Abstract: A semiconductor device includes a semiconductor layer, a deep trench isolation structure, a shallow trench isolation structure, a first resistance layer, a second resistance layer, a first heavily doped region, a second heavily doped region, and a conductive line. The deep trench isolation structure separates the semiconductor device into a plurality of units including the first and second units. The shallow trench isolation structure is disposed on a portion of the semiconductor layer in one of the plurality of units. The first and second resistance layers are disposed on the shallow trench isolation structure in the first and second units respectively. The first and second heavily doped regions are embedded in the shallow trench isolation structure and in physical contact with the semiconductor layer in the first and second units respectively. The conductive line electrically connects the first and second resistance layers and the second heavily doped region.

Abstract: The present application provides a method for detecting abnormalities in equipment and an electronic device. The method includes: obtaining correlation weights by performing a correlation analysis on performance indicator data; determining a time attenuation weight of the abnormal event; based on the correlation weights and the time attenuation weight, obtaining an attention weight of the performance indicator data by performing a self-attention analysis on the performance indicator data and historical indicator data of the abnormal event using a self-attention mechanism; determining a convergence indicator of an expert model according to performance evaluation data of the expert model corresponding to the performance indicator data; in response that the expert model is determined to be qualified, obtaining an abnormal detection result of the equipment under test by using the expert model according to a time domain feature, a frequency domain feature and normalized performance indicator data.

Abstract: An integrated heat dissipation module structure includes a metallic top cover, a metallic bottom cover, a working space, capillary structures and a working fluid in the working space. The top cover includes oppositely an outer heat-dissipating surface having a plurality of columnar heat dissipation structures protruding therefrom and an inner condensation surface surrounded by a top frame. The inner condensation surface has parallel top grooves. The bottom cover includes oppositely an outer heat-absorption surface having screw holes for locking electronic elements and an inner evaporation surface surrounded by a bottom frame. The inner evaporation surface has parallel bottom grooves, protrusive supporting structures disposed between the bottom grooves, and screw-hole protrusions corresponding to the screw holes. The capillary structures are disposed within the bottom grooves or both the bottom and top grooves. The working fluid is in the working space and the capillary structures.

Abstract: A method for preparing an organic metal skeleton material embedded with nanometal, comprising: S1: making a precursor comprising a mixed solution of a metal salt and an organic ligand; S2: providing an adjusting solution, mixing and causing reactions the adjusting solution with the precursor so that the adjusting solution makes the precursor mixed solution have a pH value ranged from 3 to 7, thereby forming an organic metal skeleton material; and S3: dispersing the organic metal skeleton material in a hydrophobic solvent, then adding a metal salt solution, drying the organic metal skeleton material and the metal salt after adsorption, and causing a metal reduction reaction in a gas environment to form an internal organic metal skeleton material embedded with nanometals.

Abstract: A liquid cooling vapor chamber heat dissipation module includes a liquid cooling cover, a metallic top cover, and a metallic bottom cover. The liquid cooling cover includes a top portion, a sidewall and an accommodating space. The sidewall includes a liquid inlet and a liquid outlet. The outer heat-dissipating surface of the top cover has a plurality of columnar heat-dissipating structures. The inner evaporation surface of the metallic bottom cover has parallel bottom grooves and protrusive supporting structures disposed between the bottom grooves. An integrated vapor chamber is formed by engaging the metallic top and bottom covers. The liquid cooling cover engages with the outer heat-dissipating surface of the metallic top cover with the columnar heat-dissipating structures accommodating within the accommodating space, which allows cooling liquid to enter the accommodating space from the liquid inlet and flow through the columnar heat-dissipating structures, and flow out from the liquid outlet.

Abstract: A nozzle structure with forward and reverse water sealing, comprising a nozzle head, a cover, and a plurality of sealing rings. The two ends of the nozzle head are the water-filling end and the spraying end respectively, a drainage aperture is pierced on the side of the spraying end, a guide cone is provided at the upper end, and a stopper is installed convexly on the outer periphery at the end portion of spraying end. The cover is sleeved on the nozzle head, which can rotate forwardly and reversely. The sealing rings are set on the nozzle head and the cover respectively. When the cover is rotated to the forward or reverse end, both ends of the cover can be sealed by the sealing rings to seal off the water.

