Patents by Inventor Chengzhe SHEN
Chengzhe SHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220291570Abstract: The present application relates to a base (10), a camera module (100) and an electronic device (1000). The base (10) is used for bearing a lens (20), and comprises: a substrate (1) connected to the lens (20), the substrate (1) being provided with a mounting hole (13); a photosensitive chip (2) arranged in the mounting hole (13) and opposite the lens (20); and a support structure (6) arranged in the mounting hole (13), connected to an inner wall (131) of the mounting hole (13) and connected to a surface, away from the lens (20), of the photosensitive chip (2) so as to support the photosensitive chip (2).Type: ApplicationFiled: August 14, 2020Publication date: September 15, 2022Applicants: OFILM GROUP CO., LTD., NANCHANG OFILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Zhongke MA, Xiaofeng CHEN, Chengzhe SHEN
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Publication number: 20220294941Abstract: The present application relates to a base (10), a camera module (100), and an electronic device (1000). The base (10) is used for bearing a lens (20), and comprises: a substrate (1) connected to the lens (20), the substrate (1) being provided with a mounting hole (13); an optical sensing chip (2) provided in the mounting hole (13) and opposite to the lens (20), a gap (6) being provided between a sidewall (21) of the optical sensing chip (2) and an inner wall (131) of the mounting hole (13); and a connection structure (3) provided in the gap (6) and connected to the optical sensing chip (2) and the substrate (1) respectively to fix the optical sensing chip (2) to the substrate (1).Type: ApplicationFiled: August 14, 2020Publication date: September 15, 2022Applicants: OFILM GROUP CO., LTD., NANCHANG OFILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Zhongke MA, Xiaofeng CHEN, Chengzhe SHEN
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Patent number: 11163214Abstract: A camera module includes a circuit board; a photosensitive chip located on the circuit board and electrically coupled to the circuit board, a package material body arranged on the circuit board, a support member arranged on one end of the package material body away from the circuit board, and a filter having a first and a second surfaces. The package material body includes a top end bearing surface. The support member includes a support body and an extension structure, and the extension structure includes a bottom surface, the bottom surface is connected to the bearing surface, and the second surface is connected to the bottom surface. The camera module is a three-stage structure of a package material body plus a support member plus a plurality of lenses.Type: GrantFiled: September 15, 2018Date of Patent: November 2, 2021Assignee: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe Shen, Jun Feng, Shumin Zhu, Shengyun Zhang, Wenhua Shuai, Dong Tang
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Patent number: 10951801Abstract: A photosensitive assembly includes a circuit board, photosensitive chip coupled to the circuit board, the photosensitive chip includes a photosensitive area on an upper surface thereof and a non-photosensitive area surrounding the photosensitive area, and a package body packaged on the circuit board and covering a portion of the non-photosensitive area of the photosensitive chip, the package body includes an inner surface, and the inner surface has a curved surface on an edge thereof contacting the non-photosensitive area.Type: GrantFiled: September 14, 2018Date of Patent: March 16, 2021Assignee: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe Shen, Jun Feng, Shumin Zhu, Shengyun Zhang, Wenhua Shuai, Dong Tang
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Patent number: 10750072Abstract: The present disclosure relates to a camera module and a photosensitive assembly thereof. The photosensitive assembly comprises includes a circuit board, a photosensitive chip, and a packaging body. The photosensitive chip is connected to the circuit board. The packaging body is formed on the circuit board. A through hole is formed in the packaging body. The through hole is opposite to the photosensitive chip to provide a light channel of for the photosensitive chip. An inner side surface of the through hole comprises includes a first cambered surface, a connection surface, and a second cambered surface, and the first cambered surface and the second cambered surface are respectively connected to two ends of the connection surface.Type: GrantFiled: September 15, 2018Date of Patent: August 18, 2020Assignee: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe Shen, Jun Feng, Shumin Zhu, Shengyun Zhang, Wenhua Shuai, Dong Tang
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Patent number: 10707249Abstract: A camera module includes a circuit board; a photosensitive chip coupled to the circuit board, a package material body attached on the circuit board, and a support member mounted on the package material body. The package material body has a photosensitive surface, which includes a photosensitive region. The support member includes a support body and an extension structure. A side of the support body away from the package material body is coplanar with the extension structure. An orthographic projection of the extension structure on the photosensitive surface is spaced apart from the photosensitive region.Type: GrantFiled: September 15, 2018Date of Patent: July 7, 2020Assignee: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe Shen, Jun Feng, Shumin Zhu, Shengyun Zhang, Wenhua Shuai, Dong Tang
