Abstract: A universal attach manufacturing process employs a boat onto which solder balls or columns are loaded. A universal attach line has a number of attach station to accommodate different types of attach processes. Depending on the process and the desired configuration and form factor of the array of solder balls or columns, a template is selected that covers some of the holes in the universal boat, and exposes other holes. The solder balls or columns are held securely in the exposed holes, and a substrate is placed onto the solder balls. Once loaded with balls or columns, the universal boat is transported to only the appropriate attach stations in the universal attach line, where the different attach operations for a given attach process, such as high temperature ball attach, eutectic ball attach, or column attach, are performed.

Abstract: A boat onto which solder balls or columns are loaded for an attach process can be used in a universal attach line has a number of attach station to accommodate different types of attach processes. Depending on the process and the desired configuration and form factor of the array of solder balls or columns, a template is selected that covers some of the holes in the universal boat, and exposes other holes. The holes are configured and sized to hold solder balls in the holes such that the solder balls protrude above the top surface of the boat by a predetermined height. This prevents damage to the solder balls while ensuring that the solder balls protrude enough to accommodate imperfectly flat packages that are placed on the array of solder balls held in the boat. Vacuum applied through the holes help to securely hold the balls in place, and a substrate is placed onto the solder balls.