Abstract: A liquid-cooling heat dissipation plate, including: two heat dissipation components including a rectangular plate having oppositely an inner surface and an outer surface. Three edges of the inner surface are surrounded by a U-shaped frame with predetermined heights, the inner surface has a plurality of heat dissipation pillars protruding therefrom. The liquid-cooling heat dissipation plate is formed by joining and welding one of the heat dissipation components to the other with the inner surfaces facing to each other, and also resulting in formation of a liquid-flow chamber. At least one liquid inlet is provided to allow a cooling fluid to enter the liquid-flow chamber, and at least one liquid outlet is provided to allow the cooling fluid to exit the liquid-flow chamber, wherein the liquid inlet and the liquid outlet are arranged at the same side or different side of the liquid-cooling heat dissipation plate.

Abstract: A liquid-cooling heat dissipation system includes: a liquid-cooling vapor chamber, a liquid-cooling heat dissipation plate, a first and a second coolant pipelines connecting the two, a coolant circulation machine, a fan, and a cooling liquid. The liquid-cooling vapor chamber includes a liquid-cooling cover, a metallic top cover, and a metallic bottom cover. The liquid-cooling heat dissipation plate includes a heat dissipation bottom plate and a heat dissipation outer cover. The coolant circulation machine pumps the cooling liquid from the first coolant pipeline into the liquid cooling cover, and then flows into the liquid-cooling heat dissipation plate. The fan locked on the bottom plate outer surface blows air to the liquid-cooling heat dissipation plate, so that the cooling liquid is cooled when flowing through the second accommodation space in the liquid cooling heat dissipation plate, and then flows back to the coolant circulations machine for recirculation.

Abstract: A heat insulation pad applied to an electronic device is provided. The electronic device includes a housing and a heat source. The housing includes an inner side surface. The heat insulation pad includes a first contact layer, a second contact layer, and a hole layer stack structure. The first contact layer is adapted to attach to the inner side surface. The second contact layer is adapted to contact the heat source. The hole layer stack structure includes a plurality of hole layers stacked in sequence and is located between the first contact layer and the second contact layer. An electronic device with the heat insulation pad is further provided.

Abstract: A method for intelligent interaction is provided. The method comprises: obtaining a dialogue content with an interactive object and a first emotional data of the interactive object in a first period; determining a first emotional type according to the first emotional data; activating a first emotional model corresponding to the first emotional type; generating a first response content according to the dialogue content through invoking the first emotional model; and responding to the dialogue content according to the first response content. The first response content is generated based on the dialogue content through the first emotional model, such that the first response content matches the first emotional type.

Abstract: An integrated vapor chamber includes a metallic top cover, a metallic bottom cover, a working space, capillary structures and a working fluid in the working space. The top cover includes oppositely an outer heat-dissipating surface and an inner condensation surface surrounded by a top frame. The inner condensation surface has parallel top grooves and protrusive supporting structures. The bottom cover includes oppositely an outer heat-absorption surface having recessed spaces for accommodating electronic elements and an inner evaporation surface surrounded by a bottom frame. The inner evaporation surface has parallel bottom grooves. The working space is an airtight space formed by engaging the top frame and the bottom frame with the inner condensation surface to face the inner evaporation surface, the top grooves to overlap individually the bottom grooves, the supporting structures to contact individually at the inner evaporation surface among the bottom grooves.

Abstract: A method for resource allocation of a cloud platform is provided. The method comprises: collecting an initial hardware parameter of an electronic device based on the electronic device accessing the cloud platform, vectorizing the initial hardware parameter to obtain a base vector data, traversing a vector database to calculate similarities between the base vector data and each reference vector data in the vector database sequentially, determining a target reference vector data based on a maximum similarity, generating a deployment role based on the target reference vector data, invoking and running a deployment program corresponding to the deployment role. A resource allocation efficiency of a cloud platform can be improved and a resource allocation cost can be reduced.

Abstract: Through the present invention, game players can auction or transact game objects under their game accounts, such as roles, props, services, etc. The management of game account trading through the trading platform will also protect the safety of game object transactions. In addition, players can also take advantage of the functions of the present invention to manage their auctions and negotiate prices.

