Patents by Inventor Chengya Xiong

Chengya Xiong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Load transfer mechanism for weigh in motion
    Patent number: 10782178
    Abstract: A load transfer mechanism includes an elongated beam and a sensing package. The beam includes a plate with a load-bearing surface, a tube portion, and a neck. The tube portion includes a base wall and a cover and defines a cavity between the base wall and the cover. The base wall laterally extends from a first edge to a second edge that is opposite the first edge. The cover is joined to the base wall at or proximate to the first and second edges. The neck extends between and joins the plate to the cover of the tube portion. The sensing package is disposed within the cavity of the beam and is under pre-load in engagement with the cover and the base wall. The sensing package is configured to measure forces exerted on the load-bearing surface of the plate.
    Type: Grant
    Filed: May 29, 2018
    Date of Patent: September 22, 2020
    Assignees: TE CONNECTIVITY CORPORATION, TYCO ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Michael Pedrick, Shenghua Liu, Chengya Xiong
  • LOAD TRANSFER MECHANISM FOR WEIGH IN MOTION
    Publication number: 20190301922
    Abstract: A load transfer mechanism includes an elongated beam and a sensing package. The beam includes a plate with a load-bearing surface, a tube portion, and a neck. The tube portion includes a base wall and a cover and defines a cavity between the base wall and the cover. The base wall laterally extends from a first edge to a second edge that is opposite the first edge. The cover is joined to the base wall at or proximate to the first and second edges. The neck extends between and joins the plate to the cover of the tube portion. The sensing package is disposed within the cavity of the beam and is under pre-load in engagement with the cover and the base wall. The sensing package is configured to measure forces exerted on the load-bearing surface of the plate.
    Type: Application
    Filed: May 29, 2018
    Publication date: October 3, 2019
    Inventors: Michael Pedrick, Shenghua Liu, Chengya Xiong