Abstract: In the case of a gas in which several gases are mixed, a type and concentration of the gas may be incorrectly measured when measured using only an optical band-pass filter. The invention of the present application is directed to providing a technology in which a plurality of broadband band-pass filters having overlapping regions are provided to calculate a magnitude of absorption for each wavelength band for light passing through each broadband band-pass filter, thereby identifying the presence of a gas of interest and the presence of a gas other than the gas of interest.

Abstract: A transmitting and receiving circuit may include a first CMOS inverter configured to receive a first power supply signal and a first input signal. The transmitting and receiving circuit may include a first calculation amplifier including a non-inverted input terminal connected to an output terminal of the first CMOS inverter, and a first resistor connected between the output terminal of the first calculation amplifier and a first node. The output terminal of the first calculation amplifier and an inverted input terminal of the first calculation amplifier may be connected to each other. A first output signal may have a level smaller than that of the first input signal and may be output to the first node.

Abstract: A flexible display device including a bending area and a plurality of non-bending areas may include a display substrate including a plurality of transistors and a light-emitting element, a sensing film below the display substrate, and a plurality of metal plates below the sensing film, and the metal plates include a soft magnetic material.

Abstract: A manufacturing method of an adhesive layer includes: providing a preliminary adhesive layer, attaching a mask to a first area portion of the preliminary adhesive layer, and thereby, provide a second area portion of the preliminary adhesive layer that is adjacent to the first area portion and to which the mask is not attached, to provide an adhesive layer that exhibits good folding reliability. In addition, a display device may exhibit good folding reliability characteristics by including the adhesive layer from which an adhesion force of a folding area is reduced between a supporting member and a display panel of the display device.

Abstract: An organic light emitting display device includes a lower electrode, a pressure sensing layer disposed on the lower electrode, an upper electrode disposed on the pressure sensing layer, an organic light emitting structure disposed on the upper electrode, a window disposed on the organic light emitting structure and which is applied with a user pressure, and a haptic structure which generates a haptic signal when the user pressure detected through the lower electrode, the pressure sensing layer, and the upper electrode is greater than a predetermined pressure.

Abstract: A manufacturing method of an adhesive layer includes: providing a preliminary adhesive layer, attaching a mask to a first area portion of the preliminary adhesive layer, and thereby, provide a second area portion of the preliminary adhesive layer that is adjacent to the first area portion and to which the mask is not attached, to provide an adhesive layer that exhibits good folding reliability. In addition, a display device may exhibit good folding reliability characteristics by including the adhesive layer from which an adhesion force of a folding area is reduced between a supporting member and a display panel of the display device.

Abstract: Provided is a display device. The display device comprises a functional layer in which a plurality of pixel areas are defined and which includes at least one coil to which an AC signal is applied and an input sensor configured to sense an input from an external source and disposed on the functional layer. The input sensor comprises a first conductive layer including a first sensing loop extending in a first direction, a sensing insulation layer disposed on the first conductive layer, and a second conductive layer disposed on the sensing insulation layer and including a second sensing loop extending in a second direction crossing the first direction.

Abstract: An electronic apparatus includes a window, a display panel disposed under the window, and a digitizer disposed under the display panel. The digitizer includes a photosensitive resin layer including a front surface and a rear surface opposite to the front surface, and a plurality of sensing coils disposed inside the photosensitive resin layer. The front surface is relatively flat compared with the rear surface.

Abstract: A flexible display device including a bending area and a plurality of non-bending areas may include a display substrate including a plurality of transistors and a light-emitting element, a sensing film below the display substrate, and a plurality of metal plates below the sensing film, and the metal plates include a soft magnetic material.

Abstract: A manufacturing method of an adhesive layer includes: providing a preliminary adhesive layer, attaching a mask to a first area portion of the preliminary adhesive layer, and thereby, provide a second area portion of the preliminary adhesive layer that is adjacent to the first area portion and to which the mask is not attached, to provide an adhesive layer that exhibits good folding reliability. In addition, a display device may exhibit good folding reliability characteristics by including the adhesive layer from which an adhesion force of a folding area is reduced between a supporting member and a display panel of the display device.

