Patents by Inventor Chen-Lin Li

Chen-Lin Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package structure preventing solder overflow on substrate solder pads
    Patent number: 7768131
    Abstract: A package structure preventing solder overflow on substrate solder pads includes a plurality of die pins, a plurality of solders and a plurality of substrate solder pads. The die pins are located under a die. The substrate solder pads are formed on an upper surface of a substrate by copper plating or etching. Each of the substrate solder pads has at least one solder pad connection point. The solders connect the die pins with the corresponding solder pad connection points, respectively. Each of the solder pad connection points has a pair of solder pad ridges or a pair of solder pad grooves. The solder pad ridges and the solder pad grooves filled with the solder or a resin can prevent the solder overflow problem.
    Type: Grant
    Filed: June 27, 2009
    Date of Patent: August 3, 2010
    Assignee: Kinsus Interconnect Technology Corp.
    Inventors: Jun-Chung Hsu, Chen-Lin Li