Abstract: A vapor chamber includes a housing, a capillary structure, and a working fluid. Both the capillary structure and the working fluid are located in the housing. An area of a surface of the capillary structure in contact with an inner surface of the housing is less than an area of the inner surface. The housing has a cavity. The working fluid in a liquid state is located in the capillary structure. The working fluid in a gaseous state is located in the cavity. The housing includes a first region and a second region. The capillary structure includes a first part located in the first region and a second part located in the second region. The second part includes a trunk structure and a branch structure.

Abstract: A liquid cooling structure is provided. The structure includes a liquid storage portion, a condenser, a liquid return channel and a liquid cooling portion having a liquid storage cavity configured to store a liquid state cooling medium. The liquid cooling portion includes a spraying member and a sealing member having a first sealed cavity configured to accommodate a to-be-cooled member, the spraying member communicates with the liquid storage cavity, and is configured to spray the cooling medium onto the to-be-cooled member. The condenser communicates with the first sealed cavity and the liquid storage cavity, and is configured to cool the gaseous state cooling medium to form the cooling medium in the liquid state. The liquid return channel communicates with the first sealed cavity and the liquid storage cavity, and is configured to transfer the liquid state cooling medium in the first sealed cavity to the liquid storage cavity.