Abstract: An organic light emitting display device includes a lower electrode, a pressure sensing layer disposed on the lower electrode, an upper electrode disposed on the pressure sensing layer, an organic light emitting structure disposed on the upper electrode, a window disposed on the organic light emitting structure and which is applied with a user pressure, and a haptic structure which generates a haptic signal when the user pressure detected through the lower electrode, the pressure sensing layer, and the upper electrode is greater than a predetermined pressure.

Abstract: A touch pen for touching a display device to provide touch input information to the display device is provided. A touch pen includes a cover member; a touch member inside the cover member and including a touch tip, a coupling part, and a non-coupling part connecting the touch tip and the coupling part; and a holding member arranged to be fixed to an inner circumferential surface of the cover member and detachable from the coupling part according to a separation condition.

Abstract: Provided is a display device. The display device comprises a functional layer in which a plurality of pixel areas are defined and which includes at least one coil to which an AC signal is applied and an input sensor configured to sense an input from an external source and disposed on the functional layer. The input sensor comprises a first conductive layer including a first sensing loop extending in a first direction, a sensing insulation layer disposed on the first conductive layer, and a second conductive layer disposed on the sensing insulation layer and including a second sensing loop extending in a second direction crossing the first direction.

Abstract: An electronic apparatus includes a window, a display panel disposed under the window, and a digitizer disposed under the display panel. The digitizer includes a photosensitive resin layer including a front surface and a rear surface opposite to the front surface, and a plurality of sensing coils disposed inside the photosensitive resin layer. The front surface is relatively flat compared with the rear surface.

Abstract: A package substrate includes an encapsulating layer; a circuit pattern having an end embedded in the encapsulating layer; and a conductor disposed on a portion of the encapsulating layer, externally exposed, and electrically connected to the at least one end of the circuit pattern embedded in the encapsulating layer.

Abstract: An electronic device embedded substrate and a method of manufacturing the same are disclosed. The electronic device embedded substrate includes a core substrate comprising a polyimide resin layer disposed on one side of a cavity of the core substrate, an electronic device embedded in the cavity, and an insulation layer disposed on both surfaces of the core substrate so as to cover the core substrate and the electronic device.

Abstract: There is provided a method for measuring a coefficient of thermal expansion including: a step (S100) of providing two or more samples; a step (S200) of obtaining measured coefficients of thermal expansion of the two or more samples by means of a thermal mechanical analyzer; and a step (S300) of deriving a correction expression of an estimated coefficient of thermal expansion that is to be applied to the thermal mechanical analyzer through the two or more measured coefficients of thermal expansion obtained in the step (S200) and a linear regression analysis.

Abstract: A method for forming bumps and a substrate including the bumps. The method includes: coating a solder resist on a substrate and electrodes formed on the substrate: performing laser etching treatment on the solder resist to form openings for forming bumps; printing a composition for forming bumps in the openings for forming bumps; and performing a reflowing process. Accordingly, the method can decrease the number of processes and realize a fine bump pitch of 90 ?m or less at the time of forming bumps. Further, the method can also decrease the number of times that alignment is performed, due to the decrease in the number of processes.

Abstract: Disclosed herein is a method for manufacturing a printed circuit board. The method for manufacturing a printed circuit board includes: preparing a base substrate having first connection pads and second connection pads; forming a solder resist layer on the base substrate, the solder resist layer having a first opening for exposing the first connection pads; forming a first surface treatment layer on the first connection pads; forming a protective film on the solder resist layer; forming a second opening for exposing the second connection pads in the protective film and the solder resist layer; and forming a second surface treatment layer on the second connection pads.

Abstract: A method for manufacturing a multi-layer printed circuit board includes: forming first bumps on one surface of a first copper layer at a predetermined interval; providing, on the first copper layer, an insulating layer through which the first bumps are penetrating; stacking a second copper layer on a top of the insulating layer; forming circuits by patterning the first copper layer and the second copper layer; laminating insulating films on top and bottom surfaces of the insulating layer on which the circuits have been formed; forming second bumps on one surface of a third copper layer and of a fourth copper layer at a predetermined interval; and stacking the third copper layer and fourth copper layer, provided with the second bumps, on the top and bottom surfaces of the insulating films.