Patents by Inventor Chenmin Hu
Chenmin Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11694009Abstract: Pattern centric process control is disclosed. A layout of a semiconductor chip is decomposed into a plurality of intended circuit layout patterns. For the plurality of intended circuit layout patterns, a corresponding plurality of sets of fabrication risk assessments corresponding to respective ones of a plurality of sources is determined. Determining a set of fabrication risk assessments for an intended circuit layout pattern comprises determining fabrication risk assessments based at least in part on: simulation of the intended circuit layout pattern, statistical analysis of the intended circuit layout pattern, and evaluation of empirical data associated with a printed circuit layout pattern. A scoring formula is applied based at least in part on the sets of fabrication risk assessments to obtain a plurality of overall fabrication risk assessments for respective ones of the plurality of intended circuit layout patterns.Type: GrantFiled: April 5, 2021Date of Patent: July 4, 2023Assignee: Anchor Semiconductor, Inc.Inventors: Chenmin Hu, Khurram Zafar, Ye Chen, Yue Ma, Rong Lv, Justin Chen, Abhishek Vikram, Yuan Xu, Ping Zhang
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Publication number: 20210326505Abstract: Pattern centric process control is disclosed. A layout of a semiconductor chip is decomposed into a plurality of intended circuit layout patterns. For the plurality of intended circuit layout patterns, a corresponding plurality of sets of fabrication risk assessments corresponding to respective ones of a plurality of sources is determined. Determining a set of fabrication risk assessments for an intended circuit layout pattern comprises determining fabrication risk assessments based at least in part on: simulation of the intended circuit layout pattern, statistical analysis of the intended circuit layout pattern, and evaluation of empirical data associated with a printed circuit layout pattern. A scoring formula is applied based at least in part on the sets of fabrication risk assessments to obtain a plurality of overall fabrication risk assessments for respective ones of the plurality of intended circuit layout patterns.Type: ApplicationFiled: April 5, 2021Publication date: October 21, 2021Inventors: Chenmin Hu, Khurram Zafar, Ye Chen, Yue Ma, Rong Lv, Justin Chen, Abhishek Vikram, Yuan Xu, Ping Zhang
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Patent number: 10997340Abstract: Pattern centric process control is disclosed. A layout of a semiconductor chip is decomposed into a plurality of intended circuit layout patterns. For the plurality of intended circuit layout patterns, a corresponding plurality of sets of fabrication risk assessments corresponding to respective ones of a plurality of sources is determined. Determining a set of fabrication risk assessments for an intended circuit layout pattern comprises determining fabrication risk assessments based at least in part on: simulation of the intended circuit layout pattern, statistical analysis of the intended circuit layout pattern, and evaluation of empirical data associated with a printed circuit layout pattern. A scoring formula is applied based at least in part on the sets of fabrication risk assessments to obtain a plurality of overall fabrication risk assessments for respective ones of the plurality of intended circuit layout patterns.Type: GrantFiled: November 26, 2019Date of Patent: May 4, 2021Assignee: Anchor Semiconductor Inc.Inventors: Chenmin Hu, Khurram Zafar, Ye Chen, Yue Ma, Rong Lv, Justin Chen, Abhishek Vikram, Yuan Xu, Ping Zhang
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Publication number: 20200097621Abstract: Pattern centric process control is disclosed. A layout of a semiconductor chip is decomposed into a plurality of intended circuit layout patterns. For the plurality of intended circuit layout patterns, a corresponding plurality of sets of fabrication risk assessments corresponding to respective ones of a plurality of sources is determined. Determining a set of fabrication risk assessments for an intended circuit layout pattern comprises determining fabrication risk assessments based at least in part on: simulation of the intended circuit layout pattern, statistical analysis of the intended circuit layout pattern, and evaluation of empirical data associated with a printed circuit layout pattern. A scoring formula is applied based at least in part on the sets of fabrication risk assessments to obtain a plurality of overall fabrication risk assessments for respective ones of the plurality of intended circuit layout patterns.Type: ApplicationFiled: November 26, 2019Publication date: March 26, 2020Inventors: Chenmin Hu, Khurram Zafar, Ye Chen, Yue Ma, Rong Lv, Justin Chen, Abhishek Vikram, Yuan Xu, Ping Zhang
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Patent number: 10546085Abstract: Pattern centric process control is disclosed. A layout of a semiconductor chip is decomposed into a plurality of intended circuit layout patterns. For the plurality of intended circuit layout patterns, a corresponding plurality of sets of fabrication risk assessments corresponding to respective ones of a plurality of sources is determined. Determining a set of fabrication risk assessments for an intended circuit layout pattern comprises determining fabrication risk assessments based at least in part on: simulation of the intended circuit layout pattern, statistical analysis of the intended circuit layout pattern, and evaluation of empirical data associated with a printed circuit layout pattern. A scoring formula is applied based at least in part on the sets of fabrication risk assessments to obtain a plurality of overall fabrication risk assessments for respective ones of the plurality of intended circuit layout patterns.Type: GrantFiled: April 3, 2018Date of Patent: January 28, 2020Assignee: Anchor Semiconductor Inc.Inventors: Chenmin Hu, Khurram Zafar, Ye Chen, Yue Ma, Rong Lv, Justin Chen, Abhishek Vikram, Yuan Xu, Ping Zhang
