Abstract: A method of forming a multi-layer circuit on a curved substrate includes forming, by a laser direct structuring process, a first layer of the multi-layer circuit on a first surface of the curved substrate. The method includes applying a first layer of paint to the first layer of the multi-layer circuit. The method includes forming, by the laser direct structuring process, a second layer of the multi-layer circuit on the first layer of the paint and electrically coupled to the first layer of the multi-layer circuit. The method includes applying a second layer of paint over the second layer of the multi-layer circuit and forming, by the laser direct structuring process, a third layer of the multi-layer circuit on the second layer of the paint and electrically coupled to the second layer of the multi-layer circuit.

Abstract: The antenna device includes a substrate, a first radiator that is in a plane shape, operates as a wideband antenna, and is disposed on the dielectric region such that one end portion faces the ground region and an opposite end portion faces away from the ground region, a width of the opposite end portion being wider than a width of the one end portion, a second radiator that is in a line shape, operates as a narrowband antenna and at a lower frequency than the first radiator, and is disposed adjacent to the first radiator on the dielectric region such that one end portion faces the ground region and an opposite end portion faces away from the ground region, a first feeding line, a second feeding line, and a connecting structure connected with the first radiator, the first feeding line, the second radiator, and the second feeding line.

Abstract: The antenna device includes a substrate, a first radiator that is in a plane shape, operates as a wideband antenna, and is disposed on the dielectric region such that one end portion faces the ground region and an opposite end portion faces away from the ground region, a width of the opposite end portion being wider than a width of the one end portion, a second radiator that is in a line shape, operates as a narrowband antenna and at a lower frequency than the first radiator, and is disposed adjacent to the first radiator on the dielectric region such that one end portion faces the ground region and an opposite end portion faces away from the ground region, a first feeding line, a second feeding line, and a connecting structure connected with the first radiator, the first feeding line, the second radiator, and the second feeding line.

Abstract: The present disclosure relates to the method of manufacturing circuit having lamination layer using LDS (Laser Direct Structuring) to ease the application on surface structure for applied product of various electronic circuit and particularly, in which can form circuit structure of single-layer to multiple-layer on the surface of injection-molded substrate in the shape of plane or curved surface, metal product, glasses, ceramic, rubber or other material.

Abstract: The present disclosure relates to the method of manufacturing circuit having lamination layer using LDS (Laser Direct Structuring) to ease the application on surface structure for applied product of various electronic circuit and particularly, in which can form circuit structure of single-layer to multiple-layer on the surface of injection-molded substrate in the shape of plane or curved surface, metal product, glasses, ceramic, rubber or other material.

Abstract: The present disclosure relates to the method of manufacturing circuit having lamination layer using LDS (Laser Direct Structuring) to ease the application on surface structure for applied product of various electronic circuit and particularly, in which can form circuit structure of single-layer to multiple-layer on the surface of injection-molded substrate in the shape of plane or curved surface, metal product, glasses, ceramic, rubber or other material.

Abstract: The present subject matter relates to the method of manufacturing circuit having lamination layer using LDS (Laser Direct Structuring) to ease the application on surface structure for applied product of various electronic circuit and particularly, in which can form circuit structure of single-layer to multiple-layer on the surface of injection-molded substrate in the shape of plane or curved surface, metal product, glasses, ceramic, rubber or other material.

Abstract: The present disclosure relates to the method of manufacturing circuit having lamination layer using LDS (Laser Direct Structuring) to ease the application on surface structure for applied product of various electronic circuit and particularly, in which can form circuit structure of single-layer to multiple-layer on the surface of injection-molded substrate in the shape of plane or curved surface, metal product, glasses, ceramic, rubber or other material.