Patents by Inventor Chenyang HE

Chenyang HE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic element, circuit board with electronic element, and electronic device
    Patent number: 12382574
    Abstract: An electronic element includes a substrate, a first input pad on a first surface of the substrate, at least one chip on the first surface of the substrate, and a first output pad on the first surface of the substrate. The first input pad, the at least one chip, and the first output pad are sequentially connected. The first input pad and the first output pad are in direct physical contact with the first surface of the substrate. A surface of the first input pad facing away from the substrate and a surface of the first output pad facing away from the substrate constitute a partial area of an outer surface of the electronic element.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: August 5, 2025
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Chenyang He, Ruiming Mo, Jie Sun
  • ELECTRONIC ELEMENT, CIRCUIT BOARD WITH ELECTRONIC ELEMENT, AND ELECTRONIC DEVICE
    Publication number: 20220304138
    Abstract: An electronic element, a circuit board with an electronic element, and an electronic device are provided. The electronic element includes a substrate and a first input pad, at least one chip, and a first output pad that are disposed on a first surface of the substrate, where the first input pad, the at least one chip, and the first output pad are sequentially connected, the first input pad and the first output pad are directly disposed on the first surface of the substrate, and a surface of the first input pad facing away from the substrate and a surface of the first output pad facing away from the substrate constitute a partial area of an outer surface of the electronic element.
    Type: Application
    Filed: June 10, 2022
    Publication date: September 22, 2022
    Inventors: Chenyang HE, Ruiming MO, Jie SUN