Patents by Inventor CHENJIE LIAO

CHENJIE LIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light Emitting Diode Package Structure and Fabrication Method
    Publication number: 20170005245
    Abstract: A light emitting diode package structure includes: a first reflecting material layer with through holes; a flip chip on the first reflecting material layer, with the electrodes inlaid in the through holes of the first reflecting material layer; a first transparent material layer surrounding the side surface of the flip chip except the electrodes; a second reflecting material layer surrounding the first transparent material layer, the interface between the first transparent material layer and the reflecting material layer is an inclined plane, an arc plane, or an irregular shape, to thereby facilitate upward light reflection of the flip chip; and a wavelength conversion material layer covered over the above structure.
    Type: Application
    Filed: June 24, 2016
    Publication date: January 5, 2017
    Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: CHEN-KE HSU, JUNPENG SHI, PEI-SONG CAI, ZHENDUAN LIN, HAO HUANG, CHENJIE LIAO, CHIH-WEI CHAO, QIUXIA LIN