Patents by Inventor Cheon Lee

Cheon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250121886
    Abstract: An embodiment of a vehicle front structure includes a pair of front side members, a first transverse member connecting front portions of the pair of front side members in a width direction of a vehicle, a second transverse member connecting rear portions of the pair of front side members in the width direction of the vehicle, and a plurality of front modules mounted on the first transverse member and the second transverse member.
    Type: Application
    Filed: March 18, 2024
    Publication date: April 17, 2025
    Inventors: Jeon Woong Kang, Byeong Cheon Lee, Huen Sick Min, Kun Ho Park
  • Publication number: 20250078228
    Abstract: Disclosed is an image processing device and method including obtaining a first differential image having a resolution greater than a resolution of an input image and a parameter value for a tone curve by applying the input image to a neural network, obtaining a plurality of filtered images for different frequency bands by filtering the first differential image, and applying, to each filtered image among the plurality of filtered images, gain values corresponding to a sample value of an edge map of a first image upscaled from the input image.
    Type: Application
    Filed: November 15, 2024
    Publication date: March 6, 2025
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Cheon LEE
  • Patent number: 12183704
    Abstract: Provided is a semiconductor package including a first semiconductor chip having a bottom surface adjacent to a first active layer and an top surface opposite to the bottom surface; a first adhesive layer disposed on the top surface of the first semiconductor chip; a first conductive stud disposed on the bottom surface of the first semiconductor chip and electrically connected to the first active layer; a first conductive post disposed outside the first semiconductor chip; a redistribution structure disposed under the first semiconductor chip and including a redistribution pattern connected to the first conductive stud and the first conductive post and a redistribution insulation layer surrounding the redistribution pattern; and a molding layer surrounding the first semiconductor chip, the first adhesive layer, the first conductive stud, and the first conductive post on the redistribution structure.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: December 31, 2024
    Assignees: NEPES CO., LTD., NEPES LAWEH CORPORATION
    Inventors: Byung Cheol Kim, Yong Tae Kwon, Hyo Gi Jo, Dong Hoon Oh, Jae Cheon Lee, Hyung Jin Shin, Mary Maye Melgo Galimba
  • Patent number: 12175361
    Abstract: The present disclosure relates to an artificial intelligence (AI) system that utilizes a machine learning algorithm, and applications therefore. Disclosed is an electronic device. The electronic device comprises: a storage unit which stores therein an artificial intelligence model trained to determine parameters for a plurality of filters used for image processing on the basis of a deep neural network (DNN); and a processor for determining, through the artificial intelligence mode, parameters for each of the plurality of filters used for image processing for an input image, and performing, through the plurality of filters, filtering of the input image on the basis of the determined parameters so as to perform image processing for the input image.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: December 24, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Cheon Lee, Sungho Kang, Hyungdal Kwon, Yunjae Lim
  • Patent number: 12125775
    Abstract: Disclosed is a semiconductor package including a semiconductor chip having a first surface adjacent to an active layer and a second surface opposite to the first surface; a conductive stud disposed on the first surface of the semiconductor chip and connected to the active layer; an adhesive layer disposed on the second surface of the semiconductor chip; a conductive post disposed outside the semiconductor chip; a first redistribution structure, which is on the first surface of the semiconductor chip and includes a first redistribution insulation layer supporting the conductive stud and the conductive post; a second redistribution structure, which is on the second surface of the semiconductor chip and includes a second redistribution insulation layer disposed on the adhesive layer; and a first molding layer disposed on the first redistribution structure and surrounding the semiconductor chip, the adhesive layer, the conductive stud, and the conductive post.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: October 22, 2024
    Assignees: NEPES CO., LTD., NEPES LAWEH CORPORATION
    Inventors: Byung Cheol Kim, Yong Tae Kwon, Hyo Gi Jo, Dong Hoon Oh, Jae Cheon Lee, Hyung Jin Shin, Mary Maye Melgo Galimba
  • Patent number: 12069791
    Abstract: A cooking appliance includes a cabinet that defines a cooking chamber. A magnetron is mounted within the cabinet and is in communication with the cooking chamber to direct a microwave thereto. An induction heating coil is mounted within the cabinet and is in communication with the cooking chamber to direct a magnetic field thereto. A turntable is rotatably mounted in the cooking chamber above the induction heating coil. A motor is operatively coupled to the turntable and is mounted within the cabinet outside of the cooking chamber below and adjacent to the induction heating coil. The motor is operatively coupled to the turntable by a non-magnetic rotation hub extending through the induction heating coil.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: August 20, 2024
    Assignee: Haier US Appliance Solutions, Inc.
