Patents by Inventor Chenxiang Xu
Chenxiang Xu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11906879Abstract: Provided are a camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device. The molded photosensitive assembly is assembled with at least one optical lenses to form a camera module. The molded photosensitive assembly includes an imaging assembly, a molded base, and a filter member. The molded base includes a first molded portion and a second molded portion. The first molded portion embeds a part of the imaging assembly. The second molded portion is integrally formed on a first upper surface of the first molded portion, and the second molded portion has a second upper surface and a second outer side surface. A filter member is attached to the second upper surface of the second molded portion, and corresponds to a photosensitive path of the imaging assembly.Type: GrantFiled: March 2, 2020Date of Patent: February 20, 2024Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhen Huang, Zhongyu Luan, Zongchun Yang, Fengsheng Xi, Chenxiang Xu
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Patent number: 11871100Abstract: Disclosed are a camera module, a blocking-type photosensitive assembly, a manufacturing method thereof, and an electronic device. The camera module includes a blocking-type photosensitive assembly and at least one motor camera lens assembly arranged on the blocking-type photosensitive assembly. The blocking-type photosensitive assembly includes a molded photosensitive assembly and a blocking structure arranged on the molded photosensitive assembly. A blocking surface of the blocking structure is higher than an upper surface of a filter element, and at least a part of the projection of the blocking surface of the blocking structure on the molded photosensitive assembly overlaps with the projection of an optical lens of the motor camera lens assembly on the molded photosensitive assembly to block the optical lens from directly contacting the filter element.Type: GrantFiled: March 2, 2020Date of Patent: January 9, 2024Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhen Huang, Zhongyu Luan, Zongchun Yang, Lifeng Kan, Chenxiang Xu
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Publication number: 20230328350Abstract: A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.Type: ApplicationFiled: May 31, 2023Publication date: October 12, 2023Inventors: Zhen HUANG, Qimin MEI, Bojie ZHAO, Zhewen MEI, Li LIU, Jiawei CHEN, Chenxiang XU
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Patent number: 11758255Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.Type: GrantFiled: May 23, 2022Date of Patent: September 12, 2023Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhen Huang, Qimin Mei, Bojie Zhao, Zhewen Mei, Li Liu, Jiawei Chen, Zongchun Yang, Chenxiang Xu
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Patent number: 11706514Abstract: A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.Type: GrantFiled: November 9, 2022Date of Patent: July 18, 2023Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhen Huang, Qimin Mei, Bojie Zhao, Zhewen Mei, Li Liu, Jiawei Chen, Chenxiang Xu
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Publication number: 20230060371Abstract: A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.Type: ApplicationFiled: November 9, 2022Publication date: March 2, 2023Inventors: Zhen HUANG, Qimin MEI, Bojie ZHAO, Zhewen MEI, Li LIU, Jiawei CHEN, Chenxiang XU
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Publication number: 20220360694Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.Type: ApplicationFiled: May 23, 2022Publication date: November 10, 2022Inventors: Zhen HUANG, Qimin MEI, Bojie ZHAO, Zhewen MEI, Li LIU, Jiawei CHEN, Zongchun YANG, Chenxiang XU
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Patent number: 11412116Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.Type: GrantFiled: March 9, 2021Date of Patent: August 9, 2022Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhen Huang, Qimin Mei, Bojie Zhao, Zhewen Mei, Li Liu, Jiawei Chen, Zongchun Yang, Chenxiang Xu
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Patent number: 11412117Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.Type: GrantFiled: March 9, 2021Date of Patent: August 9, 2022Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhen Huang, Qimin Mei, Bojie Zhao, Zhewen Mei, Li Liu, Jiawei Chen, Zongchun Yang, Chenxiang Xu
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Publication number: 20220201169Abstract: Disclosed are a camera module, a blocking-type photosensitive assembly, a manufacturing method thereof, and an electronic device. The camera module includes a blocking-type photosensitive assembly and at least one motor camera lens assembly arranged on the blocking-type photosensitive assembly. The blocking-type photosensitive assembly includes a molded photosensitive assembly and a blocking structure arranged on the molded photosensitive assembly. A blocking surface of the blocking structure is higher than an upper surface of a filter element, and at least a part of the projection of the blocking surface of the blocking structure on the molded photosensitive assembly overlaps with the projection of an optical lens of the motor camera lens assembly on the molded photosensitive assembly to block the optical lens from directly contacting the filter element.Type: ApplicationFiled: March 2, 2020Publication date: June 23, 2022Applicant: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhen HUANG, Zhongyu LUAN, Zongchun YANG, Lifeng KAN, Chenxiang XU
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Publication number: 20220179288Abstract: Provided are a camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device. The molded photosensitive assembly is assembled with at least one optical lenses to form a camera module. The molded photosensitive assembly includes an imaging assembly, a molded base, and a filter member. The molded base includes a first molded portion and a second molded portion. The first molded portion embeds a part of the imaging assembly. The second molded portion is integrally formed on a first upper surface of the first molded portion, and the second molded portion has a second upper surface and a second outer side surface. A filter member is attached to the second upper surface of the second molded portion, and corresponds to a photosensitive path of the imaging assembly.Type: ApplicationFiled: March 2, 2020Publication date: June 9, 2022Applicant: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhen HUANG, Zhongyu LUAN, Zongchun YANG, Fengsheng XI, Chenxiang XU
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Publication number: 20210321025Abstract: A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.Type: ApplicationFiled: July 10, 2019Publication date: October 14, 2021Inventors: Zhen HUANG, Qimin MEI, Bojie ZHAO, Zhewen MEI, Li LIU, Jiawei CHEN, Chenxiang XU
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Publication number: 20210250477Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.Type: ApplicationFiled: March 9, 2021Publication date: August 12, 2021Inventors: Zhen HUANG, Qimin MEI, Bojie ZHAO, Zhewen MEI, Li LIU, Jiawei CHEN, Zongchun YANG, Chenxiang XU
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Publication number: 20210195074Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.Type: ApplicationFiled: March 9, 2021Publication date: June 24, 2021Inventors: Zhen HUANG, Qimin MEI, Bojie ZHAO, Zhewen MEI, Li LIU, Jiawei CHEN, Zongchun YANG, Chenxiang XU
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Publication number: 20210185804Abstract: The present disclosure provides a circuit board assembly, a TOF camera module including the circuit board assembly and applications thereof. The circuit board assembly is used to support an electronic component, and includes a conductive portion and an insulating portion. The insulating portion is integrally bonded to the conductive portion, and the conductive portion extends through the insulating portion. The electronic component is supported by the conductive portion and is communicated with the conductive portion, so that the electronic component directly dissipates heat through the conductive portion during operation.Type: ApplicationFiled: February 23, 2021Publication date: June 17, 2021Inventors: Zhen HUANG, Junjie ZENG, Chenxiang XU, Feifan CHEN
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Patent number: 10986257Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.Type: GrantFiled: August 21, 2019Date of Patent: April 20, 2021Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhen Huang, Qimin Mei, Bojie Zhao, Zhewen Mei, Li Liu, Jiawei Chen, Zongchun Yang, Chenxiang Xu
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Publication number: 20200084349Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.Type: ApplicationFiled: August 21, 2019Publication date: March 12, 2020Inventors: Zhen Huang, Qimin Mei, Bojie Zhao, Zhewen Mei, Li Liu, Jiawei Chen, Zongchun Yang, Chenxiang Xu
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Patent number: D909432Type: GrantFiled: April 17, 2019Date of Patent: February 2, 2021Inventors: Chenxiang Xu, Shun Li