Abstract: A method where deviations of a characteristic of an image simulated by two different process models or deviations of the characteristic simulated by a process model and measured by a metrology tool, are used for various purposes such as to reduce the calibration time, improve the accuracy of the model, and improve the overall manufacturing process.

Abstract: A method for determining a control parameter for an apparatus used in a semiconductor manufacturing process, the method including: obtaining performance data associated with a substrate subject to the semiconductor manufacturing process; obtaining die specification data including values of an expected yield of one or more dies on the substrate based on the performance data and/or a specification for the performance data; and determining the control parameter in dependence on the performance data and the die specification data. Advantageously, the efficiency and/or accuracy of processes is improved by determining how to perform the processes in dependence on dies within specification.

Abstract: A method of generating a characteristic pattern for a patterning process and training a machine learning model. The method for generating the characteristic pattern includes obtaining a trained generator model configured to generate a characteristic pattern (e.g., a hot spot pattern), and an input pattern; and generating, via simulation using the trained generator model (e.g., CNN), the characteristic pattern based on the input pattern, wherein the input pattern can be a random vector and/or a class of pattern.

Abstract: A method and associated computer program for predicting an electrical characteristic of a substrate subject to a process. The method includes determining a sensitivity of the electrical characteristic to a process characteristic, based on analysis of electrical metrology data including electrical characteristic measurements from previously processed substrates and of process metrology data including measurements of at least one parameter related to the process characteristic measured from the previously processed substrates; obtaining process metrology data related to the substrate describing the at least one parameter; and predicting the electrical characteristic of the substrate based on the sensitivity and the process metrology data.

Abstract: A method and associated computer program for predicting an electrical characteristic of a substrate subject to a process. The method includes determining a sensitivity of the electrical characteristic to a process characteristic, based on analysis of electrical metrology data including electrical characteristic measurements from previously processed substrates and of process metrology data including measurements of at least one parameter related to the process characteristic measured from the previously processed substrates; obtaining process metrology data related to the substrate describing the at least one parameter; and predicting the electrical characteristic of the substrate based on the sensitivity and the process metrology data.

Abstract: A method for determining a control parameter for an apparatus used in a semiconductor manufacturing process, the method including: obtaining performance data associated with a substrate subject to the semiconductor manufacturing process; obtaining die specification data including values of an expected yield of one or more dies on the substrate based on the performance data and/or a specification for the performance data; and determining the control parameter in dependence on the performance data and the die specification data Advantageously, the efficiency and/or accuracy of processes is improved by determining how to perform the processes in dependence on dies within specification.

Abstract: Substrates to be processed are partitioned based on pre-processing data that is associated with substrates before a process step. The data is partitioned using a partition rule and the substrates are partitioned into subsets in accordance with subsets of the data obtained by the partitioning. Corrections are applied, specific to each subset. The partition rule is obtained using decision tree analysis on a training set of substrates. The decision tree analysis uses pre-processing data associated with the training substrates before they were processed, and post-processing data associated with the training substrates after being subject to the process step. The partition rule that defines the decision tree is selected from a plurality of partition rules based on a characteristic of subsets of the post-processing data. The associated corrections are obtained implicitly at the same time.

Abstract: A method and associated computer program for predicting an electrical characteristic of a substrate subject to a process. The method includes determining a sensitivity of the electrical characteristic to a process characteristic, based on analysis of electrical metrology data including electrical characteristic measurements from previously processed substrates and of process metrology data including measurements of at least one parameter related to the process characteristic measured from the previously processed substrates; obtaining process metrology data related to the substrate describing the at least one parameter; and predicting the electrical characteristic of the substrate based on the sensitivity and the process metrology data.

Abstract: A method including: obtaining a portion of a design layout; determining characteristics of assist features based on the portion or characteristics of the portion; and training a machine learning model using training data including a sample whose feature vector includes the characteristics of the portion and whose label includes the characteristics of the assist features. The machine learning model may be used to determine characteristics of assist features of any portion of a design layout, even if that portion is not part of the training data.

