Abstract: The present invention relates to an apparatus of processing a substrate, in more detail, an apparatus of processing a substrate, the apparatus being able to separately discharge gas produced during substrate treatment. An object is to provide an apparatus of processing a substrate that can separately discharge gases simultaneously with treatment liquids and can provide uniform pressure in a plurality of exhaust baths.

Abstract: Provided are a duct structure, a stocker, and a photoresist bottle management facility. The duct structure includes an air supply duct disposed on one side of a shelf stack in a stocker and having a plurality of air supply ports formed to correspond to a plurality of layers of the shelf stack and an exhaust duct disposed on the other side of the shelf stack and having a plurality of exhaust ports formed to correspond to the plurality of layers of the shelf stack.

Abstract: The present invention provides substrate transfer equipment. In an embodiment, the substrate transfer equipment includes: a transfer robot supporting the substrate; and a vertical actuating unit moving the transfer robot in an up-down direction, wherein the vertical actuating unit includes: a vertical frame having a slit formed with a longitudinal direction thereof provided in the up-down direction, and having a vertical space formed therein; an exhaust duct having an exhaust space connected with the vertical space and provided on a side of the vertical frame; and an actuating member positioned in the vertical space and moving a supporting unit in the up-down direction, wherein the exhaust duct is provided such that a first side is open toward the vertical space.

Abstract: According to the disclosed substrate processing apparatus, a first bowl is located to correspond to a substrate, and a first chemical solution supply module supplies a first chemical solution while a support module rotates at a first speed, and a second bowl is located to correspond to the substrate, and a second chemical solution supply module supplies a second chemical solution at a first flow rate while a support module rotates at a second speed equal to or smaller than the first speed, and the second bowl is located to correspond to the substrate, and the second chemical solution supply module does not supply the second chemical solution or supplies the second chemical solution at a second flow rate smaller than the first flow rate while the support module rotates at a third speed smaller than the second speed.

Abstract: An inkjet apparatus for display manufacturing includes a nozzle unit having a discharge port for discharging ink to a substrate, a charging unit disposed on a side of the nozzle unit and charging the ink, and an accelerating electrode disposed on an opposite side of the nozzle unit with the substrate interposed therebetween, and accelerating the ink towards the substrate by electrical attraction.

Abstract: A particle alignment device for a micro LED display, the particle alignment device includes a glass electrode arranged on one surface of the glass substrate on which a pattern is formed, a gripper supporting a glass substrate, the gripper including a gripper electrode interposed between the glass substrate and the gripper, a resistance unit connecting the glass electrode, and an AC signal generator connected to the gripper electrode to generate an AC signal. The glass electrode and the gripper electrode are arranged to oppose each other with the glass substrate interposed therebetween.

Abstract: A support structure, includes: a support plate supporting a substrate; a lower cover covering a lower portion of the support plate; and a catching unit comprising a concave-convex structure having portions corresponding to each other so that the support plate and the lower cover are rotated and assembled with each other.

Abstract: According to an embodiment of the present disclosure, a processing liquid supply nozzle includes a nozzle body, a nozzle tip member connected to a lower portion of the nozzle body, and a fastening member that is disposed between the nozzle body and the nozzle tip member to connect the nozzle body and the nozzle tip member to each other and introduces air into the nozzle body and the nozzle tip member.

Abstract: According to the disclosed substrate processing apparatus, a first bowl is located to correspond to a substrate, and a first chemical solution supply module supplies a first chemical solution while a support module rotates at a first speed, and a second bowl is located to correspond to the substrate, and a second chemical solution supply module supplies a second chemical solution at a first flow rate while a support module rotates at a second speed equal to or smaller than the first speed, and the second bowl is located to correspond to the substrate, and the second chemical solution supply module does not supply the second chemical solution or supplies the second chemical solution at a second flow rate smaller than the first flow rate while the support module rotates at a third speed smaller than the second speed.

Abstract: Provided is a support unit for supporting a substrate, the support unit including: a heating member configured to transmit thermal energy to a supported substrate; a reflective plate disposed under the heating member and configured to reflect thermal energy generated by the heating member to the substrate; a cooling plate disposed under the reflective plate and formed with a cooling flow path in which a cooling fluid flows; and a gas supply line configured to supply gas to a space between the reflective plate and the cooling plate.

Abstract: Disclosed are a standby port and a substrate processing apparatus having the same. The standby port exhausts fumes generated when a processing liquid is discharged into the standby port before the supply of the processing liquid onto a substrate, thereby preventing pollution of a chamber atmosphere.

Abstract: Disclosed are a standby port and a substrate processing apparatus having the same. The standby port exhausts fumes generated when a processing liquid is discharged into the standby port before the supply of the processing liquid onto a substrate, thereby preventing pollution of a chamber atmosphere.