Patents by Inventor Chengyi He

Chengyi He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Minicircle DNA recombinant parental plasmid having genetically engineered antibody gene expression cassette, a minicircle DNA having the expression cassette, and applications
    Patent number: 10280425
    Abstract: Provided are a minicircle DNA recombinant parental plasmid having a genetically engineered antibody gene expression cassette and a preparation method for the plasmid, a minicircle DNA having the genetically engineered antibody gene expression cassette, a preparation method for the DNA, and applications thereof, and, a host cell having the minicircle DNA, a preparation method for the cell, and applications thereof. Also provided are a genetically engineered antibody, a preparation method for same, and applications thereof.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: May 7, 2019
    Assignees: Shenzhen Institutes of Advanced Technology, Shenzhen Hornetcorn Biotechnology Company, Ltd.
    Inventors: Zhiying Chen, Fei Ma, Chengyi He
  • MINICIRCLE DNA RECOMBINANT PARENTAL PLASMID HAVING GENETICALLY ENGINEERED ANTIBODY GENE EXPRESSION CASSETTE, A MINICIRCLE DNA HAVING THE EXPRESSION CASSETTE, AND APPLICATIONS
    Publication number: 20160312230
    Abstract: Provided are a minicircle DNA recombinant parental plasmid having a genetically engineered antibody gene expression cassette and a preparation method for the plasmid, a minicircle DNA having the genetically engineered antibody gene expression cassette, a preparation method for the DNA, and applications thereof, and, a host cell having the minicircle DNA, a preparation method for the cell, and applications thereof. Also provided are a genetically engineered antibody, a preparation method for same, and applications thereof.
    Type: Application
    Filed: August 5, 2014
    Publication date: October 27, 2016
    Inventors: Zhiying Chen, Fei Ma, Chengyi He
  • ADHESIVE COMPOSITION, ADHESIVE TAPE AND ADHESION STRUCTURE
    Publication number: 20140162059
    Abstract: A halogen-free pressure-sensitive adhesive composition is provided, based on the total weight of the composition, comprising (A) 15-60 wt % of acrylic-based polymer, (B) 10-50 wt % of thermally conductive filler, and (C) 20-50 wt % of halogen-free flame retardant, based on 100% of the total weight of the composition, wherein the component (C) comprises: sub-component (C1) comprising at least one organophosphorous-based flame retardant; and sub-component (C2) comprising at least one flame retardant selected from the group consisting of nitrogen-containing compound-based flame retardants, graphite material-based flame retardants, melamine cyanurate-based flame retardants, metal hydroxide-based flame retardants, metal oxide-based flame retardants, metal phosphate-based flame retardants other than the organophosphorous-based flame retardants of (C1), and the composition has a P content no less than 4.0 wt %, based on 100 wt % of the total weight of the composition.
    Type: Application
    Filed: June 30, 2011
    Publication date: June 12, 2014
    Applicant: 3M Innovative Properties Company
    Inventors: Hongmei Wan, Chengyi He, Yunhai Deng