Patents by Inventor Chengzhi PENG

Chengzhi PENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153082
    Abstract: Disclosed is a computer-implemented three-dimensional image classification system (CIS) for processing and/or analyzing non-contrast computed tomography (CT) medical imaging data. The CIS is a deep neural network containing multiple Convolutional Block Attention Module (CBAM) blocks, which contain convolutional layers for feature extraction followed by CBAMs. The CBAM applies channel attention to highlight more relevant features and spatial attention to focus on more important regions. Max pooling layers operably link adjacent pairs of CBAM blocks. The output of the final CBAM block is passed to two terminal fully connected layers to generate a diagnosis. This classification system can be used to perform efficient diagnosis of hepatocellular carcinoma using solely non-contrast CT images, with diagnostic performance comparable to that of a radiologist using the current LIRADS system.
    Type: Application
    Filed: September 21, 2023
    Publication date: May 9, 2024
    Inventors: Chengzhi Peng, Leung Ho Philip Yu, Wan Hang Keith Chiu, Xianhua Mao, Man Fung Yuen, Wai Kay Walter Seto
  • Publication number: 20220416145
    Abstract: The present disclosure provides a two-dimensional scalable superconducting qubit structure and a method for controlling a cavity mode thereof. The two-dimensional scalable superconducting qubit structure includes: a superconducting qubit chip comprising a plurality of two-dimensionally distributed and scalable qubits; a capacitor part of each of the qubits has at least five arms distributed two-dimensionally, two of the at least five arms in each qubit are respectively connected with a read coupling circuit and a control circuit, and the other at least three arms are coupled with adjacent qubits through a coupling cavity.
    Type: Application
    Filed: July 1, 2020
    Publication date: December 29, 2022
    Applicant: UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
    Inventors: Shiyu WANG, Futian LIANG, Hui DENG, Ming GONG, Yulin WU, Chengzhi PENG, Xiaobo ZHU, Jianwei PAN