Patents by Inventor Chentar WU

Chentar WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11508675
    Abstract: A semiconductor package structure having an antenna module includes: a substrate, having a first surface and a second surface; a semiconductor chip, disposed on the first surface; a plastic packaging material layer, formed on the first surface, where the plastic packaging material layer wraps the semiconductor chip and exposes a part of a front surface of the semiconductor chip; a rewiring layer, disposed on the plastic packaging material layer and electrically connected to the semiconductor chip; a metal bump, electrically connected to the rewiring layer; and an antenna module, disposed on the second surface of the substrate.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: November 22, 2022
    Assignee: SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
    Inventors: Yenheng Chen, Chentar Wu, Chengchung Lin
  • Patent number: 11121065
    Abstract: The present application provides a semiconductor packaging structure with an antenna assembly, including: a substrate with through-substrate-via holes; a rewiring layer, located on the substrate; metal bumps, located on and electrically connected to the rewiring layer; a semiconductor chip, located on a surface of the rewiring layer and electrically connected to the rewiring layer; a conductive column, filling in the via hole; a bottom filling layer filling up a gap between the semiconductor chip and the rewiring layer; a polymer layer surrounding the metal bumps and the semiconductor chip; and an antenna assembly, which is electrically connected to one metal bump through the conductive column and the rewiring layer. By using the foregoing solution, the rewiring layer and the metal bumps facilitate proper packaging design.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: September 14, 2021
    Assignee: SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
    Inventors: Yenheng Chen, Chentar Wu, Chengchung Lin
  • Publication number: 20190198973
    Abstract: A semiconductor package structure having an antenna module includes: a substrate, having a first surface, a second surface, and at least one via hole made by a laser running through the substrate; a rewiring layer, disposed on the first surface of the substrate; metal bumps, disposed on the rewiring layer and electrically connected to the rewiring layer; a semiconductor chip, disposed on and electrically connected to the rewiring layer; a conductive column, filling the via hole, and an antenna module, disposed on the second surface of the substrate and electrically connected to the metal bumps through the conductive column and the rewiring layer.
    Type: Application
    Filed: December 26, 2018
    Publication date: June 27, 2019
    Inventors: Yenheng CHEN, Chentar WU, Chengchung LIN
  • Publication number: 20190198434
    Abstract: The present application provides a semiconductor packaging structure with an antenna assembly, including: a substrate with through-substrate-via holes; a rewiring layer, located on the substrate; metal bumps, located on and electrically connected to the rewiring layer; a semiconductor chip, located on a surface of the rewiring layer and electrically connected to the rewiring layer; a conductive column, filling in the via hole; a bottom filling layer filling up a gap between the semiconductor chip and the rewiring layer; a polymer layer surrounding the metal bumps and the semiconductor chip; and an antenna assembly, which is electrically connected to one metal bump through the conductive column and the rewiring layer. By using the foregoing solution, the rewiring layer and the metal bumps facilitate proper packaging design.
    Type: Application
    Filed: December 26, 2018
    Publication date: June 27, 2019
    Inventors: Yenheng CHEN, Chentar WU, Chengchung LIN
  • Publication number: 20190198466
    Abstract: A semiconductor package structure having an antenna module includes: a substrate, having a first surface and a second surface; a semiconductor chip, disposed on the first surface; a plastic packaging material layer, formed on the first surface, where the plastic packaging material layer wraps the semiconductor chip and exposes a part of a front surface of the semiconductor chip; a rewiring layer, disposed on the plastic packaging material layer and electrically connected to the semiconductor chip; a metal bump, electrically connected to the rewiring layer; and an antenna module, disposed on the second surface of the substrate.
    Type: Application
    Filed: December 26, 2018
    Publication date: June 27, 2019
    Inventors: Yenheng CHEN, Chentar WU, Chengchung LIN
  • Publication number: 20190198972
    Abstract: A semiconductor package structure having an antenna module includes: a substrate, having at least one via hole running through the substrate; a rewiring layer, disposed on a surface of the substrate; a metal bump, disposed on and electrically connected to the rewiring layer; a semiconductor chip, disposed on and electrically connected to the rewiring layer; a conductive column, filling the via hole; a plastic packaging material layer, surrounding the metal bump and the semiconductor chip; and an antenna module, electrically connected to the metal bump through the conductive column and the rewiring layer.
    Type: Application
    Filed: December 26, 2018
    Publication date: June 27, 2019
    Inventors: Yenheng CHEN, Chentar WU, Chengchung LIN
  • Publication number: 20190181536
    Abstract: The present disclosure provides a semiconductor structure with an antenna and a method making the same. The semiconductor structure has an antenna substrate with a first surface and a second surface opposite to the first surface; an antenna module disposed on the first surface of the antenna substrate; and a redistribution layer disposed on the second surface of the antenna substrate. The semiconductor structure with the antenna according to the present application provides the antenna module and the redistribution layer on two opposite surfaces of the antenna substrate, the material of the antenna substrate for supporting the antenna module can be selected according to actual needs, to provide more options. Signal loss can be reduced through the selection of the antenna substrate; the redistribution layer is provided on the surface of the antenna substrate for bonding the semiconductor chips.
    Type: Application
    Filed: December 6, 2018
    Publication date: June 13, 2019
    Inventors: Yenheng CHEN, Chentar WU, Jangshen LIN, Chengchung LIN
  • Publication number: 20190181085
    Abstract: The present application provides a fan-out semiconductor packaging structure with an antenna module and a method making the same. The fan-out semiconductor packaging structure with the antenna module comprises: a semiconductor chip; a plastic packaging material layer enclosing a periphery of the semiconductor chip; a filling structure disposed in the plastic packaging material layer and disposed on the periphery of the semiconductor chip, a loss caused by the filling structure to an antenna signal is smaller than a loss caused by the plastic packaging material layer to an antenna signal; an antenna module disposed on the first surface of the plastic packaging material layer, an orthographic projection of the antenna module on the filling structure is disposed on the filling structure; a redistribution layer disposed on the second surface of the plastic packaging material layer; and a solder bump disposed on a surface of the redistribution layer.
    Type: Application
    Filed: December 6, 2018
    Publication date: June 13, 2019
    Inventors: Yenheng CHEN, Chentar WU, Jangshen LIN, Chengchung LIN