Patents by Inventor Cheon Lee
Cheon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250121886Abstract: An embodiment of a vehicle front structure includes a pair of front side members, a first transverse member connecting front portions of the pair of front side members in a width direction of a vehicle, a second transverse member connecting rear portions of the pair of front side members in the width direction of the vehicle, and a plurality of front modules mounted on the first transverse member and the second transverse member.Type: ApplicationFiled: March 18, 2024Publication date: April 17, 2025Inventors: Jeon Woong Kang, Byeong Cheon Lee, Huen Sick Min, Kun Ho Park
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Publication number: 20250078228Abstract: Disclosed is an image processing device and method including obtaining a first differential image having a resolution greater than a resolution of an input image and a parameter value for a tone curve by applying the input image to a neural network, obtaining a plurality of filtered images for different frequency bands by filtering the first differential image, and applying, to each filtered image among the plurality of filtered images, gain values corresponding to a sample value of an edge map of a first image upscaled from the input image.Type: ApplicationFiled: November 15, 2024Publication date: March 6, 2025Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventor: Cheon LEE
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Patent number: 12183704Abstract: Provided is a semiconductor package including a first semiconductor chip having a bottom surface adjacent to a first active layer and an top surface opposite to the bottom surface; a first adhesive layer disposed on the top surface of the first semiconductor chip; a first conductive stud disposed on the bottom surface of the first semiconductor chip and electrically connected to the first active layer; a first conductive post disposed outside the first semiconductor chip; a redistribution structure disposed under the first semiconductor chip and including a redistribution pattern connected to the first conductive stud and the first conductive post and a redistribution insulation layer surrounding the redistribution pattern; and a molding layer surrounding the first semiconductor chip, the first adhesive layer, the first conductive stud, and the first conductive post on the redistribution structure.Type: GrantFiled: November 11, 2021Date of Patent: December 31, 2024Assignees: NEPES CO., LTD., NEPES LAWEH CORPORATIONInventors: Byung Cheol Kim, Yong Tae Kwon, Hyo Gi Jo, Dong Hoon Oh, Jae Cheon Lee, Hyung Jin Shin, Mary Maye Melgo Galimba
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Patent number: 12175361Abstract: The present disclosure relates to an artificial intelligence (AI) system that utilizes a machine learning algorithm, and applications therefore. Disclosed is an electronic device. The electronic device comprises: a storage unit which stores therein an artificial intelligence model trained to determine parameters for a plurality of filters used for image processing on the basis of a deep neural network (DNN); and a processor for determining, through the artificial intelligence mode, parameters for each of the plurality of filters used for image processing for an input image, and performing, through the plurality of filters, filtering of the input image on the basis of the determined parameters so as to perform image processing for the input image.Type: GrantFiled: March 6, 2019Date of Patent: December 24, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Cheon Lee, Sungho Kang, Hyungdal Kwon, Yunjae Lim
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Patent number: 12125775Abstract: Disclosed is a semiconductor package including a semiconductor chip having a first surface adjacent to an active layer and a second surface opposite to the first surface; a conductive stud disposed on the first surface of the semiconductor chip and connected to the active layer; an adhesive layer disposed on the second surface of the semiconductor chip; a conductive post disposed outside the semiconductor chip; a first redistribution structure, which is on the first surface of the semiconductor chip and includes a first redistribution insulation layer supporting the conductive stud and the conductive post; a second redistribution structure, which is on the second surface of the semiconductor chip and includes a second redistribution insulation layer disposed on the adhesive layer; and a first molding layer disposed on the first redistribution structure and surrounding the semiconductor chip, the adhesive layer, the conductive stud, and the conductive post.Type: GrantFiled: November 11, 2021Date of Patent: October 22, 2024Assignees: NEPES CO., LTD., NEPES LAWEH CORPORATIONInventors: Byung Cheol Kim, Yong Tae Kwon, Hyo Gi Jo, Dong Hoon Oh, Jae Cheon Lee, Hyung Jin Shin, Mary Maye Melgo Galimba
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Patent number: 12069791Abstract: A cooking appliance includes a cabinet that defines a cooking chamber. A magnetron is mounted within the cabinet and is in communication with the cooking chamber to direct a microwave thereto. An induction heating coil is mounted within the cabinet and is in communication with the cooking chamber to direct a magnetic field thereto. A turntable is rotatably mounted in the cooking chamber above the induction heating coil. A motor is operatively coupled to the turntable and is mounted within the cabinet outside of the cooking chamber below and adjacent to the induction heating coil. The motor is operatively coupled to the turntable by a non-magnetic rotation hub extending through the induction heating coil.Type: GrantFiled: June 24, 2021Date of Patent: August 20, 2024Assignee: Haier US Appliance Solutions, Inc.Inventors: Byung Cheon Lee, Youngjin Oh
