Patents by Inventor Chen-Yu Huang

Chen-Yu Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240111337
    Abstract: An electronic device including a body and a receptacle connector is provided. The body has a side wall surface, a receptacle slot located at the side wall surface, a waterproof protrusion protruding from the side wall surface, and two gutters located at the side wall surface, where the waterproof protrusion is located above the receptacle slot, and the two gutters are respectively located at two opposite sides of the receptacle slot. The receptacle connector is disposed in the receptacle slot.
    Type: Application
    Filed: May 8, 2023
    Publication date: April 4, 2024
    Applicant: Acer Incorporated
    Inventors: Wei-Chih Wang, Chen-Min Hsiu, Chien-Yu Lee, Szu-Wei Yang, Fang-Ying Huang
  • Publication number: 20240096705
    Abstract: A semiconductor device includes a plurality of channel layers vertically separated from one another. The semiconductor device also includes an active gate structure comprising a lower portion and an upper portion. The lower portion wraps around each of the plurality of channel layers. The semiconductor device further includes a gate spacer extending along a sidewall of the upper portion of the active gate structure. The gate spacer has a bottom surface. Moreover, a dummy gate dielectric layer is disposed between the gate spacer and a topmost channel layer of plurality of channel layers. The dummy gate dielectric layer is in contact with a top surface of the topmost channel layer, the bottom surface of the gate spacer, and the sidewall of the gate structure.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuei-Yu Kao, Chen-Yui Yang, Hsien-Chung Huang, Chao-Cheng Chen, Shih-Yao Lin, Chih-Chung Chiu, Chih-Han Lin, Chen-Ping Chen, Ke-Chia Tseng, Ming-Ching Chang
  • Publication number: 20240097035
    Abstract: Epitaxial source/drain structures for enhancing performance of multigate devices, such as fin-like field-effect transistors (FETs) or gate-all-around (GAA) FETs, and methods of fabricating the epitaxial source/drain structures, are disclosed herein. An exemplary device includes a dielectric substrate. The device further includes a channel layer, a gate disposed over the channel layer, and an epitaxial source/drain structure disposed adjacent to the channel layer. The channel layer, the gate, and the epitaxial source/drain structure are disposed over the dielectric substrate. The epitaxial source/drain structure includes an inner portion having a first dopant concentration and an outer portion having a second dopant concentration that is less than the first dopant concentration. The inner portion physically contacts the dielectric substrate, and the outer portion is disposed between the inner portion and the channel layer. In some embodiments, the outer portion physically contacts the dielectric substrate.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 21, 2024
    Inventors: Chen-Ming Lee, I-Wen Wu, Po-Yu Huang, Fu-Kai Yang, Mei-Yun Wang
  • Patent number: 11934027
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Publication number: 20240079358
    Abstract: Stacked semiconductor devices, and related systems and methods, are disclosed herein. In some embodiments, the stacked semiconductor device includes a package substrate and a die stack carried by the package substrate. The die stack can include at least a first semiconductor die carried by the package substrate, a second semiconductor die carried by the first semiconductor die. The first semiconductor die can have an upper surface and a first bond pad carried by the upper surface that includes a curvilinear concave depression formed in an uppermost surface of the first bond pad. The second semiconductor die has a lower surface and a second bond pad carried by the lower surface. The die stack can also include solder structure electrically coupling the first and second bond pads and at least partially filling the curvilinear concave depression formed in the uppermost surface of the first bond pad.
    Type: Application
    Filed: September 7, 2022
    Publication date: March 7, 2024
    Inventors: Siva Sai Kishore Palli, Venkata Rama Satya Pradeep Vempaty, Wen How Sim, Chen Yu Huang, Harjashan Veer Singh
  • Publication number: 20240071977
    Abstract: A semiconductor package having a fillet is provided. The semiconductor package includes a trace disposed within a solder mask that has a top surface. A first die is over the solder mask and mechanically couples with the trace. A first adhesive is between the trace and the first die where sides of the first die and the first adhesive define a die edge. The semiconductor package includes a fillet adjacent the die edge and a second die above the first die. The semiconductor package also includes a second adhesive having a bottom surface where the second adhesive is between the first die and the second die. The solder mask top surface, the first die surface, and the second adhesive bottom surface define a cavity where the fillet is within the cavity at the die edge.
