Abstract: A compound of formula (1), wherein R1, R2, R3 are defined in the disclosure. The compound of formula (1) is used as a catalyst for lactide polymerization to reduce the temperature and the time of the polymerization reaction, thereby producing polylactic acid (PLA) having high molecular weight. The present invention also provides a method of preparing the compound of formula (1) and a method of synthesizing polylactic acid that is catalyzed by the compound of formula (1).

Abstract: A compound of formula (I), wherein R1R2R3 are defined in the disclosure. The compound of formula (I) is used as a catalyst for lactide polymerization to reduce the temperature and the time of the polymerization reaction, thereby producing polylactic acid (PLA) having high molecular weight. The present invention also provides a method of preparing the compound of formula (1) and a method of synthesizing polylactic acid that is catalyzed by the compound of formula (1).

Abstract: The present disclosure provides an element submount and a method for manufacturing the same. The element submount includes a substrate, a first conductive heat-dissipating layer, a second conductive heat-dissipating layer, a first heat-dissipating layer and an element bonding layer. The substrate has opposite first and second surfaces. The first conductive heat-dissipating layer is formed on the first surface. The second conductive heat-dissipating layer is formed on the first surface and separated from the first conductive heat-dissipating layer. The first heat-dissipating layer is formed on the second surface. The element bonding layer is formed on the second conductive heat-dissipating layer. By electroplating and processing techniques, the edge of one or two sides of the element bonding layer exceeds an edge of the second conductive heat-dissipating layer and partially covers a side of the second conductive heat-dissipating layer.

Abstract: A method of making a semiconductor device includes: (a) providing a semiconductor substrate that is made from a material containing an element of boron group; (b) forming on the semiconductor substrate a buffer structure that includes an aluminum nitride buffer film formed using a physical vapor deposition technique; and (c) forming on the buffer structure a semiconductor unit that includes a GaN-based epitaxial layer, the GaN-based epitaxial layer having a hexagonal crystal structure and being formed using a chemical vapor deposition technique.

Abstract: The present disclosure provides an element submount and a method for manufacturing the same. The element submount includes a substrate, a first conductive heat-dissipating layer, a second conductive heat-dissipating layer, a first heat-dissipating layer and an element bonding layer. The substrate has opposite first and second surfaces. The first conductive heat-dissipating layer is formed on the first surface. The second conductive heat-dissipating layer is formed on the first surface and separated from the first conductive heat-dissipating layer. The first heat-dissipating layer is formed on the second surface. The element bonding layer is formed on the second conductive heat-dissipating layer. By electroplating and processing techniques, the edge of one or two sides of the element bonding layer exceeds an edge of the second conductive heat-dissipating layer and partially covers a side of the second conductive heat-dissipating layer.

Abstract: A housing module having a circuit board quick-assembling function is applied to an electronic device with a circuit board having a specific height. The housing module includes a housing, an spacer and two pivoting components. The housing includes a substrate and several lateral boards. The spacer includes a main body, two pivoting portions and a locking portion. The pivoting portions are disposed on corresponding sides of the main body, the locking portion stretches from a lower side of the main body and is fixed on the circuit board via an external fixing component. The pivoting portions pass through the lateral boards and are connected to the pivoting portions. While the circuit board slides relative to the substrate to push the spacer, the main body is rotated inside the housing via the pivoting portions to lift the lower side.

Abstract: A server includes a case and function modules. The case includes a frame, a first upright partition and a second upright partition. The frame has an internal space and an opening. The opening corresponds to the internal space. The first upright partition and the second upright partition jointly define a first accommodating portion, a second accommodating portion and a third accommodating portion in the internal space. Each of the function modules is a first function module, a second function module or a third function module. A width of the first function module is half of the width of the second accommodating portion. The width of the first function module, a width of the second function module and a width of the third function module have a ratio of 1:2:4.

Abstract: A housing module having a circuit board quick-assembling function is applied to an electronic device with a circuit board having a specific height. The housing module includes a housing, an spacer and two pivoting components. The housing includes a substrate and several lateral boards. The spacer includes a main body, two pivoting portions and a locking portion. The pivoting portions are disposed on corresponding sides of the main body, the locking portion stretches from a lower side of the main body and is fixed on the circuit board via an external fixing component. The pivoting portions pass through the lateral boards and are connected to the pivoting portions. While the circuit board slides relative to the substrate to push the spacer, the main body is rotated inside the housing via the pivoting portions to lift the lower side.

Abstract: A light guiding structure includes a resilient base and a plurality of light guiding columns. A plurality of through holes is separately formed on the resilient base. The plurality of light guiding columns resiliently engages with the plurality of through holes. Each of a plurality of light emitting components is disposed on an end of each of the plurality of the light guiding columns. The light guiding structure utilizes the plurality of light guiding columns for guiding the light transmitted from the plurality of light emitting components and further utilizes the resilient base for allowing the light transmitted from one of the plurality of light emitting components to pass through the corresponding light guiding column only. Therefore, the light transmitted from the plurality of light emitting components can be guided to a correct position, which effectively reduces human misjudgment.

Abstract: A housing module having a circuit board quick-assembling function is applied to an electronic device with a circuit board having a specific height. The housing module includes a housing, an spacer and two pivoting components. The housing includes a substrate and several lateral boards. The spacer includes a main body, two pivoting portions and a locking portion. The pivoting portions are disposed on corresponding sides of the main body, the locking portion stretches from a lower side of the main body and is fixed on the circuit board via an external fixing component. The pivoting portions pass through the lateral boards and are connected to the pivoting portions. While the circuit board slides relative to the substrate to push the spacer, the main body is rotated inside the housing via the pivoting portions to lift the lower side.

