Abstract: An optical sensing chip packaging structure includes a substrate, an optical sensing member, a light emitting member, a transparent glue layer and a transparent cover plate, wherein the optical sensing member is positioned on the substrate; the light emitting member is positioned on the optical sensing member, and the light emitting member includes a light emitting surface; the transparent glue layer is positioned on the light emitting member, and contacts and covers the light emitting surface; the transparent cover plate is positioned on the transparent glue layer.

Abstract: An optical sensing chip packaging structure includes a substrate, an optical sensing member, a light emitting member and a transparent cover plate. The substrate has a recess; the optical sensing member is positioned in the recess, and is electrically connected to the substrate. The light emitting member is positioned in the recess, and is electrically connected to the substrate or the optical sensing member. The transparent cover plate is positioned on the substrate, and covers the optical sensing member and the light emitting member.

Abstract: An optical sensing chip packaging structure includes a substrate, an optical sensing member, a light emitting member and a transparent cover plate. The substrate has a recess; the optical sensing member is positioned in the recess, and is electrically connected to the substrate. The light emitting member is positioned in the recess, and is electrically connected to the substrate or the optical sensing member. The transparent cover plate is positioned on the substrate, and covers the optical sensing member and the light emitting member.

Abstract: An apparatus for stacking a plurality of integrated circuit assemblies includes a connection substrate for soldering the integrated circuit assemblies. The substrate has a carved out frame structure or a cavity in the center that has a dimension matching the integrated circuit assemblies. There are solder spots or through holes located on the periphery of the frame structure or cavity. The solder spots may be located on one side or two sides of the substrate. The one side solder spots are electrically connected to other substrate surface through leads or conductive through holes. The integrated circuit assemblies are sunken in the frame structure or cavity. The legs of the assemblies are connected to the solder spots. Thus the assemblies are stacked over one another in a layer fashion to form a final assembly package.