    Inventors: Byung Cheon Lee, Youngjin Oh
  • Publication number: 20240195755
    Abstract: A data diode provides a flexible device for collecting data from a data source and transmitting the data to a data destination using one-way data transmission. On-board processing elements allow the data diode to identify automatically the type of connectivity provided to the data diode and configure the data diode to handle the identified type of connectivity. A network tap allows monitoring network traffic on the source side of the data diode.
    Type: Application
    Filed: December 8, 2023
    Publication date: June 13, 2024
    Applicant: Fend Incorporated
    Inventors: Sang Cheon Lee, Colin Patrick Dunn, Philip Quebe, Nicholas Norwood
  • Patent number: 12001954
    Abstract: An encoding apparatus connected to a learning circuit processing learning of a deep neural network and configured to perform encoding for reconfiguring connection or disconnection of a plurality of edges in a layer of the deep neural network using an edge sequence generated based on a random number sequence and dropout information indicating a ratio between connected edges and disconnected edges of a plurality of edges included in a layer of the deep neural network.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: June 4, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sungho Kang, Hyungdal Kwon, Cheon Lee, Yunjae Lim
  • Patent number: 11993316
    Abstract: A vehicle body structure includes: a front pillar; a front side member located in front of the front pillar and extending in a longitudinal direction of the vehicle; a side sill connected to a bottom end of the front pillar; and a rear lower member connecting the front side member, the side sill, and the front pillar, where the rear lower member includes a front connection portion connected to a rear portion of the front side member, and a rear connection portion connected to a lower portion of the front pillar and a front portion of the side sill, and the rear connection portion includes an upper engagement wall joined to the front pillar, and a lower engagement wall joined to the side sill.
    Type: Grant
    Filed: May 24, 2022
    Date of Patent: May 28, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Deok Hwa Hong, Il Do Kim, Byeong Cheon Lee, Kwang Hee An, Ji Woong Park
  • Publication number: 20240157025
    Abstract: Disclosed herein are a biodegradable polymer microparticle for a filler, a freeze-dried body including the same, a manufacturing method thereof, and filler injection including the freeze-dried body. The freeze-dried body includes hydrophilic surface-treated biodegradable polymer microparticle and a biocompatible carrier, wherein the hydrophilic surface-treated biodegradable polymer microparticle has an average particle diameter (D50) of 20 to 50 ?m and is polydioxanone which has a carboxyl group on the surface thereof. The hydrophilic surface-treated biodegradable polymer microparticle is a plasma surface-treated product or a base surface-treated product using discharge of the biodegradable polymer microparticle. The content of the biocompatible carrier is 1 to 5 parts by weight based on 100 parts by weight of the freeze-dried body.
    Type: Application
    Filed: January 16, 2024
    Publication date: May 16, 2024
    Applicant: ULTRA V CO., LTD.
    Inventors: Cheong Cheon LEE, Lia PRISCILLA, Min Seok KWAK, Jung Woo HAN, Jung Ryul HAM, Han Jin KWON
  • Publication number: 20240144455
    Abstract: Disclosed is an image processing method including obtaining, from a first image, object information of an important object included in the first image, obtaining control information for image quality processing, and obtaining a second image by performing image quality processing on the important object from the first image based on the object information and user control information.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 2, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jaesung PARK, Jiman KIM, Cheon LEE, Seongwoon JUNG
  • Patent number: 11966846
    Abstract: An encoding apparatus connected to a learning circuit processing learning of a deep neural network and configured to perform encoding for reconfiguring connection or disconnection of a plurality of edges in a layer of the deep neural network using an edge sequence generated based on a random number sequence and dropout information indicating a ratio between connected edges and disconnected edges of a plurality of edges included in a layer of the deep neural network.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: April 23, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sungho Kang, Hyungdal Kwon, Cheon Lee, Yunjae Lim
  • Patent number: 11954235
    Abstract: A data diode chip provides a flexible device for collecting data from a data source and transmitting the data to a data destination using one-way data transmission. On-chip processing elements allow the data diode to identify automatically the type of connectivity provided to the data diode and configure the data diode to handle the identified type of connectivity.
    Type: Grant
    Filed: June 12, 2023
    Date of Patent: April 9, 2024
    Assignee: Fend Incorporated
    Inventors: Sang Cheon Lee, Colin Patrick Dunn
  • Publication number: 20240078631
    Abstract: An image processing apparatus applies an image to a first learning network model to optimize the edges of the image, applies the image to a second learning network model to optimize the texture of the image, and applies a first weight to the first image and a second weight to the second image based on information on the edge areas and the texture areas of the image to acquire an output image.
