Abstract: The present invention relates to a wall mounting-type flexible display, which can be mounted on a wall, the display comprising: a display panel having a bending portion having a bent peripheral area; a support bar for supporting the display panel by being in contact with the bending portion; and a bracket coupled to the support bar and fixed to a wall surface, wherein the bending portion of the display panel comprises at least two curved surfaces having at least one inflection point, and the first and second curved surfaces, which are adjacent to each other about the inflection point, may have different curvatures. The first curved surface is directly adjacent to the end portion of the display panel, the second curved surface is adjacent to the first curved surface while being spaced from the end portion of the display panel, and the curvature of the first curved surface may be larger than the curvature of the second curved surface.

Abstract: The present invention relates to a wall mounting-type flexible display, which can be mounted on a wall, the display comprising: a display panel having a bending portion having a bent peripheral area; a support bar for supporting the display panel by being in contact with the bending portion; and a bracket coupled to the support bar and fixed to a wall surface, wherein the bending portion of the display panel comprises at least two curved surfaces having at least one inflection point, and the first and second curved surfaces, which are adjacent to each other about the inflection point, may have different curvatures. The first curved surface is directly adjacent to the end portion of the display panel, the second curved surface is adjacent to the first curved surface while being spaced from the end portion of the display panel, and the curvature of the first curved surface may be larger than the curvature of the second curved surface.

Abstract: An image display apparatus includes a display defined by a front surface for outputting screen information and a rear surface opposite to the front surface, and a bezel part formed along edges of the display, wherein the display includes a plane portion configured to output at least part of the screen information, and at least one bent portion integrally formed with the plane portion and bent from an edge of the plane portion by a preset angle, the at least one bent portion outputting at least one of a part of the screen information and a preset image.

Abstract: The present disclosure relates to an image display apparatus, and more particularly, an image display apparatus capable of displaying screen information. The image display apparatus includes a display configured to display screen information, an interface configured to receive an input signal with respect to the display, and a controller configured to display a menu item for controlling the screen information, wherein the display outputs the screen information on an inner region of rounded corners of the display, and wherein the controller decides a shape of the menu item to be displayed on a point where the input signal has been received, in response to the reception of the input signal.

Abstract: An image display apparatus includes a display defined by a front surface for outputting screen information and a rear surface opposite to the front surface, and a bezel part formed along edges of the display, wherein the display includes a plane portion configured to output at least part of the screen information, and at least one bent portion integrally formed with the plane portion and bent from an edge of the plane portion by a preset angle, the at least one bent portion outputting at least one of a part of the screen information and a preset image.

Abstract: The present disclosure relates to an image display apparatus, and more particularly, an image display apparatus capable of displaying screen information. The image display apparatus includes a display configured to display screen information, an interface configured to receive an input signal with respect to the display, and a controller configured to display a menu item for controlling the screen information, wherein the display outputs the screen information on an inner region of rounded corners of the display, and wherein the controller decides a shape of the menu item to be displayed on a point where the input signal has been received, in response to the reception of the input signal.

Abstract: An integrated circuit package system is provided. A dual-type leadframe having first and second rows of leads is formed. A first row of bumps is formed on an integrated circuit chip. Solder paste is placed on the first row of leads, and the first row of bumps is pressed into the solder paste on the first row of leads. The solder paste is reflow soldered to form solder and connect the integrated circuit chip to the first row of leads, and the integrated circuit chip, the first row of bumps, the solder, and the leadframe are encapsulated.

Abstract: A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has interconnection between the active site of the die and the die paddle. Also, methods for making the package are disclosed.

Abstract: A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has interconnection between the active site of the die and the die paddle. Also, methods for making the package are disclosed.

Abstract: An integrated circuit package system is provided. A dual-type leadframe having first and second rows of leads is formed. A first row of bumps is formed on an integrated circuit chip. Solder paste is placed on the first row of leads, and the first row of bumps is pressed into the solder paste on the first row of leads. The solder paste is reflow soldered to form solder and connect the integrated circuit chip to the first row of leads, and the integrated circuit chip, the first row of bumps, the solder, and the leadframe are encapsulated.

Abstract: A system for manufacturing an integrated circuit package system is provided. A dual-type leadframe having first and second rows of leads is formed. A first row of bumps is formed on an integrated circuit chip. Solder paste is placed on the first row of leads, and the first row of bumps is pressed into the solder paste on the first row of leads. The solder paste is reflow soldered to form solder and connect the integrated circuit chip to the first row of leads, and the integrated circuit chip, the first row of bumps, the solder, and the leadframe are encapsulated.

Abstract: A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has interconnection between the active site of the die and the die paddle. Also, methods for making the package are disclosed.

Abstract: A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has interconnection between the active site of the die and the die paddle. Also, methods for making the package are disclosed.

Abstract: A system for manufacturing an integrated circuit package system is provided. A dual-type leadframe having first and second rows of leads is formed. A first row of bumps is formed on an integrated circuit chip. Solder paste is placed on the first row of leads, and the first row of bumps is pressed into the solder paste on the first row of leads. The solder paste is reflow soldered to form solder and connect the integrated circuit chip to the first row of leads, and the integrated circuit chip, the first row of bumps, the solder, and the leadframe are encapsulated.