    Type: Application
    Filed: August 30, 2022
    Publication date: February 29, 2024
    Inventors: Chen Yu Huang, Chong Leong Gan
  • Patent number: 11917923
    Abstract: A magnetoresistive random access memory (MRAM) structure, including a substrate and multiple MRAM cells on the substrate, wherein the MRAM cells are arranged in a memory region adjacent to a logic region. An ultra low-k (ULK) layer covers the MRAM cells, wherein the surface portion of ultra low-k layer is doped with fluorine, and dents are formed on the surface of ultra low-k layer at the boundaries between the memory region and the logic region.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: February 27, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Ching-Hua Hsu, Si-Han Tsai, Shun-Yu Huang, Chen-Yi Weng, Ju-Chun Fan, Che-Wei Chang, Yi-Yu Lin, Po-Kai Hsu, Jing-Yin Jhang, Ya-Jyuan Hung
  • Patent number: 11840656
    Abstract: The disclosure provides a forming method of a halogen-free flame-retardant material. The method includes the followings. A twin-screw extruder including a first zone and a second zone is used. A mixture in the first zone is mixed, melted and heated to form a molten mixture. The mixture includes a halogen-free flame retardant, a wear-resistant modifier, a thermoplastic elastomer, and an antioxidant. In addition, a silane-modified nano-silica aqueous suspension is introduced into the second zone to mix the silane-modified nano-silica aqueous suspension with the molten mixture from the first zone. The first zone and the second zone are continuously connected regions.
    Type: Grant
    Filed: November 5, 2021
    Date of Patent: December 12, 2023
    Assignee: Industrial Technology Research Institute
    Inventors: Wen-Chung Liang, Chi-Lang Wu, Chen-Yu Huang
  • Publication number: 20230348673
    Abstract: The present disclosure provides a toughened resin composition, which includes: (A) a toughened and modified compound, which includes a styrene maleic anhydride compound, an anhydride grafted olefin polymer, and a diisocyanate compound; (B) a thermosetting polymer; and (C) a toughening resin; wherein, in the toughened and modified compound, the diisocyanate compound forms a polyimide bond with the styrene maleic anhydride compound and the anhydride grafted olefin polymer, respectively. The present disclosure has high toughness and excellent mechanical properties; thus, it may have a wide range of applications in the fields of electronics, aerospace and the like.
    Type: Application
    Filed: October 12, 2022
    Publication date: November 2, 2023
    Inventors: Sheng-Yen WU, Po-Hsun LEE, Chun-Ming CHIU, Wen-Pin SU, Jui-Teng HSU, Chen-Yu HUANG, Chun-Han LIN
  • Publication number: 20230145884
    Abstract: The disclosure provides a forming method of a halogen-free flame-retardant material. The method includes the followings. A twin-screw extruder including a first zone and a second zone is used. A mixture in the first zone is mixed, melted and heated to form a molten mixture. The mixture includes a halogen-free flame retardant, a wear-resistant modifier, a thermoplastic elastomer, and an antioxidant. In addition, a silane-modified nano-silica aqueous suspension is introduced into the second zone to mix the silane-modified nano-silica aqueous suspension with the molten mixture from the first zone. The first zone and the second zone are continuously connected regions.
    Type: Application
    Filed: November 5, 2021
    Publication date: May 11, 2023
    Applicant: Industrial Technology Research Institute
    Inventors: Wen-Chung Liang, Chi-Lang Wu, Chen-Yu Huang
  • Patent number: 11289346
    Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: March 29, 2022
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chen-Yu Huang, Chee-Key Chung, Chang-Fu Lin, Kong-Toon Ng, Rui-Feng Tai, Bo-Hao Ma
  • Patent number: 11017083
    Abstract: Provided are systems, methods, and media for multiphase graph partitioning for malware entity detection. An example method includes receiving an input string associated with the malware entity. A determination is made as to whether the input string includes a symbolic word, a non-symbolic word, a symbolic phrase, or a non-symbolic phrase. A branching graph is formed based on a combination of the input string and a plurality of stored strings that are each associated with the malware entity to determine whether the input string is a valid detection name of the malware entity, in which the branching graph is formed by at least performing a first graph partitioning stage and a second graph partitioning stage. The input string is then labeled based on the formed branching graph and then outputted to a malware detection engine.
