Abstract: In a method of manufacturing a semiconductor device, a fin structure having a channel region protruding from an isolation insulating layer disposed over a semiconductor substrate is formed, a cleaning operation is performed, and an epitaxial semiconductor layer is formed over the channel region. The cleaning operation and the forming the epitaxial semiconductor layer are performed in a same chamber without breaking vacuum.

Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.

Abstract: A package structure is provided. The package structure includes a conductive structure having a first portion and a second portion, and the second portion is wider than the first portion. The package structure also includes a semiconductor chip laterally separated from the conductive structure. The package structure further includes a protective layer laterally surrounding the conductive structure and the semiconductor chip. The first portion of the conductive structure has a sidewall extending from the second portion to a surface of the protective layer. The protective layer laterally surrounds an entirety of the sidewall of the first portion.

Abstract: A chip package structure is provided. The chip package structure includes a first substrate. The chip package structure includes a conductive via structure passing through the first substrate. The chip package structure includes a barrier layer over a surface of the first substrate. The chip package structure includes an insulating layer over the barrier layer. The chip package structure includes a conductive pad over the insulating layer. The conductive pad has a first portion passing through the insulating layer and the barrier layer and connected to the conductive via structure. The chip package structure includes a conductive bump over the conductive pad. The chip package structure includes a second substrate. The chip package structure includes an underfill layer between the first substrate and the second substrate.

Abstract: An information concentrating center, is disclosed, wherein the information concentrating center comprises: at least one module for concentrating information from at least one information source; and at least one module coupling to the Internet, for establishing a P2P connection with a remote client device through the Internet, wherein at least one portion of the information is delivered to the remote client device on the P2P connection.

Abstract: A point-to-point (P2P) apparatus has a device resource, a processor, a storage device and a network interface. The processor processes the device resource. The storage device stores a unique identification code. The network interface connects to a first network via a first gateway and transmits the unique identification code to a server via a second network by a first gateway. An external device accesses the device resource via the first gateway. The second network is a TCP/IP network and the first network is not a TCP/IP network.

Abstract: A display module having an improved assembly structure is provided. The display module includes a frame, a display panel, and a glue. The frame has a side wall and a supporting part, wherein the supporting part has a supporting surface and the side wall is formed on the periphery of the supporting surface. A groove is formed on the supporting surface adjacent to the side wall and is distributed along the side wall. The display panel is disposed within the frame and has a bottom face and a side face. The bottom face is supported by the supporting surface of the supporting part. The side face faces the side wall and forms a gap with the side wall. The glue is filled in the gap and adheres the side wall to the side face.

Abstract: An information concentrating center, is disclosed, wherein the information concentrating center comprises: at least one module for concentrating information from at least one information source; and at least one module coupling to the Internet, for establishing a P2P connection with a remote client device through the Internet, wherein at least one portion of the information is delivered to the remote client device on the P2P connection.

Abstract: A display apparatus includes a display module and a backlight module. The display module includes a substrate and a display panel. The substrate includes an image region and a control region, and the control region is located at an edge of the substrate. The display panel has a first surface and a second surface opposite to the first surface. The backlight module includes a light guide plate, a circuit board, a first light source unit and a second light source unit. The circuit board has a first portion disposed on the first surface and a second portion disposed on the second surface. The first light source unit is disposed on the first portion and provides lights to an incident surface of the light guide plate. The second light source unit is disposed on the second portion and provides lights to the control region.

Abstract: A display module having an improved assembly structure is provided. The display module includes a frame, a display panel, and a glue. The frame has a side wall and a supporting part, wherein the supporting part has a supporting surface and the side wall is formed on the periphery of the supporting surface. A groove is formed on the supporting surface adjacent to the side wall and is distributed along the side wall. The display panel is disposed within the frame and has a bottom face and a side face. The bottom face is supported by the supporting surface of the supporting part. The side face faces the side wall and forms a gap with the side wall. The glue is filled in the gap and adheres the side wall to the side face.

Abstract: A display module having an improved assembly structure is provided. The display module includes a frame, a display panel, and a glue. The frame has a side wall and a supporting part, wherein the supporting part has a supporting surface and the side wall is formed on the periphery of the supporting surface. A groove is formed on the supporting surface adjacent to the side wall and is distributed along the side wall. The display panel is disposed within the frame and has a bottom face and a side face. The bottom face is supported by the supporting surface of the supporting part. The side face faces the side wall and forms a gap with the side wall. The glue is filled in the gap and adheres the side wall to the side face.