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Publication number: 20240195755Abstract: A data diode provides a flexible device for collecting data from a data source and transmitting the data to a data destination using one-way data transmission. On-board processing elements allow the data diode to identify automatically the type of connectivity provided to the data diode and configure the data diode to handle the identified type of connectivity. A network tap allows monitoring network traffic on the source side of the data diode.Type: ApplicationFiled: December 8, 2023Publication date: June 13, 2024Applicant: Fend IncorporatedInventors: Sang Cheon Lee, Colin Patrick Dunn, Philip Quebe, Nicholas Norwood
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Patent number: 12001954Abstract: An encoding apparatus connected to a learning circuit processing learning of a deep neural network and configured to perform encoding for reconfiguring connection or disconnection of a plurality of edges in a layer of the deep neural network using an edge sequence generated based on a random number sequence and dropout information indicating a ratio between connected edges and disconnected edges of a plurality of edges included in a layer of the deep neural network.Type: GrantFiled: February 21, 2019Date of Patent: June 4, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sungho Kang, Hyungdal Kwon, Cheon Lee, Yunjae Lim
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Patent number: 11993316Abstract: A vehicle body structure includes: a front pillar; a front side member located in front of the front pillar and extending in a longitudinal direction of the vehicle; a side sill connected to a bottom end of the front pillar; and a rear lower member connecting the front side member, the side sill, and the front pillar, where the rear lower member includes a front connection portion connected to a rear portion of the front side member, and a rear connection portion connected to a lower portion of the front pillar and a front portion of the side sill, and the rear connection portion includes an upper engagement wall joined to the front pillar, and a lower engagement wall joined to the side sill.Type: GrantFiled: May 24, 2022Date of Patent: May 28, 2024Assignees: Hyundai Motor Company, Kia CorporationInventors: Deok Hwa Hong, Il Do Kim, Byeong Cheon Lee, Kwang Hee An, Ji Woong Park
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Publication number: 20240157025Abstract: Disclosed herein are a biodegradable polymer microparticle for a filler, a freeze-dried body including the same, a manufacturing method thereof, and filler injection including the freeze-dried body. The freeze-dried body includes hydrophilic surface-treated biodegradable polymer microparticle and a biocompatible carrier, wherein the hydrophilic surface-treated biodegradable polymer microparticle has an average particle diameter (D50) of 20 to 50 ?m and is polydioxanone which has a carboxyl group on the surface thereof. The hydrophilic surface-treated biodegradable polymer microparticle is a plasma surface-treated product or a base surface-treated product using discharge of the biodegradable polymer microparticle. The content of the biocompatible carrier is 1 to 5 parts by weight based on 100 parts by weight of the freeze-dried body.Type: ApplicationFiled: January 16, 2024Publication date: May 16, 2024Applicant: ULTRA V CO., LTD.Inventors: Cheong Cheon LEE, Lia PRISCILLA, Min Seok KWAK, Jung Woo HAN, Jung Ryul HAM, Han Jin KWON
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Publication number: 20240144455Abstract: Disclosed is an image processing method including obtaining, from a first image, object information of an important object included in the first image, obtaining control information for image quality processing, and obtaining a second image by performing image quality processing on the important object from the first image based on the object information and user control information.Type: ApplicationFiled: January 8, 2024Publication date: May 2, 2024Applicant: Samsung Electronics Co., Ltd.Inventors: Jaesung PARK, Jiman KIM, Cheon LEE, Seongwoon JUNG
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Patent number: 11966846Abstract: An encoding apparatus connected to a learning circuit processing learning of a deep neural network and configured to perform encoding for reconfiguring connection or disconnection of a plurality of edges in a layer of the deep neural network using an edge sequence generated based on a random number sequence and dropout information indicating a ratio between connected edges and disconnected edges of a plurality of edges included in a layer of the deep neural network.Type: GrantFiled: February 21, 2019Date of Patent: April 23, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sungho Kang, Hyungdal Kwon, Cheon Lee, Yunjae Lim
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Patent number: 11954235Abstract: A data diode chip provides a flexible device for collecting data from a data source and transmitting the data to a data destination using one-way data transmission. On-chip processing elements allow the data diode to identify automatically the type of connectivity provided to the data diode and configure the data diode to handle the identified type of connectivity.Type: GrantFiled: June 12, 2023Date of Patent: April 9, 2024Assignee: Fend IncorporatedInventors: Sang Cheon Lee, Colin Patrick Dunn
