Patents by Inventor Cheong Kow

Cheong Kow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8647454
    Abstract: A physical barrier having a carrier device and a sealer material applied to the carrier device. The sealer material is configured to expand when it is activated. In its pre-activation state, the sealer material is flowable. The sealer material is applied directly to the carrier in its pre-activation state through a dispensing orifice without being previously molded.
    Type: Grant
    Filed: November 21, 2005
    Date of Patent: February 11, 2014
    Assignee: Sika Technology AG
    Inventors: Robert D. Myers, Gerald E. Fitzgerald, Cheong Kow, Randy Stratman
  • Patent number: 7186442
    Abstract: A method for installing a constrained layer damper on a product of manufacture is disclosed. The method includes applying a layer of first polymeric material to a substrate of the product, wherein the first polymeric material is visco-elastic when solidified. Then, a second layer of polymeric material, which is stiff when solidified, is applied to the first polymeric material such that said first polymeric material is constrained between the second polymeric material and the substrate of the product. At least one of the layers of polymeric materials is dispensed in fluid form during the manufacture of the product from a bulk source of fluid material. The polymeric materials are chosen such that they do not require the application of heat above room temperature to solidify.
    Type: Grant
    Filed: June 11, 2003
    Date of Patent: March 6, 2007
    Assignee: Sika Technology AG
    Inventors: Robert D. Myers, Philip E. Weber, Kevin Casey, Cheong Kow, Steven A. Rosenberg, Norman Blank
  • Publication number: 20070034432
    Abstract: A solid thermally expansible material is provided. The material includes a solid epoxy resin that is substantially free of liquid epoxy resin and semi-solid epoxy resin. The material also includes an impact modifier, a curing agent and a heat-activated foaming agent. The impact modifier includes rubber in one embodiment and is substantially free of rubber in another embodiment. Following heat activation, the material expands and can adhere to a substrate. A cured expanded reinforcement material is also provided, as is a method of reinforcing a substrate.
    Type: Application
    Filed: June 30, 2006
    Publication date: February 15, 2007
    Inventors: Steven Rosenberg, Norman Blank, Juergen Finter, Frank Hoefflin, Cheong Kow
  • Publication number: 20060073266
    Abstract: A physical barrier having a carrier device and a sealer material applied to the carrier device. The sealer material is configured to expand when it is activated. In its pre-activation state, the sealer material is flowable. The sealer material is applied directly to the carrier in its pre-activation state through a dispensing orifice without being previously molded.
    Type: Application
    Filed: November 21, 2005
    Publication date: April 6, 2006
    Inventors: Robert Myers, Gerald Fitzgerald, Cheong Kow, Randy Stratman
  • Publication number: 20050185787
    Abstract: A dialer and calling card with SIM memory device and method of facilitating access to a telephone network by verifying the identification data (ID) of a subscriber dialing out of an originating telephone; detecting a dual tone multiple frequency (DTMF) signal of the first push button of a destination telephone number being dialed by the subscriber to determine if the call is a trunk or international call; in which event, an automatic dialing sequence is activated; otherwise, the destination telephone number's DTMF signal bypasses said automatic dialing sequence to connect and transmit said destination telephone number's DTMF signal to a public service telephone network (PSTN) for making a local call.
    Type: Application
    Filed: December 29, 2004
    Publication date: August 25, 2005
    Inventor: Cheong Kow
  • Publication number: 20040253453
    Abstract: A method for installing a constrained layer damper on a product of manufacture is disclosed. The method includes applying a layer of first polymeric material to a substrate of the product, wherein the first polymeric material is visco-elastic when solidified. Then, a second layer of polymeric material, which is stiff when solidified, is applied to the first polymeric material such that said first polymeric material is constrained between the second polymeric material and the substrate of the product. At least one of the layers of polymeric materials is dispensed in fluid form during the manufacture of the product from a bulk source of fluid material. The polymeric materials are chosen such that they do not require the application of heat above room temperature to solidify.
    Type: Application
    Filed: June 11, 2003
    Publication date: December 16, 2004
    Applicant: Sika Corporation
    Inventors: Robert D. Myers, Philip E. Weber, Kevin Casey, Cheong Kow, Steven A. Rosenberg, Norman Blank
  • Publication number: 20040011282
    Abstract: A physical barrier having a carrier device and a sealer material applied to the carrier device. The sealer material is configured to expand when it is activated. In its pre-activation state, the sealer material is flowable. The sealer material is applied directly to the carrier in its pre-activation state through a dispensing orifice without being previously molded.
    Type: Application
    Filed: July 18, 2002
    Publication date: January 22, 2004
    Inventors: Robert D. Myers, Gerald E. Fitzgerald, Cheong Kow, Randy Stratman
  • Patent number: 6562878
    Abstract: Heat-expandable molded synthetic resin seal and baffle components adapted for use in automobile body cavities or the like are provided which are designed to preferentially expand upon heating in desired directions and to a desired degree, in order to properly seal irregular or special cavity shapes. The molded components of the invention have selected body surface portions thereof UV crosslinked to a depth of up to about 0.5 mm, while other portions of the molded body are not crosslinked; upon heating, the crosslinked portions expand at a slower rate and to a lesser extent than non-crosslinked body portions. The preferred synthetic resin includes a grafted anhydride polymer, a terminal epoxide polymer additive, a blowing agent, a UV photoinitiator and a UV crosslinkable resin system.
    Type: Grant
    Filed: November 14, 2001
    Date of Patent: May 13, 2003
    Assignee: Sika Corporation
    Inventors: Norman E. Blank, Cheong Kow
  • Publication number: 20020091171
    Abstract: Heat-expandable molded synthetic resin seal and baffle components adapted for use in automobile body cavities or the like are provided which are designed to preferentially expand upon heating in desired directions and to a desired degree, in order to properly seal irregular or special cavity shapes. The molded components of the invention have selected body surface portions thereof UV crosslinked to a depth of up to about 0.5 mm, while other portions of the molded body are not crosslinked; upon heating, the crosslinked portions expand at a slower rate and to a lesser extent than non-crosslinked body portions. The preferred synthetic resin includes a grafted anhydride polymer, a terminal epoxide polymer additive, a blowing agent, a UV photoinitiator and a UV crosslinkable resin system.
    Type: Application
    Filed: November 14, 2001
    Publication date: July 11, 2002
    Inventors: Norman E. Blank, Cheong Kow
  • Patent number: 6319964
    Abstract: Heat-expandable molded synthetic resin seal and baffle components adapted for use in automobile body cavities or the like are provided which are designed to preferentially expand upon heating in desired directions and to a desired degree, in order to properly seal irregular or special cavity shapes. The molded components of the invention have selected body surface portions thereof UV crosslinked to a depth of up to about 0.5 mm, while other portions of the molded body are not crosslinked; upon heating, the crosslinked portions expand at a slower rate and to a lesser extent than non-crosslinked body portions. The preferred synthetic resin includes a grafted anhydride polymer, a terminal epoxide polymer additive, a blowing agent, a UV photoinitiator and a UV crosslinkable resin system.
    Type: Grant
    Filed: June 30, 2000
    Date of Patent: November 20, 2001
    Assignee: Sika Corporation
    Inventors: Norman E. Blank, Cheong Kow