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Publication number: 20180300434Abstract: Pattern centric process control is disclosed. A layout of a semiconductor chip is decomposed into a plurality of intended circuit layout patterns. For the plurality of intended circuit layout patterns, a corresponding plurality of sets of fabrication risk assessments corresponding to respective ones of a plurality of sources is determined. Determining a set of fabrication risk assessments for an intended circuit layout pattern comprises determining fabrication risk assessments based at least in part on: simulation of the intended circuit layout pattern, statistical analysis of the intended circuit layout pattern, and evaluation of empirical data associated with a printed circuit layout pattern. A scoring formula is applied based at least in part on the sets of fabrication risk assessments to obtain a plurality of overall fabrication risk assessments for respective ones of the plurality of intended circuit layout patterns.Type: ApplicationFiled: April 3, 2018Publication date: October 18, 2018Inventors: Chenmin Hu, Khurram Zafar, Ye Chen, Yue Ma, Rong Lv, Justin Chen, Abhishek Vikram, Yuan Xu, Ping Zhang
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Patent number: 10062160Abstract: Tracking patterns during a semiconductor fabrication process includes: obtaining an image of a portion of a fabricated device; extracting contours of the portion of the fabricated device from the obtained image; aligning the extracted contour to a matching section of a reference design; decomposing the matching section of the reference design into one or more patterns; and updating a pattern tracking database with information pertaining to at least one pattern in the one or more patterns generated as a result of the decomposition.Type: GrantFiled: September 20, 2017Date of Patent: August 28, 2018Assignee: Anchor Semiconductor Inc.Inventors: Khurram Zafar, Chenmin Hu, Ye Chen, Yue Ma, Chingyun Hsiang, Justin Chen, Raymond Xu, Abhishek Vikram, Ping Zhang
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Publication number: 20180033132Abstract: Tracking patterns during a semiconductor fabrication process includes: obtaining an image of a portion of a fabricated device; extracting contours of the portion of the fabricated device from the obtained image; aligning the extracted contour to a matching section of a reference design; decomposing the matching section of the reference design into one or more patterns; and updating a pattern tracking database with information pertaining to at least one pattern in the one or more patterns generated as a result of the decomposition.Type: ApplicationFiled: September 20, 2017Publication date: February 1, 2018Inventors: Khurram Zafar, Chenmin Hu, Ye Chen, Yue Ma, Chingyun Hsiang, Justin Chen, Raymond Xu, Abhishek Vikram, Ping Zhang
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Patent number: 9846934Abstract: Tracking patterns during a semiconductor fabrication process includes: obtaining an image of a portion of a fabricated device; extracting contours of the portion of the fabricated device from the obtained image; aligning the extracted contour to a matching section of a reference design; decomposing the matching section of the reference design into one or more patterns; and updating a pattern tracking database with information pertaining to at least one pattern in the one or more patterns generated as a result of the decomposition.Type: GrantFiled: March 10, 2016Date of Patent: December 19, 2017Assignee: Anchor Semiconductor Inc.Inventors: Khurram Zafar, Chenmin Hu, Ye Chen, Yue Ma, Chingyun Hsiang, Justin Chen, Raymond Xu, Abhishek Vikram, Ping Zhang
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Publication number: 20160300338Abstract: Tracking patterns during a semiconductor fabrication process includes: obtaining an image of a portion of a fabricated device; extracting contours of the portion of the fabricated device from the obtained image; aligning the extracted contour to a matching section of a reference design; decomposing the matching section of the reference design into one or more patterns; and updating a pattern tracking database with information pertaining to at least one pattern in the one or more patterns generated as a result of the decomposition.Type: ApplicationFiled: March 10, 2016Publication date: October 13, 2016Inventors: Khurram Zafar, Chenmin Hu, Ye Chen, Yue Ma, Chingyun Hsiang, Justin Chen, Raymond Xu, Abhishek Vikram, Ping Zhang
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Publication number: 20120259574Abstract: An integrated-circuit yield improvement system includes a global signature analysis/grouping module configured to receive an integrated circuit (IC) design and identify areas in the IC design that include potential defect signatures based on the defect signatures stored in the defect signature library. The global signature analysis/grouping module can produce a global signature map indicating these areas and their associated potential defect signatures in the IC design. A local signature analysis/grouping module can identify and group local defect signatures in the IC design with the process monitoring and yield data as input, to output grouped local signatures. An intelligent learning engine can analyze the global signature map and the grouped local signatures and update some of the defect signatures in the defect signature library. A feedback loop is formed to update and renew the contents of the defect signature library for each new IC design while process and yield are improved.Type: ApplicationFiled: April 5, 2011Publication date: October 11, 2012Inventors: Chenmin Hu, Bo Su, Ping Zhang, Yuan Xu, Qing Zhang