Abstract: A multi-motherboard server system, having a management board and a plurality of motherboards, is disclosed. The multi-motherboard server system is applicable to a sever system. The management board has a BMC, and the motherboards are respectively connected to the management board. The BMC can transmit data to a far-end control system through sideband communication.

Abstract: A BIOS architecture adapted in a computer system is provided. The BIOS architecture includes at least one BIOS, a programmable chip module, a baseboard management controller (BMC), a south bridge chip and a network interface controller (NIC). The NIC is connected to the south bridge chip and the BMC and is to receive a remote update data to determine the destination of the remote update data. When the destination of the remote update data is the south bridge chip, the south bridge chip updates the BIOS according to the remote update data. When the destination of the remote update data is the BMC, the NIC informs the BMC to receive the remote update data, such that the BMC controls the programmable chip module to update the BIOS according to the remote update data.

Abstract: A backlight module which includes a frame and a first prism film is provided. The frame includes sidewall which encloses an inner space. The first prism film is disposed within the inner space and has a plurality of prisms on it. The prisms are in parallel and adjacent to each other, and the prisms extend along a first extending direction. The first prism film has a surrounding edge, which includes a first edge and a second edge. The prisms include a center prism being substantially located in a center position of all prisms. The center prism insects the surrounding edge at two intersection points; a first distance D1 is between the intersection point and the sidewall. The surrounding edge further has an end point being located farthest from the center prism. A second distance D2 is between the end point and the sidewall. The first distance D1 is larger than the second distance D2.

Abstract: A display module having an improved assembly structure is provided. The display module includes a frame, a display panel, and a glue. The frame has a side wall and a supporting part, wherein the supporting part has a supporting surface and the side wall is formed on the periphery of the supporting surface. A groove is formed on the supporting surface adjacent to the side wall and is distributed along the side wall. The display panel is disposed within the frame and has a bottom face and a side face. The bottom face is supported by the supporting surface of the supporting part. The side face faces the side wall and forms a gap with the side wall. The glue is filled in the gap and adheres the side wall to the side face.

Abstract: The present invention provides an apparatus and method that increases the utilization by processors on shared resources. It provides the minimum latency in a multiprocessor system during usage right exchange between multi-processors on a shared resource. The apparatus provides a timed mailbox including a timer. The timed mailbox is at least associated with a first processor and a second processor. The second processor starts to utilize a shared resource to perform a task. According to a predetermined clock cycle number, the timed mailbox issues a signal in advance to notify the first processor of the availability of the shared resource to be utilized by the first processor.

Abstract: A multi-motherboard server system, having a management board and a plurality of motherboards, is disclosed. The multi-motherboard server system is applicable to a sever system. The management board has a BMC, and the motherboards are respectively connected to the management board. The BMC can transmit data to a far-end control system through sideband communication.

Abstract: A BIOS architecture adapted in a computer system is provided. The BIOS architecture includes at least one BIOS, a programmable chip module, a baseboard management controller (BMC), a south bridge chip and a network interface controller (NIC). The NIC is connected to the south bridge chip and the BMC and is to receive a remote update data to determine the destination of the remote update data. When the destination of the remote update data is the south bridge chip, the south bridge chip updates the BIOS according to the remote update data. When the destination of the remote update data is the BMC, the NIC informs the BMC to receive the remote update data, such that the BMC controls the programmable chip module to update the BIOS according to the remote update data.

Abstract: A backlight module which includes a frame and a first prism film is provided. The frame includes sidewall which encloses an inner space. The first prism film is disposed within the inner space and has a plurality of prisms on it. The prisms are in parallel and adjacent to each other, and the prisms extend along a first extending direction. The first prism film has a surrounding edge, which includes a first edge and a second edge. The prisms include a center prism being substantially located in a center position of all prisms. The center prism insects the surrounding edge at two intersection points; a first distance D1 is between the intersection point and the sidewall. The surrounding edge further has an end point being located farthest from the center prism. A second distance D2 is between the end point and the sidewall. The first distance D1 is larger than the second distance D2.

Abstract: A flat panel display comprising a liquid crystal module, a backlight module, and a transition film is disclosed. The backlight module provides light to the liquid crystal module, and the transition film is disposed above the liquid crystal module. The transition film comprises a material capable of filtering light of specific wavelengths. The material can be organic dye material phthal-ocyanine Copper (CuPc) or C32H16N8Cu. The transition film can be an evaporation layer, so the transition film can be formed on the polarizer of the liquid crystal module. The transition film has a transparency ratio with respect to blue light and a transparency ratio with respect to red light, and the ratios range from 0.5 to 0.95. The transparency ratio with respect to blue light is greater than that with respect to red light. The backlight module comprises one or more light emitting diodes (LEDs) to provide light.