    Type: Application
    Filed: November 10, 2023
    Publication date: March 7, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Cheon LEE, Donghyun KIM, Yongsup PARK, Jaeyeon PARK, Iljun AHN, Hyunseung LEE, Taegyoung AHN, Youngsu MOON, Tammy LEE
  • Patent number: 11892171
    Abstract: A cooking appliance includes a cabinet that defines a vertical direction and an inner shell positioned within the cabinet. The inner shell defines a cooking chamber therein. The cooking appliance also includes an upper heating module positioned at or proximate to an upper wall of the inner shell. The cooking appliance further includes a movable platform mounted to the inner shell within the cabinet. The movable platform is configured to move along the vertical direction between a bottom position wherein the movable platform is at least partially flush with a bottom wall of the inner shell and an elevated position wherein the movable platform is positioned above the bottom wall of the inner shell.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: February 6, 2024
    Assignee: Haier US Appliance Solutions, Inc.
    Inventor: Byung Cheon Lee
  • Patent number: 11866098
    Abstract: A vehicle body structure includes: a front pillar joined to a dash panel; a front side member extending from the dash panel toward the front of a vehicle; a side sill connected to a bottom end of the front pillar; a rear lower member connecting a rear portion of the front side member and a front portion of the side sill; and a connection member connecting at least two of the front pillar, the side sill, and the rear lower member. The connection member is integrally connected to the front pillar, the side sill, or the rear lower member to form a unitary one piece structure therewith.
    Type: Grant
    Filed: March 10, 2023
    Date of Patent: January 9, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Deok Hwa Hong, Hee Seouk Chung, Hyun Sik Kim, Byeong Cheon Lee
  • Patent number: 11866097
    Abstract: Disclosed is a lower cross member of a vehicle. The lower cross member includes a core member configured to be disposed on a vehicle floor so as to extend in a width direction of the vehicle, to be formed of a composite material including unidirectional carbon fiber or bidirectional carbon fiber, and to have a cross-section including at least one closed curve, a lower layer configured to extend in an extending direction of the core member, to be disposed between the core member and the vehicle floor, and to be formed of a composite material including a first multi-axial glass fabric, and an upper layer configured to extend in the extending direction of the core member, to be disposed on an upper surface of the core member, and to be formed of a composite material including a second multi-axial glass fabric.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: January 9, 2024
    Assignees: Hyundai Motor Company, Kia Motors Corporation, Kolonglotech, Inc.
    Inventors: Hyun Sik Kim, Sang Yoon Park, Deok Hwa Hong, Hee Seouk Chung, Byeong Cheon Lee, Yeun Ho Yu, Young Gyu Kim, Jeong Wan Han, Hyeon Seok Do, Hyun Kyu Shin, Cheol Min Nam, Kum Soo Bae, Seong Jong Kim, Jun Youp Kim
  • Patent number: 11836890
    Abstract: An image processing apparatus applies an image to a first learning network model to optimize the edges of the image, applies the image to a second learning network model to optimize the texture of the image, and applies a first weight to the first image and a second weight to the second image based on information on the edge areas and the texture areas of the image to acquire an output image.
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: December 5, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Cheon Lee, Donghyun Kim, Yongsup Park, Jaeyeon Park, Iljun Ahn, Hyunseung Lee, Taegyoung Ahn, Youngsu Moon, Tammy Lee
  • Publication number: 20230375562
    Abstract: A fluorescent protein sensor capable of quantitatively measuring oxidation degree of methionine residues of a specific protein, and a use thereof. Specifically, a fluorescent biosensor recombinant protein in which an MsrB protein, a cpYFP protein, a thioredoxin 3 protein, a linker protein and a G protein are linked in this order, and which is capable of quantitatively measuring the oxidation degree of methionine residues of a target protein; a fluorescent biosensor comprising same; a method for measuring oxidation degree of methionine residues of a target protein; and an information providing method for diagnosis of oxidative stress-associated diseases; and a method for screening for a therapeutic agent for oxidative stress-associated diseases.
    Type: Application
    Filed: September 28, 2021
    Publication date: November 23, 2023
    Applicant: GERONMED, CO. LTD
    Inventors: Byung Cheon LEE, Hae Min LEE
  • Patent number: D1085864
    Type: Grant
    Filed: August 2, 2023
    Date of Patent: July 29, 2025
    Assignee: LGS CORPORATION Co., Ltd.
    Inventor: Seung Cheon Lee