Patents by Inventor Cheol-Woo Lee
Cheol-Woo Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9592233Abstract: Provided is a pharmaceutical combination preparation including fimasartan and rosuvastatin as active ingredients together with meglumine. The combination preparation exhibits an outstanding effect in treating cardiovascular disease by improving the disintegration and the dissolution which obtained better drug bioavailability and drug safety.Type: GrantFiled: March 14, 2014Date of Patent: March 14, 2017Assignee: Boryung Pharmaceutical Co., Ltd.Inventors: Jayhyuk Myung, Kyung Wan Nam, Cheol Woo Lee, Ju Won Kim
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Publication number: 20160093545Abstract: Provided are a semiconductor package and a method of fabricating the same. The semiconductor package includes: a package substrate; a semiconductor chip mounted on the package substrate and electrically connected to the package substrate; a first protective layer covering the semiconductor chip and having flexibility controlled by at least one of a material type, a thickness, a material composition ratio and viscosity of the first protective layer; and a second protective layer arranged on the first protective layer and having flexibility controlled by at least one of a material type and a thickness of the second protective layer, wherein the first protective layer comprises a first binder resin, a first hardener, and a first hardening catalyst. According to the semiconductor package of the inventive concept, protective layers protecting the semiconductor chip have flexibility, and thus, the semiconductor package may be bent.Type: ApplicationFiled: May 28, 2015Publication date: March 31, 2016Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Cheol-woo LEE, Kang Soo LEE, Hyeon HWANG
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Publication number: 20160035698Abstract: A stack package includes a substrate, a stack of semiconductor chips mounted to the substrate, a side semiconductor chip disposed on one side of the stack, and adhesive interposed between the lower surface of the side semiconductor chip and the stack of semiconductor chips and which attaches the side semiconductor chip to the stack.Type: ApplicationFiled: May 22, 2015Publication date: February 4, 2016Inventors: CHEOL-WOO LEE, WAN-HO PARK
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Publication number: 20160022679Abstract: The present invention relates to a pharmaceutical combination preparation comprising fimasartan and rosuvastatin as active ingredients together with meglumine. The combination preparation of the present invention exhibits an outstanding effect in treating cardiovascular disease by improving the disintegration and the dissolution which obtained better drug bioavailability and drug safety.Type: ApplicationFiled: March 14, 2014Publication date: January 28, 2016Applicant: Boryung Pharmaceutical Co., Ltd.Inventors: Jayhyuk MYUNG, Kyung Wan NAM, Cheol Woo LEE, Ju Won KIM
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Patent number: 9171819Abstract: Provided is a semiconductor package that may prevent deformation of stacked semiconductor chips and minimize a semiconductor package size. The semiconductor package includes a package base substrate, a lower chip stacked on the package base substrate, an upper chip stacked on the lower chip, and a first die attach film (DAF) attached to a bottom surface of the upper chip to cover at least a portion of the lower chip. The first DAF may be a multi-layer film including a first attaching layer contacting the bottom surface of the upper chip and a second attaching layer attached to a bottom of the first attaching layer to cover at least a portion of a side surface of the lower chip.Type: GrantFiled: October 9, 2014Date of Patent: October 27, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Cheol-woo Lee, Ji-han Ko
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Publication number: 20150102507Abstract: Provided is a semiconductor package that may prevent deformation of stacked semiconductor chips and minimize a semiconductor package size. The semiconductor package includes a package base substrate, a lower chip stacked on the package base substrate, an upper chip stacked on the lower chip, and a first die attach film (DAF) attached to a bottom surface of the upper chip to cover at least a portion of the lower chip. The first DAF may be a multi-layer film including a first attaching layer contacting the bottom surface of the upper chip and a second attaching layer attached to a bottom of the first attaching layer to cover at least a portion of a side surface of the lower chip.Type: ApplicationFiled: October 9, 2014Publication date: April 16, 2015Inventors: Cheol-woo LEE, Ji-han KO
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Publication number: 20090127688Abstract: Provided is a package-on-package (POP) having an improved joint reliability. The POP includes a lower package, an upper package that is mounted on the lower package, and a plurality of joint members that electrically connect the lower package to the upper package. The lower package includes a lower substrate and a lower semiconductor chip mounted on a first surface of the lower substrate. The upper package includes an upper substrate and at least one upper semiconductor chip mounted on the upper substrate. The joint members are arranged between the lower package and the upper package. The lower package further includes a lower sealing member that is completely filled in a space between the upper substrate of the upper package and the lower substrate of the lower package to surround the joint members and protect the lower semiconductor chips.Type: ApplicationFiled: July 15, 2008Publication date: May 21, 2009Applicant: Samsung Electronics Co., Ltd.Inventors: Tae-Young LEE, Dong-Ha LEE, Cheol-Woo LEE
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Publication number: 20080164619Abstract: Provided are a semiconductor chip package and a method of manufacturing the semiconductor package. The semiconductor chip package may include at least one semiconductor chip, whose upper surface includes a plurality of electrode pads on a substrate including a conductive pattern, and the conductive pattern and the electrode pads of the chip are connected electrically using a bonding wire. After a first insulation member is provided to an upper surface of the at least one semiconductor chip, the semiconductor chip package may be formed by providing a second insulation member in contact with the first insulation member, the bonding wires, and the at least one semiconductor chip.Type: ApplicationFiled: January 8, 2008Publication date: July 10, 2008Inventors: Cheol-Woo Lee, Bo-Seong Kim, Kwang-Ryul Lee, Tae-Young Lee
