Patents by Inventor Chenyi Cui

Chenyi Cui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flat heat pipe having a gradient wetting structure
    Patent number: 11913727
    Abstract: The present invention discloses a flat heat pipe, comprising a bottom plate, a top plate, and a support plate located between the bottom plate and the top plate; a micron-level radial strip is processed on the inner surface of the bottom plate; the inner surface of the top plate is processed with superhydrophilic and superhydrophobic radial structures arranged at intervals to transport the condensate to the direction of the surrounding pipe wall; a wick is arranged on the inner side of the support plate. The present invention has the function of pumpless directional transport of liquid and convergence of refluxed condensate; thereby improving the heat exchange performance of the entire flat heat pipe.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: February 27, 2024
    Assignee: Xi'an Jiaotong University
    Inventors: Baojin Qi, Jinjia Wei, Ya Wang, Ting Yu, Chenyi Cui
  • FLAT HEAT PIPE HAVING A GRADIENT WETTING STRUCTURE
    Publication number: 20210278141
    Abstract: The present invention discloses a flat heat pipe, comprising a bottom plate, a top plate, and a support plate located between the bottom plate and the top plate; a micron-level radial strip is processed on the inner surface of the bottom plate; the inner surface of the top plate is processed with superhydrophilic and superhydrophobic radial structures arranged at intervals to transport the condensate to the direction of the surrounding pipe wall; a wick is arranged on the inner side of the support plate. The present invention has the function of pumpless directional transport of liquid and convergence of refluxed condensate; thereby improving the heat exchange performance of the entire flat heat pipe.
    Type: Application
    Filed: May 21, 2021
    Publication date: September 9, 2021
    Inventors: Baojin Qi, Jinjia Wei, Ya Wang, Ting Yu, Chenyi Cui