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: May 25, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Ci-Hao Wu, Ying-Chen Yu, June-Ray Lin, Hsieh-Lung Yang, Chen-Yu Huang, Chia-Heng Lin, Kuei-Ching Lee
  • Patent number: 10922366
    Abstract: A method, computer system, and a computer program product for crawling and extracting main content from a web page is provided. The present invention may include retrieving a HTML document associated with a web page. The present invention may then include identifying at least one entry point located in the retrieved HTML document by utilizing a self-adaptive entry point locator. The present invention may also include extracting a main content article associated with the retrieved HTML document based on the identified at least one entry point. The present invention may further include presenting the extracted main content associated with the retrieved HTML document to the user.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: February 16, 2021
    Assignee: International Business Machines Corporation
    Inventors: Chen-Yu Huang, Sheng-Wei Lee, June-Ray Lin, Ci-Hao Wu, Hsieh-Lung Yang, Ying-Chen Yu
  • Publication number: 20200335447
    Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.
    Type: Application
    Filed: July 2, 2020
    Publication date: October 22, 2020
    Inventors: Chen-Yu Huang, Chee-Key Chung, Chang-Fu Lin, Kong-Toon Ng, Rui-Feng Tai, Bo-Hao Ma
  • Patent number: 10762155
    Abstract: A method, computer program product, and computing system device for receiving, on a computing device, a plurality of webpages. At least one webpage may be filtered from the plurality of webpages into at least one set of webpages using a decision tree algorithm. At least one remaining webpage may be filtered from the plurality of webpages into the at least one set of webpages using a supported vector machine (SVM) algorithm.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: September 1, 2020
    Assignee: International Business Machines Corporation
    Inventors: June-Ray Lin, Curtis CH Wei, Hsieh-Lung Yang, Ying-Chen Yu, Chia-Heng Lin, Ci-Hao Wu, Chen-Yu Huang, Kuei-Ching Lee
  • Patent number: 10741500
    Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.
    Type: Grant
    Filed: May 4, 2018
    Date of Patent: August 11, 2020
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chen-Yu Huang, Chee-Key Chung, Chang-Fu Lin, Kong-Toon Ng, Rui-Feng Tai, Bo-Hao Ma
  • Publication number: 20200125681
    Abstract: A method, computer program product, and computing system device for receiving, on a computing device, a plurality of webpages. At least one webpage may be filtered from the plurality of webpages into at least one set of webpages using a decision tree algorithm. At least one remaining webpage may be filtered from the plurality of webpages into the at least one set of webpages using a supported vector machine (SVM) algorithm.
    Type: Application
    Filed: October 23, 2018
    Publication date: April 23, 2020
    Inventors: June-Ray Lin, Curtis CH Wei, Hsieh-Lung Yang, Ying-Chen Yu, Chia-Heng Lin, Ci-Hao Wu, Chen-Yu Huang, Kuei-Ching Lee
  • Publication number: 20200125727
    Abstract: Provided are systems, methods, and media for multiphase graph partitioning for malware entity detection. An example method includes receiving an input string associated with the malware entity. A determination is made as to whether the input string includes a symbolic word, a non-symbolic word, a symbolic phrase, or a non-symbolic phrase. A branching graph is formed based on a combination of the input string and a plurality of stored strings that are each associated with the malware entity to determine whether the input string is a valid detection name of the malware entity, in which the branching graph is formed by at least performing a first graph partitioning stage and a second graph partitioning stage. The input string is then labeled based on the formed branching graph and then outputted to a malware detection engine.
    Type: Application
    Filed: October 17, 2018
    Publication date: April 23, 2020
    Inventors: Ci-Hao Wu, Ying-Chen Yu, June-Ray Lin, Hsieh-Lung Yang, Chen-Yu Huang, Chia-Heng Lin, Kuei-Ching Lee
  • Publication number: 20190303501
    Abstract: A method, computer system, and a computer program product for crawling and extracting main content from a web page is provided. The present invention may include retrieving a HTML document associated with a web page. The present invention may then include identifying at least one entry point located in the retrieved HTML document by utilizing a self-adaptive entry point locator. The present invention may also include extracting a main content article associated with the retrieved HTML document based on the identified at least one entry point. The present invention may further include presenting the extracted main content associated with the retrieved HTML document to the user.
    Type: Application
    Filed: March 27, 2018
    Publication date: October 3, 2019
    Inventors: Chen-Yu Huang, Sheng-Wei Lee, June-Ray Lin, Ci-Hao Wu, Hsieh-Lung Yang, Ying-Chen Yu
  • Publication number: 20190237374
    Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.
    Type: Application
    Filed: May 4, 2018
    Publication date: August 1, 2019
    Inventors: Chen-Yu Huang, Chee-Key Chung, Chang-Fu Lin, Kong-Toon Ng, Rui-Feng Tai, Bo-Hao Ma