Patents by Inventor Cheol AHN

Cheol AHN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6864177
    Abstract: A method for manufacturing of a metal line contact plug of a semiconductor device by performing a two step CMP process using (1) a first slurry solution having high etching selectivity of metal/insulating film and (2) a second slurry solution having small etching selectivity of metal/insulating film, thereby minimizing dependency on CMP devices and separating easily a metal line contact plug.
    Type: Grant
    Filed: December 26, 2002
    Date of Patent: March 8, 2005
    Assignee: Hynix Semiconductor Inc.
    Inventors: Jong Goo Jung, Ki Cheol Ahn, Pan Ki Kwon
  • Publication number: 20040253601
    Abstract: This invention comprises of construction of a recombinant CHO cell line that produces functional mannose binding lectin (MBL) and of special uses of MBL. Specially, use of MBL for development of a therapeutic agent for patients having systemic infection with viruses, bacteria, or fungus is described. More specifically, MBL as a trigger for complement activation and MBL so formulated to activate complement system for the purpose of treating patients with microbial infection.
    Type: Application
    Filed: August 15, 2003
    Publication date: December 16, 2004
    Inventors: Hong Mo Moon, Jung-Sun Yum, Byung Cheol Ahn
  • Patent number: 6788858
    Abstract: A bundle tube type optical cable is disclosed. A bundle tube type optical cable comprises: a bundle of optical fiber tubes being arranged in the middle portion of the optical cable and each containing at least two optical fiber cores loosely arranged therein; a first water-blocking layer protecting the optical fiber cores in the optical fiber tube from external moisture by a water-blocking material filled in the inner space of the tube; an inner shell made of aluminum material enclosing the bundle of optical fiber tubes with a predetermined gap; a second water-blocking layer protecting the optical fiber tubes from external moisture by the water-blocking material filled in the inner space of the inner shell; and an outer sheath made of plastic material enclosing the outer surface of the inner shell.
    Type: Grant
    Filed: November 18, 2002
    Date of Patent: September 7, 2004
    Assignee: LG Cable Ltd.
    Inventors: Euy-don Park, Byung-gon Lee, Jin-cheol Ahn, Yon-soo Ahn
  • Publication number: 20040137016
    Abstract: The present invention relates to an adjuvant and vaccine composition containing pre-S of the hepatitis B virus, and more specifically to a modified recombinant pre-S that can enhance immunogenicity of a general vaccine antigen. The present invention also relates to an improved prophylactic Hepatitis B virus (HBV) vaccine and a therapeutic vaccine for the treatment of chronic HBV carriers.
    Type: Application
    Filed: November 24, 2003
    Publication date: July 15, 2004
    Inventors: Hong-Mo Moon, Ki-Yong Kim, Jung-Sun Yum, Byung-Cheol Ahn, Su-Young Yi, Young Seomun, Ji-Hee Park
  • Patent number: 6701101
    Abstract: A method and apparatus for enhancing a transfer efficiency of electronic photograph development equipment, which enhances the transfer efficiency by controlling a transfer voltage output from a transfer voltage output end by a pulse width modulation command under the control of a microcomputer based on a transfer environment and a paper sheet recognition of the electronic photograph development equipment.
    Type: Grant
    Filed: July 22, 2002
    Date of Patent: March 2, 2004
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Don-cheol Ahn
  • Publication number: 20040005170
    Abstract: An image forming device, including a charging unit to electrically charge a surface of an organic photoconductive medium; a light exposure unit to form an electrostatic latent image on the surface of the organic photoconductive medium; a developing unit to develop the electrostatic latent image formed with a developer; a transfer roller to transfer an image developed by the developing unit to a recording paper; a light array having a plurality of light sources arranged in a predetermined pattern; a first light path providing unit to form a light path to receive a first light portion emitted from the light sources and to allow the light to be projected on the organic photoconductive medium between the developing unit and the transfer roller; and a second light path providing unit to form a light path to receive a second portion of the light emitted from the light sources and to allow the light to be projected onto the organic photoconductive medium passing through the transfer roller, thereby removing an elect
    Type: Application
    Filed: April 22, 2003
    Publication date: January 8, 2004
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Dong-Cheol Ahn
  • Patent number: 6631838
    Abstract: A method for fabricating a printed circuit board includes the steps of: fabricating a printed circuit board having at least one collapsed portion; depositing a first solder resist in the collapsed portion; exposing the first solder resist-coated printed circuit board at a pressure lower than atmospheric pressure for a predetermined time; coating a second solder resist on the entire surface of the printed circuit board; and drying and hardening the first and the second solder resists. With this method, when a solder resist is coated, since an air space does not remain in a blind via hole, the reliability of the attachment between a printed circuit board and the solder resist layer is increased.
    Type: Grant
    Filed: April 11, 2001
    Date of Patent: October 14, 2003
    Assignee: LG Electronics Inc.
