Abstract: An electronic apparatus with a two-way cable connection construction is provided. The electronic apparatus includes a casing kit and an electronic device. The casing kit includes a casing, a main circuit board and an auxiliary circuit board. The main circuit board and the auxiliary circuit board are disposed inside the casing. The auxiliary circuit board and the main circuit board are electrically connected to each other and non-coplanar with each other. When the electronic device is inserted into a mounting slot of the casing along a first direction, a mating electrical connector of the electronic device is connected to a first electrical connector of the auxiliary circuit board. When the electronic device is inserted into the mounting slot of the casing along a second direction opposite to the first direction, the mating electrical connector of the electronic device is connected to a second electrical connector of the auxiliary circuit board.

Abstract: An electronic apparatus with a two-way cable connection construction is provided. The electronic apparatus includes a casing kit and an electronic device. The casing kit includes a casing, a main circuit board and an auxiliary circuit board. The main circuit board and the auxiliary circuit board are disposed inside the casing. The auxiliary circuit board and the main circuit board are electrically connected to each other and non-coplanar with each other. When the electronic device is inserted into a mounting slot of the casing along a first direction, a mating electrical connector of the electronic device is connected to a first electrical connector of the auxiliary circuit board. When the electronic device is inserted into the mounting slot of the casing along a second direction opposite to the first direction, the mating electrical connector of the electronic device is connected to a second electrical connector of the auxiliary circuit board.

Abstract: A cooling and heating structure for a fiber optic transceiver is disclosed. In the cooling and heating structure, a field programmable gate array (FPGA) chip reads a temperature value of a small form-factor pluggable transceiver (SFP) cage from a sensor, a digital to analog converter (DAC) converts the temperature value into a voltage value, a processing chip converts the voltage value into an output-voltage value, and a thermoelectric cooler (TEC) adjusts a working wattage thereof according to the output-voltage value, so as to control the TEC to cool or heat the SFP cage, thereby achieving the technical effect of using the TEC to cool and heat the SFP cage to prevent link down and instability of the fiber optic transceiver during signal transmission in the high-temperature environment and the low-temperature environment from occurring.