Abstract: A liquid cooling vapor chamber heat dissipation module includes a liquid cooling cover, a metallic top cover, and a metallic bottom cover. The liquid cooling cover includes a top portion, a sidewall and an accommodating space. The sidewall includes a liquid inlet and a liquid outlet. The outer heat-dissipating surface of the top cover has a plurality of columnar heat-dissipating structures. The inner evaporation surface of the metallic bottom cover has parallel bottom grooves and protrusive supporting structures disposed between the bottom grooves. An integrated vapor chamber is formed by engaging the metallic top and bottom covers. The liquid cooling cover engages with the outer heat-dissipating surface of the metallic top cover with the columnar heat-dissipating structures accommodating within the accommodating space, which allows cooling liquid to enter the accommodating space from the liquid inlet and flow through the columnar heat-dissipating structures, and flow out from the liquid outlet.

Abstract: A display device includes a bezel, first and second light guide plates (LGP), first and second light emitting element, first and second reflection sheets, a first fixing member, and at least one display panel. Each of the first and second LGPs has a bottom surface, a light exit surface, a light incident surface, and a first side surface. The first and second reflection sheets are located between the bezel and the first LGP and between the bezel and the second LGP, respectively. Bent portions of the first and second reflection sheets are disposed beside the first side surface of the first LGP and the first side surface of the second LGP, respectively and located between the first side surface of the first LGP and the first side surface of the second LGP. The first fixing member is sandwiched between the bent portions of the first and second reflection sheets.

Abstract: The present invention provides a method to establish cloned game accounts, when an auction information is posted on the game account trading platform, the game account trading platform will establish a testing game interface according to the game interface under the relevant game account, and generate a cloned game account based on the game objects, so that the buyer user primary account can enter this testing game interface to test the cloned game account.

Abstract: An imaging system includes a scattering assembly with a scattering medium positioned a first distance from an object to be imaged. The scattering medium includes a plurality of particles suspended in a suspension medium and at least one field source generating an electromagnetic field to manipulate an orientation, concentration, spatial distribution, and/or other properties of the plurality of particles. The imaging system further includes a detector including a plurality of detector elements positioned a second distance from the scattering medium and an image processing system configured to reconstruct an image of the object from an object image signal detected by the detector using object light scattered by the scattering medium and incident on the detector.

Abstract: A semiconductor device includes a semiconductor layer, a deep trench isolation structure, a shallow trench isolation structure, a first resistance layer, a second resistance layer, a first heavily doped region, a second heavily doped region, and a conductive line. The deep trench isolation structure separates the semiconductor device into a plurality of units including the first and second units. The shallow trench isolation structure is disposed on a portion of the semiconductor layer in one of the plurality of units. The first and second resistance layers are disposed on the shallow trench isolation structure in the first and second units respectively. The first and second heavily doped regions are embedded in the shallow trench isolation structure and in physical contact with the semiconductor layer in the first and second units respectively. The conductive line electrically connects the first and second resistance layers and the second heavily doped region.

Abstract: An integrated heat dissipation module structure includes a metallic top cover, a metallic bottom cover, a working space, capillary structures and a working fluid in the working space. The top cover includes oppositely an outer heat-dissipating surface having a plurality of columnar heat dissipation structures protruding therefrom and an inner condensation surface surrounded by a top frame. The inner condensation surface has parallel top grooves. The bottom cover includes oppositely an outer heat-absorption surface having screw holes for locking electronic elements and an inner evaporation surface surrounded by a bottom frame. The inner evaporation surface has parallel bottom grooves, protrusive supporting structures disposed between the bottom grooves, and screw-hole protrusions corresponding to the screw holes. The capillary structures are disposed within the bottom grooves or both the bottom and top grooves. The working fluid is in the working space and the capillary structures.

Abstract: A nozzle structure with forward and reverse water sealing, comprising a nozzle head, a cover, and a plurality of sealing rings. The two ends of the nozzle head are the water-filling end and the spraying end respectively, a drainage aperture is pierced on the side of the spraying end, a guide cone is provided at the upper end, and a stopper is installed convexly on the outer periphery at the end portion of spraying end. The cover is sleeved on the nozzle head, which can rotate forwardly and reversely. The sealing rings are set on the nozzle head and the cover respectively. When the cover is rotated to the forward or reverse end, both ends of the cover can be sealed by the sealing rings to seal off the water.