    Inventors: Nam-Jin Kim, Young-Cheol Ahn, Won-Jae Kim
  • Publication number: 20030166338
    Abstract: A chemical mechanical polishing (hereinafter, referred to as ‘CMP’) slurry for metal is disclosed, more specifically, method for manufacturing metal line contact plug of semiconductor device using an acidic CMP slurry for oxide film further comprising an oxidizer and a complexing agent, which polishes a metal, an oxide film and a nitride film at a similar speed, thereby easily separates a metal line contact plug.
    Type: Application
    Filed: December 30, 2002
    Publication date: September 4, 2003
    Inventors: Ki Cheol Ahn, Pan Ki Kwon, Jong Goo Jung, Sang Ick Lee
  • Publication number: 20030119324
    Abstract: A method for manufacturing of a metal line contact plug of a semiconductor device by performing a two step CMP process using (1) a first slurry solution having high etching selectivity of metal/insulating film and (2) a second slurry solution having small etching selectivity of metal/insulating film, thereby minimizing dependency on CMP devices and separating easily a metal line contact plug.
    Type: Application
    Filed: December 26, 2002
    Publication date: June 26, 2003
    Inventors: Jong Goo Jung, Ki Cheol Ahn, Pan Ki Kwon
  • Publication number: 20030113129
    Abstract: A method and apparatus for enhancing a transfer efficiency of electronic photograph development equipment, which enhances the transfer efficiency by controlling a transfer voltage output from a transfer voltage output end by a pulse width modulation command under the control of a microcomputer based on a transfer environment and a paper sheet recognition of the electronic photograph development equipment.
    Type: Application
    Filed: July 22, 2002
    Publication date: June 19, 2003
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Dong-Cheol Ahn
  • Publication number: 20030032603
    Abstract: The invention is aimed at discovering a new type of anti-cancer compound which can exert an excellent inhibitory activity against the heparanase. A fungal strain Acremonium sp. MT70646 (KCTC 8973P) was isolated from the soil. From the culture of the isolated fungal strain, novel compounds that can inhibit both heparinase and heparanase was purified. Therefore, the present invention regards to provide a newly isolated fungal strain Acremonium sp. MT70646 (KCTC 8973P), its new products, and pharmaceutical agents such as a heparinase inhibitor, a heparanase inhibitor, a metastasis inhibitor and an angeiogenesis inhibitor all of which contain the above new compounds produced by the fungal strain as an active ingredient.
    Type: Application
    Filed: June 21, 2002
    Publication date: February 13, 2003
    Inventors: Jong Seog Ahn, Bo Yeon Kim, Won Keun Oh, Tae Ick Mheen, Soon Cheol Ahn, Dae Ook Kang, Hack Ryong Ko, Hwan Mook Kim
  • Patent number: 6466795
    Abstract: A resource allocation request method in a wireless system, including base stations and terminals, includes the steps of: periodically broadcasting resource information, managed by the base stations, to the terminals; receiving and storing the periodically-broadcast resource information in the terminals; making a determination, in response to a resource allocation request, by comparing the parameter value of a resource, extracted from the stored resource information, with a preset critical value when a terminal receives an application command corresponding to the resource allocation request from a user; and, variably requesting resource allocation of the base stations according to the determinations by the terminals in response to the resource allocation requests.
    Type: Grant
    Filed: August 23, 1999
    Date of Patent: October 15, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Yong-cheol Ahn
  • Publication number: 20020084314
    Abstract: A method for fabricating a printed circuit board includes the steps of: fabricating a printed circuit board having at least one collapsed portion; depositing a first solder resist in the collapsed portion; exposing the first solder resist-coated printed circuit board at a pressure lower than atmospheric pressure for a predetermined time; coating a second solder resist on the entire surface of the printed circuit board; and drying and hardening the first and the second solder resists. With this method, when a solder resist is coated, since an air space does not remain in a blind via hole, the reliability of the attachment between a printed circuit board and the solder resist layer is increased.
    Type: Application
    Filed: April 11, 2001
    Publication date: July 4, 2002
    Inventors: Nam-Jin Kim, Young-Cheol Ahn, Won-Jae Kim
  • Patent number: 5965837
    Abstract: A device for carrying artillery shells, each shell having a cylindrical body and a conical head, is disclosed. The device includes an upper body and a lower body. A gripper assembly is connected to the lower body and has an inner circumferential surface corresponding to the cylindrical body. A driving unit pivots the gripper assembly about an axis. A shell-head stopping unit is connected to the lower body at a position which may be adjusted along the length of the lower body. The shell-head stopping unit receives the conical head of a shell to hold the shell in a set position. Also included is a shell-rear stopping unit connected to the gripper assembly and elastically biased upward with respect to the inner circumferential surface of the gripper assembly. The shell-rear stopping unit holds the rear end of the shell in the gripper assembly.
    Type: Grant
    Filed: January 31, 1997
    Date of Patent: October 12, 1999
    Assignee: Samsung Aerospace Industries, Ltd
    Inventors: Kang-il Lee, Sung-yong Bae, Hee-sun Kang, Byung-cheol Ahn, Joon-yeol Im