Patents by Inventor Cheong Hwan JEONG

Cheong Hwan JEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230084826
    Abstract: The present invention disclosed herein relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus that performs substrate processing through a pressure change between a high pressure and a low pressure. The substrate processing apparatus includes: a process chamber (100) comprising a chamber body (110) which has an opened upper portion and in which a through-hole (150) is defined in a bottom surface thereof, and a top lid (140) coupled to the upper portion of the chamber body (110) to define an inner space (S1); a substrate support (200) comprising a substrate support plate (210) which is installed in the process chamber (100) and on which a substrate (1) is seated on a top surface thereof, and a substrate support shaft (220) installed to pass through the through-hole (150) so as to support the substrate support plate (210).
    Type: Application
    Filed: September 1, 2022
    Publication date: March 16, 2023
    Applicant: WONIK IPS CO., LTD.
    Inventors: Tae Dong KIM, Jung Hwan LEE, Cheong Hwan JEONG, Sung Ho ROH, Young Jun KIM
  • Publication number: 20230073660
    Abstract: The present invention disclosed herein relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus in which a substrate is processed at a high pressure and a low pressure. The present invention discloses a substrate processing apparatus including: a process chamber having an inner space; a substrate support on which a substrate is seated on a top surface thereof; an inner lid part which is installed to be vertically movable in the inner space and of which a portion is in close contact with the bottom surface of the process chamber to define a sealed processing space in which the substrate support is disposed; a gas supply part configured to supply a process gas to the processing space; and an inner lid driving part configured to drive the vertical movement of the inner lid part.
    Type: Application
    Filed: September 1, 2022
    Publication date: March 9, 2023
    Applicant: WONIK IPS CO., LTD.
    Inventors: Sung Ho ROH, Jung Hwan LEE, Cheong Hwan JEONG, Tae Dong KIM, Young Jun KIM, Moon Chul KUM, Chan Soo PARK, Mi Sook KIM, Yong Ki KIM
  • Publication number: 20230072156
    Abstract: The present invention disclosed herein relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus that performs substrate processing through a pressure change between a high pressure and a low pressure. The present invention discloses a substrate processing apparatus including; a process chamber (100) comprising a chamber body (110) which has an opened upper portion, in which an installation groove (130) is defined at a central side of a bottom surface (120) thereof, and which comprises a gate (111) for loading/unloading a substrate (1) is disposed at one side thereof and a top lid (140) coupled to the upper portion of the chamber body (110) to define an inner space, a substrate support (200) installed to be inserted into the installation groove (130) of the chamber body (110) and having a top surface on which the substrate (1) is seated.
    Type: Application
    Filed: September 1, 2022
    Publication date: March 9, 2023
    Applicant: WONIK IPS CO., LTD.
    Inventors: Sung Ho ROH, Jung Hwan LEE, Cheong Hwan JEONG, Tae Dong KIM, Young Jun KIM, Moon Chul KUM, Chan Soo PARK, Mi Sook KIM, Yong Ki KIM
  • Publication number: 20230070804
    Abstract: The present invention disclosed herein relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus in which a substrate is processed at a high pressure and a low pressure. The present invention discloses a substrate processing apparatus including: a process chamber (100) which has an inner space and in which an installation groove (130) is defined at a central side on a bottom surface (120); a substrate support (200) installed to be inserted into the installation groove (130) and having a top surface on which the substrate is seated; an inner lid part (300) which is installed to be movable vertically in the inner space and descends so that a portion thereof is in close contact with the bottom surface (120) adjacent to the installation groove (130) to define a sealed processing space (S2) in which the substrate support (200) is disposed therein.
    Type: Application
    Filed: September 1, 2022
    Publication date: March 9, 2023
    Applicant: WONIK IPS CO., LTD.
    Inventors: Tae Dong KIM, Jung Hwan LEE, Cheong Hwan JEONG, Sung Ho ROH, Young Jun KIM, Moon Chul KUM, Chan Soo PARK, Mi Sook KIM, Yong Ki KIM
  • Publication number: 20230073851
    Abstract: The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus in which a substrate is processed at a high pressure and a low pressure. The substrate processing apparatus of the present invention includes: a process chamber (100) including a chamber body (110) which has an opened upper portion and in which an installation groove (130) is defined at a central side of a bottom surface (120) thereof, and a gate (111) configured to load/unload a substrate (1) is disposed at one side thereof, and a top lid (140) coupled to the upper portion of the chamber body (110) to define an inner space (S1); a substrate support (200) installed to be inserted into the installation groove (130) of the chamber body (110) and having a top surface on which the substrate (1) is seated.
    Type: Application
    Filed: September 1, 2022
    Publication date: March 9, 2023
    Applicant: WONIK IPS CO., LTD.
    Inventors: Tae Dong KIM, Jung Hwan LEE, Cheong Hwan JEONG, Sung Ho ROH, Young Jun KIM