Abstract: A method where deviations of a characteristic of an image simulated by two different process models or deviations of the characteristic simulated by a process model and measured by a metrology tool, are used for various purposes such as to reduce the calibration time, improve the accuracy of the model, and improve the overall manufacturing process.

Abstract: Methods of identifying a hot spot from a design layout or of predicting whether a pattern in a design layout is defective, using a machine learning model. An example method disclosed herein includes obtaining sets of one or more characteristics of performance of hot spots, respectively, under a plurality of process conditions, respectively, in a device manufacturing process; determining, for each of the process conditions, for each of the hot spots, based on the one or more characteristics under that process condition, whether that hot spot is defective; obtaining a characteristic of each of the process conditions; obtaining a characteristic of each of the hot spots; and training a machine learning model using a training set including the characteristic of one of the process conditions, the characteristic of one of the hot spots, and whether that hot spot is defective under that process condition.

Abstract: A computer system includes at least one processor, and a storage device coupled to at least one processor. The storage devices stores instructions that, when executed, causes the at least one processor to simulate restoration of a power grid system, to perform a frequency analysis test for the simulated restoration, and to generate a restoration plan for the power grid system based on the simulation and frequency analysis test results.

Abstract: A computer system includes at least one processor, and a storage device coupled to at least one processor. The storage devices stores instructions that, when executed, causes the at least one processor to simulate restoration of a power grid system, to perform a transient test for the simulated restoration, and to generate a restoration plan for the power grid system based on the simulation and transient test results.

Abstract: In at least some embodiments, a computer system includes a processor and a storage device coupled to the processor. The storage device stores a program that, when executed, causes the processor to simulate restoration of a power grid system and to generate a restoration plan for the power grid system based on the simulation.

Abstract: Methods for determining a predictive rating are disclosed. In an embodiment, an active user is compared to a set of clusters. One or more of the clusters are determined to be most similar to the active user. From the one or more clusters, K users are determined to be most similar to the active user. Prior ratings for an item by the K users may be used to predict a rating for the item for the active user.

Abstract: In at least some embodiments, a computer system includes a processor and a storage device coupled to the processor. The storage device stores a program that, when executed, causes the processor to simulate restoration of a power grid system and to generate a restoration plan for the power grid system based on the simulation.

Abstract: A method and system for use in information retrieval includes, for each of a plurality of terms, selecting a predetermined number of top scoring documents for the term to form a corresponding document set for the term. When a plurality of terms are received, optionally as a query, the system ranks, using an inverse document frequency algorithm, the plurality of terms for importance based on the document sets for the plurality of terms. Then a number of ranked terms are selected based on importance and a union set is formed based on the document sets associated with the selected number of ranked terms.

Abstract: A scalable two-pass scalable probabilistic latent semantic analysis (PLSA) methodology is disclosed that may perform more efficiently, and in some cases more accurately, than traditional PLSA, especially where large and/or sparse data sets are provided for analysis. The improved methodology can greatly reduce the storage and/or computational costs of training a PLSA model. In the first pass of the two-pass methodology, objects are clustered into groups, and PLSA is performed on the groups instead of the original individual objects. In the second pass, the conditional probability of a latent class, given an object, is obtained. This may be done by extending the training results of the first pass. During the second pass, the most likely latent classes for each object are identified.

Abstract: Described is an efficient retrieval mechanism that quickly locates documents (e.g., corresponding to online advertisements) based on query term discrimination. A topmost subset (e.g., two) of search terms is selected according to their ranked importance, e.g., as ranked by inverted document frequency. The topmost terms are then used to narrow the number of rows of an inverted query index that are searched to find document identifiers and associated scores, such as computed offline by a BM25 algorithm. For example, for each document identifier of each important term, a fast search within each of the narrowed subset of rows (that also contain that document identifier) may be performed by comparing document identifiers to jump a pointer within each other row, followed by a binary search to locate a particular document. The scores of the set of particular documents may then be used to rank their relative importance for returning as results.