Patents by Inventor Cheol Jong Han

Cheol Jong Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dicing film having shrinkage release film and method for manufacturing semiconductor package using the same
    Patent number: 8101527
    Abstract: The present invention relates to a dicing film having an adhesive film for dicing a wafer and a die adhesive film, which are used for manufacturing a semiconductor package, and a method of manufacturing a semiconductor package using the same. More particularly, the present invention relates to a dicing film wherein a shrinkage release film is inserted between an adhesive film for dicing a wafer and a die adhesive film so that the die adhesive film and a die can be easily separated from the adhesive film for dicing a wafer when picking up a semiconductor die, and a method of manufacturing a semiconductor package using the same.
    Type: Grant
    Filed: April 12, 2010
    Date of Patent: January 24, 2012
    Assignee: LG Innotek Co. Ltd.
    Inventors: Joon Mo Seo, Hyuk Soo Moon, Cheol Jong Han, Jong Geol Lee, Kyung Tae Wi
  • Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same
    Patent number: 7968977
    Abstract: The present invention relates to a dicing film having an adhesive film for dicing a wafer and a die adhesive film, which are used for manufacturing a semiconductor package, and a method of manufacturing a semiconductor package using the same. More particularly, the present invention relates to a dicing film wherein a shrinkage release film is inserted between an adhesive film for dicing a wafer and a die adhesive film so that the die adhesive film and a die can be easily separated from the adhesive film for dicing a wafer when picking up a semiconductor die, and a method of manufacturing a semiconductor package using the same.
    Type: Grant
    Filed: December 10, 2004
    Date of Patent: June 28, 2011
    Assignee: LG Innotek Co., Ltd.
    Inventors: Joon Mo Seo, Hyuk Soo Moon, Cheol Jong Han, Jong Geol Lee, Kyung Tae Wi
  • DICING FILM HAVING SHRINKAGE RELEASE FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME.
    Publication number: 20100197078
    Abstract: The present invention relates to a dicing film having an adhesive film for dicing a wafer and a die adhesive film, which are used for manufacturing a semiconductor package, and a method of manufacturing a semiconductor package using the same. More particularly, the present invention relates to a dicing film wherein a shrinkage release film is inserted between an adhesive film for dicing a wafer and a die adhesive film so that the die adhesive film and a die can be easily separated from the adhesive film for dicing a wafer when picking up a semiconductor die, and a method of manufacturing a semiconductor package using the same.
    Type: Application
    Filed: April 12, 2010
    Publication date: August 5, 2010
    Applicant: LG Cable LTD.
    Inventors: Joon Mo Seo, Hyuk Soo Moon, Cheol Jong Han, Jong Geol Lee, Kyung Tae Wi