Abstract: A method and apparatus for picking up a semiconductor chip, a method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape are provided. Air may be blown through air holes in a dicing tape to at least partially separate the semiconductor chip from the dicing tape and/or create a space between the semiconductor chip to weaken the adhesion of the dicing tape to the semiconductor chip. The semiconductor chip may then be picked up by a removal member and completely removed from the dicing tape. Semiconductor chips that are not to be removed may be vacuum-suctioned to the dicing tape. UV radiation or heat may be applied to weaken the adhesion of the dicing tape. The semiconductor chip may be detected by an optical detector. Removing the semiconductor chips by air reduces stress and damage to the semiconductor chips.

Abstract: A method and apparatus for picking up a semiconductor chip, a method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape are provided. Air may be blown through air holes in a dicing tape to at least partially separate the semiconductor chip from the dicing tape and/or create a space between the semiconductor chip to weaken the adhesion of the dicing tape to the semiconductor chip. The semiconductor chip may then be picked up by a removal member and completely removed from the dicing tape. Semiconductor chips that are not to be removed may be vacuum-suctioned to the dicing tape. UV radiation or heat may be applied to weaken the adhesion of the dicing tape. The semiconductor chip may be detected by an optical detector. Removing the semiconductor chips by air reduces stress and damage to the semiconductor chips.

Abstract: A method and apparatus for picking up a semiconductor chip, a method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape are provided. Air may be blown through air holes in a dicing tape to at least partially separate the semiconductor chip from the dicing tape and/or create a space between the semiconductor chip to weaken the adhesion of the dicing tape to the semiconductor chip. The semiconductor chip may then be picked up by a removal member and completely removed from the dicing tape. Semiconductor chips that are not to be removed may be vacuum-suctioned to the dicing tape. UV radiation or heat may be applied to weaken the adhesion of the dicing tape. The semiconductor chip may be detected by an optical detector. Removing the semiconductor chips by air reduces stress and damage to the semiconductor chips.

Abstract: A stacked BGA package and a method for manufacturing the stacked BGA package, with reduced size and/or height of a unit package, which may also reduce an electrical connection length. The stacked BGA package may include a base BGA package having at least one semiconductor chip, and a plurality of BGA packages which are stacked on the base BGA package. A plurality of solder balls may electrically connect the base BGA package and the plurality of BGA packages and may then be sealed to reduce the likelihood of damage.

Abstract: An apparatus for cleaning a mold die set includes a pair of brushes, a pair of vacuum holes, and multiple nozzles. One of the brushes is positioned to scrub a first surface of the mold die set, and the other of the brushes is positioned to scrub a second surface of the mold die set to separate a residue from the first and second surfaces of the mold die set. The vacuum holes receives the separated residue from the first and second surfaces of the mold die set, and through the nozzles, a parting compound is provided to coat the first and second surfaces of the mold die set. The apparatus further includes multiple air holes through which air is blown to the first and second surfaces of the mold die set. An apparatus for semiconductor manufacturing includes a mold die set having a first surface and a second surface and a mold die set cleaner that can remove a residue from the first and second surfaces of the mold die set and coat a parting compound on the first and second surfaces.

Abstract: Provided are a molding method for encapsulating in a substantially simultaneous manner wafer level packages (WLPs) arranged on opposite sides of a PCB module and a mold suitable for practicing the molding method. A PCB module is secured between an upper mold and a lower mold that cooperate to form a single mold. The upper mold includes an upper cavity for receiving an upper WLP and an upper gate through which an epoxy molding compound (EMC) may be forced into the upper cavity. The lower mold includes a lower cavity for receiving a lower WLP and a lower gate through which EMC may be forced into the lower cavity. The EMC may enter the gates through a single inlet formed between upper and lower inlet forming blocks, thereby encapsulating both the upper and lower sides of the PCB module substantially simultaneously, thereby improving productivity.

Abstract: Embodiments of the invention provide a semiconductor-chip mounting body, a semiconductor device including the mounting body, and a method of packaging the semiconductor device. According to some embodiments, when a semiconductor chip is mounted on the mounting body as a flip-chip type, an encapsulation process using an encapsulation resin is not required. In some embodiments, the mounting body includes a substrate formed of a polyimide film, a conductive pattern formed of copper, a protection layer pattern formed of PSR, and an adhesive pattern formed on the protection layer pattern. The adhesive pattern can be formed of an insulating material. A plurality of holes, into which a plurality of bumps formed on the semiconductor chip are inserted to be connected to the conductive pattern, are formed in the protection layer pattern and the adhesive pattern.

Abstract: A method of utilizing a removable protective tape to protect the active surfaces of semiconductor wafer and the individual semiconductor chips during semiconductor packaging processes is provided along with several configurations of apparatuses that may be used in such a method for removing protective tape portions from individual semiconductor chips during the assembly process.

Abstract: A method and apparatus for picking up a semiconductor chip, a method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape are provided. Air may be blown through air holes in a dicing tape to at least partially separate the semiconductor chip from the dicing tape and/or create a space between the semiconductor chip to weaken the adhesion of the dicing tape to the semiconductor chip. The semiconductor chip may then be picked up by a removal member and completely removed from the dicing tape. Semiconductor chips that are not to be removed may be vacuum-suctioned to the dicing tape. UV radiation or heat may be applied to weaken the adhesion of the dicing tape. The semiconductor chip may be detected by an optical detector. Removing the semiconductor chips by air reduces stress and damage to the semiconductor chips.

Abstract: A die package and a die packaging technique, and more particularly a double-sided circuit board mounting technique and a multi-chip package including the circuit board. The multi-chip package comprises a circuit board having the first surface and the second surface. The first surface has a package area and the peripheral area. The package area comprises the chip mounting area on which the die is attached and bonding area with which the die is electrically connected. Additionally, the peripheral area comprises a runner area on which molding compound flows. In the boundary area between the package area and the peripheral area, a gate hole is connected with the runner area. The second surface has a package area and perimeter. The package area comprises the chip mounting area on which the die is attached and the bonding area with which the die is electrically connected. Additionally, the peripheral area comprises the external connection patterns with which the die is electrically connected.

Abstract: An apparatus for cleaning a mold die set includes a pair of brushes, a pair of vacuum holes, and multiple nozzles. One of the brushes is positioned to scrub a first surface of the mold die set, and the other of the brushes is positioned to scrub a second surface of the mold die set to separate a residue from the first and second surfaces of the mold die set. The vacuum holes receives the separated residue from the first and second surfaces of the mold die set, and through the nozzles, a parting compound is provided to coat the first and second surfaces of the mold die set. The apparatus further includes multiple air holes through which air is blown to the first and second surfaces of the mold die set. An apparatus for semiconductor manufacturing includes a mold die set having a first surface and a second surface and a mold die set cleaner that can remove a residue from the first and second surfaces of the mold die set and coat a parting compound on the first and second surfaces.