Abstract: A knee joint rehabilitation apparatus for a wheelchair includes a rehabilitation apparatus frame having a height corresponding to a length of each of legs of a patient sitting on the wheelchair; an upper leg support disposed at an upper end of the rehabilitation apparatus frame and supporting upper legs of the patient thereon while the patient is sitting on the wheelchair; a lower leg support pivotably connected to the upper leg support, wherein the lower legs of the patient are seated and supported on the lower leg support; and an exercise control unit disposed on the rehabilitation apparatus frame and configured to allow the lower leg support to pivot around a connection portion between the lower leg support and the upper leg support such that the patient performs rehabilitation exercise of the knee joint thereof while sitting on the wheelchair.

Abstract: Provided is a semiconductor package with improved reliability. The semiconductor package includes: a plurality of connection terminals on a first surface of the semiconductor device; a protection member on the first surface of the semiconductor device and partially covers side surfaces of the plurality of connection terminals such that the protective member exposes lower surfaces of the plurality of connection terminals; and a mold member that covers a side surface of the semiconductor device and a portion of the protection member such that the mold member does not cover the lower surfaces of the plurality of connection terminals.

Abstract: A method of fabricating a semiconductor package includes mounting a plurality of semiconductor devices on a substrate; forming a molding member that covers a top surface of the substrate, top surfaces of the semiconductor devices, and sidewall surfaces of the semiconductor devices; sawing the molding member and the substrate along pre-scribing lines of the substrate; and spraying a metallic epoxy material on the sawn molding members using a sprayer to form an antistatic layer on sidewall surfaces and a top surface of each of the sawn molding members.

Abstract: A method of fabricating a semiconductor package includes mounting a plurality of semiconductor devices on a substrate; forming a molding member that covers a top surface of the substrate, top surfaces of the semiconductor devices, and sidewall surfaces of the semiconductor devices; sawing the molding member and the substrate along pre-scribing lines of the substrate; and spraying a metallic epoxy material on the sawn molding members using a sprayer to form an antistatic layer on sidewall surfaces and a top surface of each of the sawn molding members.