Abstract: The present application discloses a conversion apparatus from a chip package to a waveguide, a radio frequency apparatus and a radar apparatus. The conversion apparatus includes: a first metal layer as a metal ground layer, a second metal layer, a third metal layer, a shielding metallization via, a conversion via, and a dielectric substrate disposed between different metal layers to function as a support; the second metal layer is configured to lay an RF trace; the third metal layer is configured to dispose a patch element; a capacitance formed between the RF trace and patch element introduces capacitance characteristic; multiple shielding metallization vias are ground vias around the patch element and RF trace for guiding RF signal propagation; at least one conversion metallization via is disposed on one end of the RF trace close to the patch element, for connecting the RF trace and patch element and introducing inductance characteristic.

Abstract: A microstrip antenna, an antenna array, a radar, and a vehicle are provided. The microstrip antenna includes: a dielectric layer, and a metal layer and a ground plane layer disposed at two sides of the dielectric layer, wherein the metal layer includes a first radiation patch and a feeding portion; a length of a long side edge of the first radiation patch is determined based on an operating wavelength of the microstrip antenna, and a length of a short side edge of the first radiation patch is smaller than the length of the long side edge; the feeding portion is coupled between a center position of the long side edge of the first radiation patch and a short side edge, and the feeding portion is configured to transmit a high frequency signal to the first radiation patch or to transmit a space radiation signal received by the first radiation patch.

Abstract: The present application discloses a conversion apparatus from a chip package to a waveguide, a radio frequency apparatus and a radar apparatus. The conversion apparatus includes: a first metal layer as a metal ground layer, a second metal layer, a third metal layer, a shielding metallization via, a conversion via, and a dielectric substrate disposed between different metal layers to function as a support; the second metal layer is configured to lay an RF trace; the third metal layer is configured to dispose a patch element; a capacitance formed between the RF trace and patch element introduces capacitance characteristic; multiple shielding metallization vias are ground vias around the patch element and RF trace for guiding RF signal propagation; at least one conversion metallization via is disposed on one end of the RF trace close to the patch element, for connecting the RF trace and patch element and introducing inductance characteristic.

Abstract: An antenna module includes a first antenna layer, including at least one main radiation unit including at least two main radiation patches symmetrically arranged and spaced apart from each other and at least one feeder portion located at or corresponds to a gap between adjacent two of the main radiation patches; a second antenna layer, stacked with the first antenna layer and including a reference ground arranged opposite to the main radiation patches and at least one microstrip insulated from the reference ground; at least one first electrically conductive member, electrically connected to the main radiation patches and the reference ground; and at least one second electrically conductive member, with an end being electrically connected to the feeder portion and another end being electrically connected to another end of the microstrip. An end of the microstrip is electrically connected to a radio frequency transceiver chip.

Abstract: The antenna includes: a first antenna structure extending along a first direction and having a first side and a second side. The antenna further includes multiple second antenna structures arranged along the first direction, where each of the multiple second antenna structures is connected to the first side and extends in a direction opposite to the second direction with an extension length of k1×(?/2). The antenna further includes multiple third antenna structures arranged along the first direction, where each of the multiple third antenna structures is connected to the second surface and extends along the second direction with an extension length of k2×(?/2). The multiple second antenna structures and the multiple third antenna structures are arranged alternatingly along the first direction. One of k1 and k2 is a positive integer greater than 1, and the other is a positive integer greater than or equal to 1.

Abstract: A microstrip antenna, an antenna array, a radar, and a vehicle are provided. The microstrip antenna includes: a dielectric layer, and a metal layer and a ground plane layer disposed at two sides of the dielectric layer, wherein the metal layer includes a first radiation patch and a feeding portion; a length of a long side edge of the first radiation patch is determined based on an operating wavelength of the microstrip antenna, and a length of a short side edge of the first radiation patch is smaller than the length of the long side edge; the feeding portion is coupled between a center position of the long side edge of the first radiation patch and a short side edge, and the feeding portion is configured to transmit a high frequency signal to the first radiation patch or to transmit a space radiation signal received by the first radiation patch.

Abstract: An antenna module includes a first antenna layer, including at least one main radiation unit including at least two main radiation patches symmetrically arranged and spaced apart from each other and at least one feeder portion located at or corresponds to a gap between adjacent two of the main radiation patches; a second antenna layer, stacked with the first antenna layer and including a reference ground arranged opposite to the main radiation patches and at least one microstrip insulated from the reference ground; at least one first electrically conductive member, electrically connected to the main radiation patches and the reference ground; and at least one second electrically conductive member, with an end being electrically connected to the feeder portion and another end being electrically connected to another end of the microstrip. An end of the microstrip is electrically connected to a radio frequency transceiver chip.

Abstract: An antenna module and an electronic device are provided. The antenna module includes multiple antenna units arranged in an array. Each antenna unit includes a first main patch, at least one first sub-patch, a second main patch, and at least one second sub-patch. The first sub-patch and the first main patch are spaced apart from each other. The first main patch is configured to generate a first radio frequency (RF) signal, and the first RF signal is coupled to the first sub-patch, so that the first main patch and the first sub-patch jointly radiate an RF signal of a first frequency band.