Patents by Inventor Chenyang PENG

Chenyang PENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250093547
    Abstract: The embodiment of the present disclosure provides a method and a device for fine reconstruction of a sedimentation structure of a flume. The device includes: a combined bottom plate and a combined freezing flume, wherein the combined bottom plate is formed by tiling and splicing a plurality of equal-thickness and rectangular basic bottom plates, a splicing gap is located between adjacent basic bottom plates, the splicing gap is filled with elastic adhesive, and the filled splicing gap is as thick as the basic bottom plates; the combined freezing flume includes a plurality of local freezing flumes; and each of the basic bottom plates has a local freezing flume that matches the basic bottom plate.
    Type: Application
    Filed: November 28, 2024
    Publication date: March 20, 2025
    Applicants: CHINA UNIVERSITY OF PETROLEUM (EAST CHINA), SHANDONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Mingming TANG, Huifang MA, Rong XIE, Ruifeng HONG, Chenyang PENG
  • Patent number: 12235557
    Abstract: A displaying base plate and a manufacturing method thereof, and a displaying device. The displaying base plate includes a substrate, and a first electrode layer disposed on one side of the substrate, wherein the first electrode layer includes a first electrode pattern; a first planarization layer disposed on one side of the first electrode layer that is away from the substrate, wherein the first planarization layer is provided with a through hole, and the through hole penetrates the first planarization layer, to expose the first electrode pattern; and a second electrode layer, a second planarization layer and a third electrode layer that are disposed in stack on one side of the first planarization layer that is away from the substrate, wherein the second electrode layer is disposed closer to the substrate, the second electrode layer is connected to the first electrode pattern and the third electrode layer.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: February 25, 2025
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Zhen Zhang, Fuqiang Li, Zhenyu Zhang, Yunping Di, Lizhong Wang, Zheng Fang, Jiahui Han, Yawei Wang, Chenyang Zhang, Chengfu Xu, Ce Ning, Pengxia Liang, Feihu Zhou, Xianqin Meng, Weiting Peng, Qiuli Wang, Binbin Tong, Rui Huang, Tianmin Zhou, Wei Yang