Patents by Inventor Chen-Li Hu

Chen-Li Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12106787
    Abstract: The present disclosure generally relate to a read head and methods of forming thereof. Upon forming a dual free layer (DFL) sensor and a rear hard bias (RHB) structure on a seed layer, a photoresist is deposited on the DFL read head and the RHB structure. A refill layer is deposited on the photoresist and the seed layer adjacent to the DFL sensor and the RHB structure. Portions of the refill layer disposed on one or more sidewalls of the photoresist are removed, and a SiOx cap layer is deposited on the refill layer and on the one or more sidewalls. The photoresist is removed, and the SiOx cap layer and top surfaces of the DFL sensor and the RHB structure are planarized to form a substantially flat topography. The SiOx cap layer acts as a stop layer for the refill layer, and remains in the finished read head.
    Type: Grant
    Filed: August 1, 2023
    Date of Patent: October 1, 2024
    Assignee: Western Digital Technologies, Inc.
    Inventors: Yung-Hung Wang, Chih-Ching Hu, Hongxue Liu, Guanxiong Li, Chen-Jung Chien, Ming Mao, Ming Jiang
  • Patent number: D514539
    Type: Grant
    Filed: July 20, 2004
    Date of Patent: February 7, 2006
    Assignee: Inventec Appliances Corporation
    Inventors: Cheng-Shing Lai, Chen-Li Hu, Xin-Lan Wang