Patents by Inventor Chengsheng Ku

Chengsheng Ku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Molded package
    Patent number: 10879084
    Abstract: A package is manufactured by placing a substrate, for example a lead frame, in a mold with a protection flange extending into a notch in the substrate around a contact surface. The protection flange impedes molding compound from reaching the contact surface reducing the need for a deflash step.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: December 29, 2020
    Inventors: Yun Liu, Yuhua Lee, Chengsheng Ku, Chingming Liu, Mengming Zhu, Dusan Golubovic, Yujie Huang
  • MOLDED PACKAGE
    Publication number: 20200227282
    Abstract: A package is manufactured by placing a substrate, for example a lead frame, in a mold with a protection flange extending into a notch in the substrate around a contact surface. The protection flange impedes molding compound from reaching the contact surface reducing the need for a deflash step.
    Type: Application
    Filed: March 24, 2020
    Publication date: July 16, 2020
    Inventors: Yun Liu, Yuhua Lee, Chengsheng Ku, Chingming Liu, Mengming Zhu, Dusan Golubovic, Yujie Huang
  • Molded package and method of manufacture
    Patent number: 10629456
    Abstract: A package is manufactured by placing a substrate (10), for example a lead frame, in a mold (30) with a protection flange (38) extending into a notch (14) in the substrate (10) around a contact surface (12). The protection flange (38) impedes molding compound from reaching the contact surface reducing the need for a deflash step.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: April 21, 2020
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Yun Liu, Yuhua Lee, Chengsheng Ku, Chingming Liu, Mengming Zhu, Dusan Golubovic, Yujie Huang
  • MOLDED PACKAGE AND METHOD OF MANUFACTURE
    Publication number: 20170330768
    Abstract: A package is manufactured by placing a substrate (10), for example a lead frame, in a mold (30) with a protection flange (38) extending into a notch (14) in the substrate (10) around a contact surface (12). The protection flange (38) impedes molding compound from reaching the contact surface reducing the need for a deflash step.
    Type: Application
    Filed: October 7, 2015
    Publication date: November 16, 2017
    Inventors: Yun Liu, Yuhua Lee, Chengsheng Ku, Chingming Liu, Mengming Zhu, Dusan Golubovic, Yujie Huang