Patents by Inventor Chengquan ZHOU

Chengquan ZHOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Non-contact transporting apparatus
    Patent number: 11345553
    Abstract: A non-contact transporting apparatus (10) includes: a negative pressure assembly (100) configured to generate a negative pressure airflow within the non-contact transporting apparatus; and an ultrasonic assembly (200) connected to the negative pressure assembly (100). The ultrasonic assembly (200) includes: an ultrasonic transducer (210) configured to convert a high-frequency ultrasonic electrical signal into a high-frequency mechanical vibration, one end of the ultrasonic transducer (210) is connected to the negative pressure assembly (100); an ultrasonic horn (230) configured to amplify the high-frequency mechanical vibration, one end of the ultrasonic horn (230) is connected to one end of the ultrasonic transducer (210) away from the negative pressure assembly (100); and an ultrasonic chuck (250) configured to amplify and convert the high-frequency mechanical vibration, the ultrasonic chuck (250) is connected to one end of the ultrasonic horn (230) away from the ultrasonic transducer (210).
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: May 31, 2022
    Assignee: HAN'S LASER TECHNOLOGY INDUSTRY GROUP CO., LTD.
    Inventors: Song Lu, Jin Wang, Feng Cao, Chengquan Zhou, Zhengfeng Liu, Zekai Xie, Jiaming You, Bing Ding, Yunfeng Gao
  • NON-CONTACT TRANSPORTING APPARATUS
    Publication number: 20210221627
    Abstract: A non-contact transporting apparatus (10) includes: a negative pressure assembly (100) configured to generate a negative pressure airflow within the non-contact transporting apparatus; and an ultrasonic assembly (200) connected to the negative pressure assembly (100). The ultrasonic assembly (200) includes: an ultrasonic transducer (210) configured to convert a high-frequency ultrasonic electrical signal into a high-frequency mechanical vibration, one end of the ultrasonic transducer (210) is connected to the negative pressure assembly (100); an ultrasonic horn (230) configured to amplify the high-frequency mechanical vibration, one end of the ultrasonic horn (230) is connected to one end of the ultrasonic transducer (210) away from the negative pressure assembly (100); and an ultrasonic chuck (250) configured to amplify and convert the high-frequency mechanical vibration, the ultrasonic chuck (250) is connected to one end of the ultrasonic horn (230) away from the ultrasonic transducer (210).
    Type: Application
    Filed: August 7, 2017
    Publication date: July 22, 2021
    Applicant: HAN'S LASER TECHNOLOGY INDUSTRY GROUP CO., LTD.
    Inventors: Song LU, Jin WANG, Feng CAO, Chengquan ZHOU, Zhengfeng LIU, Zekai XIE, Jiaming YOU, Bing DING, Yunfeng GAO