The method includes the steps of laminating a dielectric layer (14) on a substrate (12), laser drilling channels (16 and 18) in the dielectric film (14) and the substrate (12), and filling channels (16 and 18) with a filler material (20). Further, a release layer (22) is applied to dielectric film layer (14) and filler material (20), the release layer (22) having an adhesive thereon. Release layer (22) is peeled or otherwise removed from substrate (12), leaving filler material (20) formed and shaped on substrate (12), thus producing a high resolution electronic circuit on substrate (12).

Abstract: A method for manufacturing a modular electrical circuit includes the steps of pre-manufacturing a plurality of components having fine features such as resistors, capacitors, inductances, and conductors formed on a dielectric substrate. The pre-manufactured components are laminated each to the other in a predetermined order. Each pre-manufactured component includes one or more electrical elements of the same type coupled each to the other by conducting lines. Each dielectric substrate includes through vias filled with the conductive material which serve for cross-coupling of the elements of neighboring components. Position of the passive elements, as well as conductive lines and through vias, are pre-designed to allow precise coordination between the elements of different components in the multi-layered modular electrical circuit.

Abstract: A method of forming high resolution electronic circuits (10) on a substrate (12) is provided. The method includes the steps of laminating a dielectric layer (14) on a substrate (12), laser drilling channels (16 and 18) in the dielectric film (14) and the substrate (12), and filling channels (16 and 18) with a filler material (20). Further, a release layer (22) is applied to dielectric film layer (14) and filler material (20), the release layer (22) having an adhesive thereon. Release layer (22) is peeled or otherwise removed from substrate (12), leaving filler material (20) formed and shaped on substrate (12), thus producing a high resolution electronic circuit on substrate (12).

Abstract: A method for manufacturing a modular electrical circuit includes the steps of pre-manufacturing a plurality of components having fine features such as resistors, capacitors, inductances, and conductors formed on a dielectric substrate. The pre-manufactured components are laminated each to the other in a predetermined order. Each pre-manufactured component includes one or more electrical elements of the same type coupled each to the other by conducting lines. Each dielectric substrate includes through vias filled with the conductive material which serve for cross-coupling of the elements of neighboring components. Position of the passive elements, as well as conductive lines and through vias, are pre-designed to allow precise coordination between the elements of different components in the multi-layered modular electrical circuit.

Abstract: A method for manufacturing a modular electrical circuit includes the steps of pre-manufacturing a plurality of components having fine features such as resistors, capacitors, inductances, and conductors formed on a dielectric substrate. The pre-manufactured components are laminated each to the other in a predetermined order. Each pre-manufactured component includes one or more electrical elements of the same type coupled each to the other by conducting lines. Each dielectric substrate includes through vias filled with the conductive material which serve for cross-coupling of the elements of neighboring components. Position of the passive elements, as well as conductive lines and through vias, are pre-designed to allow precise coordination between the elements of different components in the multi-layered modular electrical circuit.