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Patent number: 7390000Abstract: The present invention provides a lateral link for suspension systems wherein the distance between opposite ends of the lateral link increases in a tight or sudden turn, so as to enhance controllability, stability, and riding comfort of the vehicle.Type: GrantFiled: December 12, 2005Date of Patent: June 24, 2008Assignee: Kia Motors CorporationInventor: Cheol-Woo Lee
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Patent number: 7378071Abstract: A method for growing a silicon single crystal ingot by a Czochralski method, which is capable of providing silicon wafers having very uniform in-plane quality and which results in improvement of semiconductor device yield. A method is provided for producing a silicon single crystal ingot by a Czochralski method, wherein when convection of a silicon melt is divided into a core cell and an outer cell, the silicon single crystal ingot is grown under the condition that the maximal horizontal direction width of the core cell is 30 to 60% of a surface radius of the silicon melt. In one embodiment the silicon single crystal ingot is grown under the condition that the maximal vertical direction depth of the core cell is equal to or more than 50% of the maximal depth of the silicon melt.Type: GrantFiled: July 7, 2005Date of Patent: May 27, 2008Assignee: Siltron Inc.Inventors: Hyon-Jong Cho, Cheol-Woo Lee, Hong-Woo Lee, Cheong Jin Soo, Kim Sunmi
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Patent number: 7229495Abstract: A method for growing a silicon single crystal ingot by a Czochralski method, which is capable of providing silicon wafers having very uniform in-plane quality and which results in improvement of semiconductor device yield. A method is provided for producing a silicon single crystal ingot by a Czochralski method, wherein when convection distribution of a silicon melt is divided into a core cell and an outer cell, the silicon single crystal ingot is grown under the condition that the maximal horizontal direction width of the core cell is 30 to 60% of a surface radius of the silicon melt. In one embodiment the silicon single crystal ingot is grown under the condition that the maximal vertical direction depth of the core cell is equal to or more than 50% of the maximal depth of the silicon melt.Type: GrantFiled: December 19, 2003Date of Patent: June 12, 2007Assignee: Siltron Inc.Inventors: Hyon-Jong Cho, Cheol-Woo Lee, Hong-Woo Lee, Jin Soo Cheong, Sunmi Kim
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Publication number: 20070085294Abstract: The present invention provides a lateral link for suspension systems wherein the distance between opposite ends of the lateral link increases in a tight or sudden turn, so as to enhance controllability, stability, and riding comfort of the vehicle.Type: ApplicationFiled: December 12, 2005Publication date: April 19, 2007Inventor: Cheol-Woo Lee
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Publication number: 20060016386Abstract: A method for growing a silicon single crystal ingot by a Czochralski method, which is capable of providing silicon wafers having very uniform in-plane quality and which results in improvement of semiconductor device yield. A method is provided for producing a silicon single crystal ingot by a Czochralski method, wherein when convection of a silicon melt is divided into a core cell and an outer cell, the silicon single crystal ingot is grown under the condition that the maximal horizontal direction width of the core cell is 30 to 60% of a surface radius of the silicon melt. In one embodiment the silicon single crystal ingot is grown under the condition that the maximal vertical direction depth of the core cell is equal to or more than 50% of the maximal depth of the silicon melt.Type: ApplicationFiled: July 7, 2005Publication date: January 26, 2006Inventors: Hyon-Jong Cho, Cheol-Woo Lee, Hong-Woo Lee, Cheong Soo, Kim Sunmi
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Publication number: 20040129201Abstract: A method for growing a silicon single crystal ingot by a Czochralski method, which is capable of providing silicon wafers having very uniform in-plane quality and which results in improvement of semiconductor device yield. A method is provided for producing a silicon single crystal ingot by a Czochralski method, wherein when convection of a silicon melt is divided into a core cell and an outer cell, the silicon single crystal ingot is grown under the condition that the maximal horizontal direction width of the core cell is 30 to 60% of a surface radius of the silicon melt. In one embodiment the silicon single crystal ingot is grown under the condition that the maximal vertical direction depth of the core cell is equal to or more than 50% of the maximal depth of the silicon melt.Type: ApplicationFiled: December 19, 2003Publication date: July 8, 2004Inventors: Hyon-Jong Cho, Cheol-Woo Lee, Hong-Woo Lee, Jin Soo Cheong, Sunmi Kim
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Patent number: 5245597Abstract: Disclosed are a method and a device for correcting a track deviation by the deviation of a disc through a fine seek operation that operates a tracking actuator in a coarse seek stage of an optical disc drive wherein a track cross signal of the disc is detected in the optical pick up during the course seek operation and at the same time by using an optical encoder and a linear scale which are installed separately, a scale cross signal of the linear scale is detected and the actuator is driven by a signal resulting from comparing both the signals. At the stage of the travel of the optical pick up, the track deviation of the disk is corrected, and accordingly the relative speed between the light spot and the track at a seek direction becomes small to facilitate the control of the actuator and not to be necessary for lowering a speed of the VCM used in the coarse seek in order to lower the relative speed.Type: GrantFiled: September 30, 1991Date of Patent: September 14, 1993Assignee: Samsung Electronics Co., Ltd.Inventors: Cheol-woo Lee, Geon-ho Cho, Su-han Park