Abstract: Disclosed are a substrate alignment apparatus, a substrate processing apparatus, and a substrate processing method using the substrate alignment apparatus. The substrate alignment apparatus and the substrate processing apparatus include a support plate and a plurality of guide units coupled to the support plate to align a position of the substrate. Each of the guide units includes an alignment pin for aligning the substrate in place and a stationary body having a support surface for supporting an edge region of the substrate aligned, the stationary part being fixedly coupled to the support plate. The alignment pin is rotatable about a central axis of the alignment pin relative to the support surface of the stationary part, thereby rapidly aligning the substrate and thus preventing the substrate transferred between a plurality of process chambers by a transfer robot from being separated or having a negative influence on other apparatuses.

Abstract: Disclosed are a substrate alignment apparatus, a substrate processing apparatus, and a substrate processing method using the substrate alignment apparatus. The substrate alignment apparatus and the substrate processing apparatus include a support plate and a plurality of guide units coupled to the support plate to align a position of the substrate. Each of the guide units includes an alignment pin for aligning the substrate in place and a stationary body having a support surface for supporting an edge region of the substrate aligned, the stationary part being fixedly coupled to the support plate. The alignment pin is rotatable about a central axis of the alignment pin relative to the support surface of the stationary part, thereby rapidly aligning the substrate and thus preventing the substrate transferred between a plurality of process chambers by a transfer robot from being separated or having a negative influence on other apparatuses.