Patents by Inventor Cheong-jun Kim

Cheong-jun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor wafer, semiconductor structure and method of manufacturing the semiconductor wafer
    Patent number: 9806036
    Abstract: A semiconductor wafer including a main body including first and second surfaces opposite each other, a notch including a recess on an outer periphery, a first bevel region formed along the outer periphery of the main body, including a first slope connecting the first and second surfaces and having a first height with respect to a straight line extending from a first point where the first surface and the first slope meet to a second point where the second surface and the first slope meet, and a second bevel region in contact with the recess or opening, including a second slope connecting the first and second surfaces and having a second height, different from the first height, with respect to a straight line extending from a third point where the first surface and the second slope meet to a fourth point where the second surface and the second slope meet.
    Type: Grant
    Filed: November 17, 2016
    Date of Patent: October 31, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong-soo Kim, Sam-jong Choi, Sue-ryeon Kim, Tae-hyoung Koo, Hyun-hee Ju, Cheong-jun Kim, Ji-won You
  • SEMICONDUCTOR WAFER, SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR WAFER
    Publication number: 20170200683
    Abstract: A semiconductor wafer including a main body including first and second surfaces opposite each other, a notch including a recess on an outer periphery, a first bevel region formed along the outer periphery of the main body, including a first slope connecting the first and second surfaces and having a first height with respect to a straight line extending from a first point where the first surface and the first slope meet to a second point where the second surface and the first slope meet, and a second bevel region in contact with the recess or opening, including a second slope connecting the first and second surfaces and having a second height, different from the first height, with respect to a straight line extending from a third point where the first surface and the second slope meet to a fourth point where the second surface and the second slope meet.
    Type: Application
    Filed: November 17, 2016
    Publication date: July 13, 2017
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: JONG-SOO KIM, Sam-jong Choi, Sue-ryeon Kim, Tae-hyoung Koo, Hyun-hee Ju, Cheong-jun Kim, Ji-won You