Abstract: An LED light filament includes an LED section, first and second conductive electrodes, a conductive portion and a first solder layer. The LED section includes LED chips. The first conductive electrode and the second conductive electrode are disposed at two ends of the LED section. The conductive portion is electrically connected between the LED chips. An LED chip among the plurality of LED chips has an electrical connecting portion, the one end portion of the conductive portion is connected to the electrical connecting portion and the first solder layer is disposed on the end portion of the conductive portion, and the end portion of the conductive portion is sandwiched between the electrical connecting portion of the LED chip and the first solder layer.

Abstract: An LED light filament includes an LED section, first and second conductive electrodes, a conductive portion and a first solder layer. The LED section includes LED chips. The first conductive electrode and the second conductive electrode are disposed at two ends of the LED section. The conductive portion is electrically connected between the LED chips. An LED chip among the plurality of LED chips has an electrical connecting portion, the one end portion of the conductive portion is connected to the electrical connecting portion and the first solder layer is disposed on the end portion of the conductive portion, and the end portion of the conductive portion is sandwiched between the electrical connecting portion of the LED chip and the first solder layer.

Abstract: An LED light filament includes an LED section, first and second conductive electrodes, and a conductive portion. The LED section includes LED chips. The first conductive electrode and the second conductive electrode are disposed at two ends of the LED section. The conductive portion is electrically connected between the LED chips. An LED chip among the LED chips has an electrical connecting portion, an end portion of the conductive portion is connected to the electrical connecting portion, the conductive portion has a first bent portion and a second bent portion. The conductive portion extends from the electrical connecting portion along a first direction of the LED chip, toward a second direction of the LED chip through the first bent portion, and toward a third direction of the LED chip through the second bent portion, and the first to third directions are different directions. An LED light bulb is also provided.

Abstract: Disclosed herein is an isolable colloidal particle comprising a nanoparticle and an inorganic capping agent bound to the surface of the nanoparticle, a solution of the same, a method for making the same from a biphasic solvent mixture, and the formation of structures and solids from the isolable colloidal particle. The process can yield photovoltaic cells, piezoelectric crystals, thermoelectric layers, optoelectronic layers, light emitting diodes, ferroelectric layers, thin film transistors, floating gate memory devices, imaging devices, phase change layers, and sensor devices.

Abstract: Disclosed herein is an isolable colloidal particle comprising a nanoparticle and an inorganic capping agent bound to the surface of the nanoparticle, a solution of the same, a method for making the same from a biphasic solvent mixture, and the formation of structures and solids from the isolable colloidal particle. The process can yield photovoltaic cells, piezoelectric crystals, thermoelectric layers, optoelectronic layers, light emitting diodes, ferroelectric layers, thin film transistors, floating gate memory devices, imaging devices, phase change layers, and sensor devices.

Abstract: Disclosed herein is an isolable colloidal particle comprising a nanoparticle and an inorganic capping agent bound to the surface of the nanoparticle, a solution of the same, a method for making the same from a biphasic solvent mixture, and the formation of structures and solids from the isolable colloidal particle. The process can yield photovoltaic cells, piezoelectric crystals, thermoelectric layers, optoelectronic layers, light emitting diodes, ferroelectric layers, thin film transistors, floating gate memory devices, imaging devices, phase change layers, and sensor devices.

Abstract: Disclosed herein is an isolable colloidal particle comprising a nanoparticle and an inorganic capping agent bound to the surface of the nanoparticle, a solution of the same, a method for making the same from a biphasic solvent mixture, and the formation of structures and solids from the isolable colloidal particle. The process can yield photovoltaic cells, piezoelectric crystals, thermoelectric layers, optoelectronic layers, light emitting diodes, ferroelectric layers, thin film transistors, floating gate memory devices, imaging devices, phase change layers, and sensor devices.