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Patent number: 10708481Abstract: The present disclosure relates to a camera module and a photosensitive assembly thereof. The photosensitive assembly includes a circuit board, a photosensitive chip and a packaging body. The photosensitive chip is connected to the circuit board, and includes a photosensitive region and a non-photosensitive region surrounding the photosensitive region. The packaging body is formed on the circuit board and a portion of the non-photosensitive region of the photosensitive chip. The packaging body includes a top surface away from the photosensitive chip and an inner side surface connecting the top surface to the non-photosensitive region. A portion of the inner side surface adjacent to the top surface is a cambered surface, and the cambered surface has a larger surface area than an inclined plane, thus the cambered surface can carry more adhesive. In this way, it is possible to effectively prevent the adhesive from flowing to the photosensitive region of the photosensitive chip.Type: GrantFiled: September 15, 2018Date of Patent: July 7, 2020Assignee: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe Shen, Jun Feng, Shumin Zhu, Shengyun Zhang, Wenhua Shuai, Dong Tang
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Patent number: 10623614Abstract: A camera module includes a circuit board, a photosensitive chip coupled to the circuit board and having a photosensitive surface, a package material body attached on the circuit board, and a support member mounted on a side of the package material body away from the circuit board. The photosensitive surface includes a photosensitive region. The support member includes a support body and an extension structure. A side of the support body adjacent to the package material body is coplanar with a side of the extension structure adjacent to the package material body, and an orthographic projection of the extension structure on the photosensitive surface is spaced apart from the photosensitive region.Type: GrantFiled: September 15, 2018Date of Patent: April 14, 2020Assignee: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe Shen, Jun Feng, Shumin Zhu, Shengyun Zhang, Wenhua Shuai, Dong Tang
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Patent number: 10600832Abstract: A camera module includes a circuit board, a photosensitive chip located on the circuit board and electrically coupled to the circuit board, a package body packaged on the circuit board, and a bracket located on a side of the package body away from the circuit board. The package body includes a bearing surface away from the circuit board, and the bracket includes a first surface adjacent to the package body. A ratio between an area of the first surface and an area of the bearing surface is about 0.5 to about 1.2.Type: GrantFiled: September 14, 2018Date of Patent: March 24, 2020Assignee: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe Shen, Jun Feng, Shumin Zhu, Shengyun Zhang, Wenhua Shuai, Dong Tang
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Patent number: 10602043Abstract: A camera module includes: a circuit board; a photosensitive chip located on and coupled to the circuit board; a package body packaged on the circuit board; and a bracket located on a side of the package body away from the circuit board; wherein the bracket is provided with a step away from the package body, a sidewall of the step is inclined with respect to an optical axis of the camera module, a distance between the sidewall of the step and the optical axis gradually increase along a direction from the circuit to the package body, and an angle between the sidewall of the step and the optical axis ranges from 0.5° to 30°.Type: GrantFiled: September 14, 2018Date of Patent: March 24, 2020Assignees: O-FILM IMAGE TECHNOLOGY (GUANGZHOU) CO., LTD., NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe Shen, Jun Feng, Shumin Zhu, Shengyun Zhang, Wenhua Shuai, Dong Tang
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Publication number: 20190089885Abstract: A camera module includes a circuit board, a photosensitive chip coupled to the circuit board and having a photosensitive surface, a package material body attached on the circuit board, and a support member mounted on a side of the package material body away from the circuit board. The photosensitive surface includes a photosensitive region. The support member includes a support body and an extension structure. A side of the support body adjacent to the package material body is coplanar with a side of the extension structure adjacent to the package material body, and an orthographic projection of the extension structure on the photosensitive surface is spaced apart from the photosensitive region.Type: ApplicationFiled: September 15, 2018Publication date: March 21, 2019Applicant: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe SHEN, Jun FENG, Shumin ZHU, Shengyun ZHANG, Wenhua SHUAI, Dong TANG
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Publication number: 20190089884Abstract: The present disclosure relates do a camera module and a photosensitive assembly thereof The photosensitive assembly comprises includes a circuit board, a photosensitive chip, and a packaging body. The photosensitive chip is connected to the circuit board. The packaging body is formed on the circuit board. A through hole is formed in the packaging body. The through hole is opposite lo the photosensitive chip to provide a light channel of for the photosensitive chip. An inner side surface of the through hole comprises includes a first cambered surface, a connection surface, and a second cambered surface, and the first cambered surface and the second cambered surface are respectively connected to two ends of the connection surface.Type: ApplicationFiled: September 15, 2018Publication date: March 21, 2019Applicant: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe SHEN, Jun FENG, Shumin ZHU, Shengyun ZHANG, Wenhua SHUAI, Dong TANG