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Publication number: 20240078631Abstract: An image processing apparatus applies an image to a first learning network model to optimize the edges of the image, applies the image to a second learning network model to optimize the texture of the image, and applies a first weight to the first image and a second weight to the second image based on information on the edge areas and the texture areas of the image to acquire an output image.Type: ApplicationFiled: November 10, 2023Publication date: March 7, 2024Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Cheon LEE, Donghyun KIM, Yongsup PARK, Jaeyeon PARK, Iljun AHN, Hyunseung LEE, Taegyoung AHN, Youngsu MOON, Tammy LEE
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Patent number: 11892171Abstract: A cooking appliance includes a cabinet that defines a vertical direction and an inner shell positioned within the cabinet. The inner shell defines a cooking chamber therein. The cooking appliance also includes an upper heating module positioned at or proximate to an upper wall of the inner shell. The cooking appliance further includes a movable platform mounted to the inner shell within the cabinet. The movable platform is configured to move along the vertical direction between a bottom position wherein the movable platform is at least partially flush with a bottom wall of the inner shell and an elevated position wherein the movable platform is positioned above the bottom wall of the inner shell.Type: GrantFiled: March 10, 2021Date of Patent: February 6, 2024Assignee: Haier US Appliance Solutions, Inc.Inventor: Byung Cheon Lee
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Patent number: 11866098Abstract: A vehicle body structure includes: a front pillar joined to a dash panel; a front side member extending from the dash panel toward the front of a vehicle; a side sill connected to a bottom end of the front pillar; a rear lower member connecting a rear portion of the front side member and a front portion of the side sill; and a connection member connecting at least two of the front pillar, the side sill, and the rear lower member. The connection member is integrally connected to the front pillar, the side sill, or the rear lower member to form a unitary one piece structure therewith.Type: GrantFiled: March 10, 2023Date of Patent: January 9, 2024Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Deok Hwa Hong, Hee Seouk Chung, Hyun Sik Kim, Byeong Cheon Lee
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Patent number: 11866097Abstract: Disclosed is a lower cross member of a vehicle. The lower cross member includes a core member configured to be disposed on a vehicle floor so as to extend in a width direction of the vehicle, to be formed of a composite material including unidirectional carbon fiber or bidirectional carbon fiber, and to have a cross-section including at least one closed curve, a lower layer configured to extend in an extending direction of the core member, to be disposed between the core member and the vehicle floor, and to be formed of a composite material including a first multi-axial glass fabric, and an upper layer configured to extend in the extending direction of the core member, to be disposed on an upper surface of the core member, and to be formed of a composite material including a second multi-axial glass fabric.Type: GrantFiled: August 17, 2020Date of Patent: January 9, 2024Assignees: Hyundai Motor Company, Kia Motors Corporation, Kolonglotech, Inc.Inventors: Hyun Sik Kim, Sang Yoon Park, Deok Hwa Hong, Hee Seouk Chung, Byeong Cheon Lee, Yeun Ho Yu, Young Gyu Kim, Jeong Wan Han, Hyeon Seok Do, Hyun Kyu Shin, Cheol Min Nam, Kum Soo Bae, Seong Jong Kim, Jun Youp Kim
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Patent number: 11836890Abstract: An image processing apparatus applies an image to a first learning network model to optimize the edges of the image, applies the image to a second learning network model to optimize the texture of the image, and applies a first weight to the first image and a second weight to the second image based on information on the edge areas and the texture areas of the image to acquire an output image.Type: GrantFiled: November 16, 2021Date of Patent: December 5, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Cheon Lee, Donghyun Kim, Yongsup Park, Jaeyeon Park, Iljun Ahn, Hyunseung Lee, Taegyoung Ahn, Youngsu Moon, Tammy Lee
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Publication number: 20230375562Abstract: A fluorescent protein sensor capable of quantitatively measuring oxidation degree of methionine residues of a specific protein, and a use thereof. Specifically, a fluorescent biosensor recombinant protein in which an MsrB protein, a cpYFP protein, a thioredoxin 3 protein, a linker protein and a G protein are linked in this order, and which is capable of quantitatively measuring the oxidation degree of methionine residues of a target protein; a fluorescent biosensor comprising same; a method for measuring oxidation degree of methionine residues of a target protein; and an information providing method for diagnosis of oxidative stress-associated diseases; and a method for screening for a therapeutic agent for oxidative stress-associated diseases.Type: ApplicationFiled: September 28, 2021Publication date: November 23, 2023Applicant: GERONMED, CO. LTDInventors: Byung Cheon LEE, Hae Min LEE
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Patent number: D1085864Type: GrantFiled: August 2, 2023Date of Patent: July 29, 2025Assignee: LGS CORPORATION Co., Ltd.Inventor: Seung Cheon Lee