Abstract: A photosensitive adhesive is polymerized by a cinnamate monomer and a monomer A. By irradiating under different light waves, triggering reversible cyclization causes the adhesion force of the adhesive to change. The adhesion force change is repeatable. Therefore, the efficiency of the manufacture process would increase, and the cost of material would be reduced.

Abstract: A housing module having a circuit board quick-assembling function is applied to an electronic device with a circuit board having a specific height. The housing module includes a housing, an spacer and two pivoting components. The housing includes a substrate and several lateral boards. The spacer includes a main body, two pivoting portions and a locking portion. The pivoting portions are disposed on corresponding sides of the main body, the locking portion stretches from a lower side of the main body and is fixed on the circuit board via an external fixing component. The pivoting portions pass through the lateral boards and are connected to the pivoting portions. While the circuit board slides relative to the substrate to push the spacer, the main body is rotated inside the housing via the pivoting portions to lift the lower side.

Abstract: A server includes a case and function modules. The case includes a frame, a first upright partition and a second upright partition. The frame has an internal space and an opening. The opening corresponds to the internal space. The first upright partition and the second upright partition jointly define a first accommodating portion, a second accommodating portion and a third accommodating portion in the internal space. Each of the function modules is a first function module, a second function module or a third function module. A width of the first function module is half of the width of the second accommodating portion. The width of the first function module, a width of the second function module and a width of the third function module have a ratio of 1:2:4.

Abstract: A light guiding structure includes a resilient base and a plurality of light guiding columns. A plurality of through holes is separately formed on the resilient base. The plurality of light guiding columns resiliently engages with the plurality of through holes. Each of a plurality of light emitting components is disposed on an end of each of the plurality of the light guiding columns. The light guiding structure utilizes the plurality of light guiding columns for guiding the light transmitted from the plurality of light emitting components and further utilizes the resilient base for allowing the light transmitted from one of the plurality of light emitting components to pass through the corresponding light guiding column only. Therefore, the light transmitted from the plurality of light emitting components can be guided to a correct position, which effectively reduces human misjudgment.

Abstract: A method of making a semiconductor device includes: (a) providing a semiconductor substrate that is made from a material containing an element of boron group; (b) forming on the semiconductor substrate a buffer structure that includes an aluminum nitride buffer film formed using a physical vapor deposition technique; and (c) forming on the buffer structure a semiconductor unit that includes a GaN-based epitaxial layer, the GaN-based epitaxial layer having a hexagonal crystal structure and being formed using a chemical vapor deposition technique.

Abstract: An electronic device with heat dissipating function has a fixing mechanism, and the fixing mechanism includes a casing, a positioning component, a fixing component and a resilient component. The casing includes a blocking slab, lateral slabs connected with each other, and a constraining portion disposed on the lateral slabs. The positioning component is disposed inside the casing, and a fan unit is slidably disposed on the positioning component. The fixing component includes a contacting portion and a guiding portion. The guiding portion is disposed on the contacting portion, and the contacting portion is slidably disposed on the positioning component. The guiding portion can move in/out of an outlet of the casing. The resilient component is disposed on the positioning component, and pushes the contacting portion to press the fan unit onto the constraining portion.

Abstract: An electronic device with heat dissipating function has a fixing mechanism, and the fixing mechanism includes a casing, a positioning component, a fixing component and a resilient component. The casing includes a blocking slab, lateral slabs connected with each other, and a constraining portion disposed on the lateral slabs. The positioning component is disposed inside the casing, and a fan unit is slidably disposed on the positioning component. The fixing component includes a contacting portion and a guiding portion. The guiding portion is disposed on the contacting portion, and the contacting portion is slidably disposed on the positioning component. The guiding portion can move in/out of an outlet of the casing. The resilient component is disposed on the positioning component, and pushes the contacting portion to press the fan unit onto the constraining portion.

Abstract: A light source module including a light guide and a light source is provided. An end of the light guide has a light incident surface, and the other end of the light guide has at least three light-guiding branches. The light-guiding branches respectively extend along different extending directions and each light-guiding branch has a light emitting surface. The light source is adapted for providing a light beam, wherein the light beam enters the light guide through the light incident surface and the light beam exits the light guide from the light emitting surfaces.

Abstract: A light source module including a light guide and a light source is provided. An end of the light guide has a light incident surface, and the other end of the light guide has at least three light-guiding branches. The light-guiding branches respectively extend along different extending directions and each light-guiding branch has a light emitting surface. The light source is adapted for providing a light beam, wherein the light beam enters the light guide through the light incident surface and the light beam exits the light guide from the light emitting surfaces.

Abstract: An assembly includes an electronic device casing, a heat-dissipating module and a waterproofing module. The electronic device casing is formed with an encircling wall. The encircling wall has a wall body and an apertured portion formed in the wall body. The heat-dissipating module is coupled to the electronic device casing, is surrounded by the encircling wall, and includes a heat pipe extending through the apertured portion. The waterproofing module includes a waterproofing element that has a ring portion disposed on a top rim of the wall body, and a sleeve portion having a first sleeve segment that is connected to the ring portion, that is sleeved on the heat pipe and that engages the apertured portion so as to establish water tightness between the heat pipe and the apertured portion.