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Publication number: 20190089883Abstract: The present disclosure relates to a camera module and a photosensitive assembly thereof. The photosensitive assembly includes a circuit board, a photosensitive chip and a packaging body. The photosensitive chip is connected to the circuit board, and includes a photosensitive region and a non-photosensitive region surrounding the photosensitive region. The packaging body is formed on the circuit board and a portion of the non-photosensitive region of the photosensitive chip. The packaging body includes a top surface away from the photosensitive chip and an inner side surface connecting the top surface to the non-photosensitive region. A portion of the inner side surface adjacent to the top surface is a cambered surface, and the cambered surface has a larger surface area than an inclined plane, thus the cambered surface can carry more adhesive. In this way, it is possible to effectively prevent the adhesive from flowing to the photosensitive region of the photosensitive chip.Type: ApplicationFiled: September 15, 2018Publication date: March 21, 2019Applicant: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe SHEN, Jun FENG, Shumin ZHU, Shengyun ZHANG, Wenhua SHUAI, Dong TANG
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Publication number: 20190086771Abstract: A camera module includes a circuit board; a photosensitive chip located on the circuit board and electrically coupled to the circuit board, a package material body arranged on the circuit board, a support member arranged on one end of the package material body away from the circuit board, and a filter having a first and a second surfaces. The package material body includes a top end bearing surface. The support member includes a support body and an extension structure, and the extension structure includes a bottom surface, the bottom surface is connected to the bearing surface, and the second surface is connected to the bottom surface. The camera module is a three-stage structure of a package material body plus a support member plus a plurality of lenses.Type: ApplicationFiled: September 15, 2018Publication date: March 21, 2019Applicant: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe SHEN, Jun FENG, Shumin ZHU, Shengyun ZHANG, Wenhua SHUAI, Dong TANG
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Publication number: 20190088699Abstract: A camera module includes a circuit board; a photosensitive chip coupled to the circuit board, a package material body attached on the circuit board, and a support member mounted on the package material body. The package material body has a photosensitive surface, which includes a photosensitive region. The support member includes a support body and an extension structure. A side of the support body away from the package material body is coplanar with the extension structure. An orthographic projection of the extension structure on the photosensitive surface is spaced apart from the photosensitive region.Type: ApplicationFiled: September 15, 2018Publication date: March 21, 2019Applicant: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe SHEN, Jun FENG, Shumin ZHU, Shengyun ZHANG, Wenhua SHUAI, Dong TANG
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Publication number: 20190088698Abstract: A camera module includes a circuit board, a photosensitive chip located on the circuit board and electrically coupled to the circuit board, a package body packaged on the circuit board, and a bracket located on a side of the package body away from the circuit board. The package body includes a bearing surface away from the circuit board, and the bracket includes a first surface adjacent to the package body. A ratio between an area of the first surface and an area of the bearing surface is about 0.5 to about 1.2.Type: ApplicationFiled: September 14, 2018Publication date: March 21, 2019Applicant: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe SHEN, Jun FENG, Shumin ZHU, Shengyun ZHANG, Wenhua SHUAI, Dong TANG
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Publication number: 20190089882Abstract: A photosensitive assembly includes a circuit board, photosensitive chip coupled to the circuit board, the photosensitive chip includes a photosensitive area on an upper surface thereof and a non-photosensitive area surrounding the photosensitive area, and a package body packaged on the circuit board and covering a portion of the non-photosensitive area of the photosensitive chip, the package body includes an inner surface, and the inner surface has a curved surface on an edge thereof contacting the non-photosensitive area.Type: ApplicationFiled: September 14, 2018Publication date: March 21, 2019Applicant: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe SHEN, Jun FENG, Shumin ZHU, Shengyun ZHANG, Wenhua SHUAI, Dong TANG
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Publication number: 20190089881Abstract: A camera module includes: a circuit board; a photosensitive chip located on and coupled to the circuit board; a package body packaged on the circuit board; and a bracket located on a side of the package body away from the circuit board; wherein the bracket is provided with a step away from the package body, a sidewall of the step is inclined with respect to an optical axis of the camera module, a distance between the sidewall of the step and the optical axis gradually increase along a direction from the circuit to the package body, and an angle between the sidewall of the step and the optical axis ranges from 0.5° to 30°.Type: ApplicationFiled: September 14, 2018Publication date: March 21, 2019Applicants: O-FILM IMAGE TECHNOLOGY (GUANGZHOU) CO.,LTD., NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe SHEN, Jun FENG, Shumin ZHU, Shengyun ZHANG, Wenhua SHUAI, Dong TANG